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研究生:葉益清
研究生(外文):Yi-Ching Yeh
論文名稱:以COMSOL模擬受靜電驅動之微型樑
論文名稱(外文):Simulation of Micro Beams Actuated by Electrostatic with COMSOL
指導教授:胡毓忠胡毓忠引用關係黃國益黃國益引用關係
指導教授(外文):Yuh-Chung HuKuo-Yi Huang
學位類別:碩士
校院名稱:華梵大學
系所名稱:機電工程學系博碩專班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:97
語文別:中文
論文頁數:44
中文關鍵詞:吸附現象耦合效應邊界效應臨界電壓
外文關鍵詞:pull-in phenomenoncoupling effectboundary effectthreshold voltage
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論文主要以數值模擬方式分析微型樑受靜電驅動時之吸附現象,研究內容為分析微型樑與靜電場的耦合效應、微型樑因靜電力產生的變形及微型樑邊界效應之臨界電壓。在論文中使用有限元素分析軟體COMSOL Multiphysics®,以參數值方式模擬不同樑厚、不同樑寬之微型樑受靜電負載的偏斜與電壓關係,及探討模擬結果對微型樑之影響,以提供未來研究發展靜電式微結構的參考依據。
This thesis is mainly based on the numerical simulation method to analyze the pull-in phenomenon on the micro beam driven by static electricity. The research contents are separated into coupling effect of micro beam and electrostatic field and the deflection of micro beam due to static electricity and the threshold voltage of the boundary effect of micro beam. In this thesis, the finite element analysis software COMSOL Multiphysics® is utilized and numerical method is adopted to simulate the relationship between the load deflection by static electricity and voltage of micro beam with different thickness and width and to explore the effect on micro beam by the simulation result. The results can serve as a reference for research on the development of electrostatic micro structure in the future.
誌謝 I
摘要 II
Abstract III
目錄 IV
表錄 VI
圖錄 VII
符號說明 X
第一章 緒論 1
1.1 論文架構 1
1.2 前言 2
1.3 研究動機 4
1.4 文獻回顧 5
第二章 理論分析 9
2.1 能量元素 9
2.2 吸附電壓 13
2.3 邊界效應之吸附電壓 16
第三章 有限元素數值模擬法 20
3.1 COMSOL Multiphysics®簡介 20
3.2 電腦模擬 21
3.3 模擬結果分析 36
第四章 結論 41
4.1 結論 41
4.2 未來展望 42
參考文獻 43
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Switch for Telecommunications Applications with Signal Frequencies from DC up to 4 GHz,"Transducers’95, The 8th International Conference on Solid–State Sensors and Actuators, pp.384–387, June 1995.
5. H. Toshiyoshi, W. Piyawattanametha, C.T. Chan, and M.C. Wu,"Linearization of Electrostatically Actuated Surface Micromachined 2–D Optical Scanner,"Journal of Microelectromechanical Systems, Vol.10, No.2, pp.205–214, June 2001.
6. N.P. Van Der Mejis, and J.T. Fokkema,"VLSI Circuit Reconstruction from Mask Topology,"Integration, Vol.2, No.2, pp.85–119, 1984.
7. Sazzadur Chowdhury, M.Ahmadi, W.C.Miller,"Pull–In Voltage Study of Electrostatically Actuated Fixed–Fixed Beams Using a VLSI On–Chip Interconnect Capacitance Model,"Journal of Microelectromechanical Systems, Vol.15, No.3, pp.639–615, June 2006.
8. S.Chowdhury, M.Ahmadi, W. C.Miller,"Pull–In Voltage Calculations for MEMS Sensors with Cantilevered Beams,"IEEE– NEWCAS Conference,2005. The 3rd International, June 2005, pp.143–146.
9. I. Ladabaum, X. Jin, H.T. Soh, A. Atalar, B.T. Khuri–Yakub,"Surface Micromachined Capacitive Ultrasonic Transducers,"IEEE Transactions on Ultrasonic, Ferroelectrics, and Frequency Control, Vol.45, No.3, pp.679–690, May 1998.
10. S.D. Senturia,"Microsystems Design,"Kluwer Academic Publishers, Boston 2001, pp.125–137.
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