臺灣博碩士論文加值系統

在目前的3C產業中，對於手機筆記型電腦(如EeePC)等隨身用產品，無不減小體積以便於攜帶，各個網通晶片廠也都紛紛推出整合性晶片來縮小成品體積。本論文研究之目的在於將普通尺寸的網路卡體積再更加小型化，使其易於搭配在筆記型電腦上，並在小型化之後做效能差異的比較，使縮小後的功能和效能維持不變，以逹到小型化的目的。本研究以標準的USB2.0網路卡為設計基礎，首先介紹USB 標準的機構，考量縮減尺寸時的標準，並注意元件限高的選擇限制，探討小型化時需要使用到的被動元件在高頻上的嚮應及製程，並以軟體進行模擬在印刷電路板上傳輸線的阻抗控制。另外對於天線的位置及效用也進行評估，在初步的模擬跟評估之後，整合成實體之小型化USB網路卡並做整體的效能測試，且和目前市面上販售的網路卡進行兩種尺寸之間的效能差異比較。本論文製作之小型化USB網路卡，具有體積小且攜帶方便，配合小型化的無線基地台，可供出國或出差時使用，具有縮小空間的優勢。

Gearing toward the trend of consumer electronic products, mobile internet industry tends to adopt slim, thin and ultra light standards. IC suppliers are aggressive to use high performance chipsets to support critical mechanical design and satisfy system requirements. The optimum size of chipset must be considered for fine Mobile Internet Device (MID). In this study, