臺灣博碩士論文加值系統

本研究開發以『微型鑽石砂輪』結合磨棒，設計製造『微型鑽石砂輪磨棒』，應用於超精密微磨削加工。探討微型鑽石砂輪與磨棒間的黏著方法，及建立磨削矽晶圓及鈉鈣玻璃加工實驗。
實驗結果顯示：建立SKD61柄之微型鑽石砂輪磨棒，磨削矽晶圓及鈉鈣玻璃時，使用較低進給速度加工，所得材料去除效率相對較高。在相同主軸轉速下，使用越低切深，材料去除效率相對較佳，反之，切深越大時則材料去除效率相對愈差，這可能原因是切深量大，磨棒較易變形。以材料去除效率而言，以較低切深、較慢主軸轉速，較低進給速度下，可得相對較佳材料去除效率；相對越大切深，越高主軸轉速、越快進給速度等條件下，則材料去除效率相對較差。另外，硬脆材料去除，相對大部分呈現延性磨削，但切溝邊緣則呈現脆性破壞。

The purpose of this paper is to develop a micro type diamond wheel combined a micro arbor that can be applied to precision micro grinding. Joining method between the micro wheel and the micro arbor was investigated and the grinding process for the silicon wafer and sodium calcium glass was established.
The experiment results showed that using a micro type diamond wheel with a micro arbor of tool steel SKD61 was fabricated to grind silicon wafer and sodium calcium glass under a lower feed rate, the resulting material removal efficiency was relatively higher. For the same spindle speed, when the micro wheel under a lower depth of cut was employed, the material removal efficiency obtained was relatively better. Oppositely, the more the depth of cut was, the poorer the material removal efficiency was obtained. The reason for this is that a higher depth of cut during the micro grinding will cause a larger deformation of micro arbor. When the micro type diamond wheel during the grinding at a lower depth of cut, a slower spindle speed, and a lower feed rate was used, the material removal efficiency produced was relatively better. Besides, the silicon wafer and sodium calcium glass ground by a micro type diamond wheel during the micro grinding displayed mainly a ductile appearance, but the edges of grinding groove showed a brittle fracture.

致 謝 I
摘 要 II
Abstract III
目 錄 IV
圖 目 錄 VII
表 目 錄 X
第一章 緒論 1
1.1前言 1
1.2文獻回顧 3
1.3 研究動機與目的 6
1.4 本文內容 7
第二章 相關理論基礎 8
2.1 LIGA.............................................................................................8
2.1.1 LIGA製程....................................................................10
2.1.2 LIGA-like 11
2.2 複合電鑄 13
2.2.1 電鑄原理 16
2.2.2 胺基磺酸鎳鍍液與添加劑 17
2.3磨削加工原理 18
2.3.1 硬脆性材料受壓印的特性[21-25] 18
2.3.2 脆性材料磨削過程 22
2.3.3磨削工具磨粒狀態 26
第三章 微型鑽石砂輪磨棒製作及磨削加工 29
3.1 微型鑽石砂輪製作 29
3.1.1 塗佈光阻…………………………………...………….29
3.1.2 曝光……………………………………..……………..32
3.1.3顯影………………………………………….…………33
3.1.4複合電鑄…………………………………….…………34
3.1.5 微型砂輪取出…………………………………………34
3.2微型鑽石砂輪磨棒製作及磨削實驗 35
3.2.1磨棒材質選用……………………………………………..35
3.2.2 磨棒黏著及烘烤…………………………...…….………36
3.2.3 磨削加工裝置……………………………...…………….36
3.3 實驗設備 39
第四章 實驗結果與討論 45
4.1碳化鎢柄之微型鑽石砂輪 45
4.2 SKD61微型鑽石砂輪磨棒 50
4.2.1 SKD61磨棒設計 50
4.2.2 SKD61微型鑽石砂輪磨棒黏著情況 51
4.3微型鑽石砂輪之磨削加工 53
4.3.1 磨削去除效率 53
4.3.2 矽晶圓與鈉鈣玻璃材料去除效率之比較....................71
4.3.3微型鑽石砂輪磨削硬脆材料之表面外觀 77
第五章 結論與未來展望 86
5.1 結論 86
5.2 未來展望 87
參考文獻 88


圖1.1 微機械加工分類表[2]..................................................................02
圖2.1 LIGA製程示意圖[11] 09
圖2.2 電鑄技術應用產業及產品關連圖[15] 14
圖2.3壓印實驗示意圖[19] 20
圖2.4硬脆材料受尖銳壓印施壓之變化過程[23] 21
圖2.5刮痕試驗四種刮痕形態示意圖[24] 23
圖2.6工件磨削脆性破壞去除情形[19] 23
圖2.7磨削區域所產生的交互作用[25] 25
圖2.8切刃的變化形態[26] 27
圖3.1微型鑽石砂輪尺寸[27].................................................................29
圖3.2 微型鑽石砂輪製作流程示意圖[27] 30
圖3.3 光阻之塗佈轉速與時間關係[27] 31
圖3.4 微型砂輪光罩示意圖[27]............................................................33
圖3.5 磁石攪拌電鑄，鋁基材擺放示意圖[27].....................................34
圖3.6 (a)碳化鎢材質磨棒，(b)SKD61材質磨棒....................................35
圖3.7 實驗設備架構...............................................................................37

圖3.8 微型鑽石磨棒磨削流程示意圖...................................................38
圖3.9 CNC磨削裝置................................................................................41
圖3.10 數位攝影機(300萬像素CCD)....................................................41
圖3.11 Piezosystem Jena三軸奈米平台.................................................42
圖3.12 YAMAHA線性滑軌...................................................................42
圖3.13烤箱..............................................................................................43
圖3.14 工具顯微鏡.................................................................................43
圖3.15 掃描式電子顯微鏡.....................................................................44
圖3.16超音波震盪器..............................................................................44
圖4.1 碳化鎢柄微棒尺寸.......................................................................45
圖4.2 柄徑設計.......................................................................................46
圖4.3 碳化鎢柄徑黏著圖.......................................................................47
圖4.4 微型鑽石砂輪磨棒之黏著劑過多...............................................48
圖4.5 砂輪及試片溝槽圖外觀...............................................................49
圖4.6 SKD61磨棒設計圖....................................................................50
圖4.7 電鑄微型鑽石砂輪與光阻結構間平坦示意圖.........................51
圖4.8 SKD61磨棒黏著微型鑽石砂輪過程........................................52
圖4.9 SKD61柄之微型鑽石砂輪磨棒................................................52


圖4.10 磨削矽晶圓溝槽的量測圖，切深1μm，進給速度(a)0.25mm/s，(b) 0.33mm/s，(c)0.5mm/s .........................................................61
圖4.11 磨削矽晶圓溝槽的量測圖，切深2μm，進給速度(a)0.25mm/s，(b) 0.33mm/s，(c)0.5mm/s………………………………...…….63
圖4.12 磨削矽晶圓溝槽的量測圖，切深3μm，進給速度(a)0.25mm/s， (b) 0.33mm/s，(c)0.5mm/s……………………………...……..….65
圖4.13 磨削鈉鈣玻璃溝槽的量測圖，切深1μm，進給速度(a)0.25mm/s， (b) 0.33mm/s，(c)0.5mm/s……………………………...……..….67
圖4.14 磨削鈉鈣玻璃溝槽的量測圖，切深2μm，進給速度(a)0.25mm/s， (b) 0.33mm/s，(c)0.5mm/s………………………………….....….69
圖4.15 磨削鈉鈣玻璃溝槽的量測圖，切深3μm，進給速度(a)0.25mm/s， (b) 0.33mm/s，(c)0.5mm/s…………………………….………….71
圖4.16 矽晶圓與鈉鈣玻璃之磨削去除效率比較，切深為1μm.…...…74
圖4.17 矽晶圓與鈉鈣玻璃之磨削去除效率比較，切深為2μm……..75
圖4.18 矽晶圓與鈉鈣玻璃之磨削去除效率比較，切深為3μm…….76
圖4.19 矽晶圓與鈉鈣玻璃之磨削表面外觀………………………….76
圖4.20 微型砂輪磨削試片示意圖………………………………..…...77
圖4.21 微型鑽石砂輪磨削矽晶圓的工件表面外觀，(a)切深1μm、(b)切深2μm、(c)切深3μm………………………………………80
圖4.22 微型鑽石砂輪磨削鈉鈣玻璃的工件表面外觀，(a)切深1μm、(b)切深2μm、(c)切深3μm……………………………………83


表1-1 各種微細加工技術比較[1]..........................................................01
表2.1 LIGA與LIGA-like之比較[14] 12
表2.2 常用複合鍍層之金屬材料與微粒[17]........................................15
表3.1 微型鑽石砂輪製作.......................................................................37
表4.1 微型鑽石砂輪磨削矽晶圓之去除切深與效率，(a)切深1μm、
(b)切深2μm、(c)切深3μm……………………..…….…………..55
表4.2 微型鑽石砂輪磨削鈉鈣玻璃之去除切深與效率，(a)切深1μm、
(b)切深2μm、(c)切深3μm……………..…..….………………..58

[1] 周敏傑，機械工業雜誌，元月號，pp131，1996.
[2] 余宗翰，類LIGA技術製造為鑽石磨錠工具之研究，博士論文，華梵大學，2009。
[3] T. Semba, H. Sato, “Development of electroformed diamond tool with fine grains covered with metal oxide coating,” Annals of the CIRP, Vol.49, pp.157-160, 2000.
[4] D. KR. Bronshtein, Delevi, V.G. Simpeim, N.V. Tsypin, “Reaction of diamond with hard metals during the shaping of composite materials,” Poroshkovaya metalelurgiya, Vol.225, pp.48-50, 1981.
[5] W. Li, Y. Wang, S. Fan, J. Xu, “Wear of diamond grind wheels and material removel rate of silicon nitride under different machining condition,” Material letter, Vol.61, pp.54-58, 2007.
[6] T.G. Bifano, T.A. Dow, R.O. Scattergood, “Ductile-regime grinding: a new technology for machining brittle materials,” ASME Journal of Engineering for Industry, Vol.113, pp.184-189, 1991.
[7] B. Zhang, T.D. Howes, “Subsurface Evaluation of Ground Ceramics,” Annals of the CIRP, Vol.44/1, pp.263-266, 1995.
[8] T. Ohi, “Trends and future developments for diamond CMP pad condition,” Industrial diamond review, Vol pp.1-4, 2007.
[9] L.B. Zhou, H. Eda, J. Shimizu, “State-of-the art technologies and kinematical analysis for one-stop finishing of 300 mm Si wafer,” Journal of Materials Processing Technology, Vol.129, pp.34-40, 2002.

[10] E. Salje, H. Mohlen, “Advanced techniquess in grinding strength ceramic material,” Intercera, NO.5, pp.59-64, 1987.
[11] 楊龍杰，掌握機電，滄海圖書，96年6月。
[12] A. Holmes, S.Saidam, R. Lawes, “Technologies and How to Exploit Them,” Institute of electrical and electronics engineers eicroengineering, Vol pp.1-4, 1997.
[13] 陳炳輝，微機電系統，五南圖書，2003。
[14] 邱璨賓，微影製程之數學模式，奈米通訊，國家奈米實驗室，第五卷第三期，pp.30-37，1998。
[15] 吳憲明，精密電鑄技術市場應用，雷射加工暨精密電鑄技術研討會，台大慶齡工業中心，pp.52，1997。
[16] 楊啟榮，微機電製程之精密電鑄技術，國立中山大學 機械工程博士。
[17] 張允誠，胡如南，電鍍手冊，國防工業出版社，1997。
[18] J.W. Dini, H.R. Johnson, “The influence of nickel sulfamate operating parameters on the impurity content and properties of electrodeposits,” Thin Solid Films, Vo154, pp.183~188, 1978.
[19] K. Subramanian, S. Ramanath, M. Tricad, ”Mechanisms of material removal in the precision production grinding of ceramics,” Journal of Manufacturing Secience and Engineering, Vol.199, pp.509-519, 1997.
[20] B. R. Lawn, M.V. Swain “Microfracture beneath point indentation in brittle solids,” Journal of Materials Science, Vol.10, pp.113-122, 1975.
[21] A.G. Evans, T.R. Wilshaw, “Quasi-static solid partical damagein brittle solids : I. Observations, Analysis and Implications,” Acta Metallurgics, Vol.24, pp937-956. 1976.
[22] B.R. Lawn, E.R. Fuller, “Equilibrium penny-like cracks in indentation fracture,” Journal of Material Science, Vol.10, pp.2016-2024, 1975.
[23] I. Inasaki, “Grinding of hard and brittle material,” Annals of the CIRP, Vol. 36/2, pp.463-471, 1987.
[24] 賴耿楊譯著，“精密加工新技術全集”，復漢出版社，2001。
[25] 蔡宗河譯，“陶瓷的機械加工”，全華科技圖書股份有限公司，1991。
[26] W. Lortz, “A model of the cutting mechanism in grinding,” Wear, Vol.53, pp.115, 1979.
[27] 顏士嘉，UV-LIGA結合複合電鑄技術製造微型鑽石砂輪之研究，碩士論文，華梵大學，2008。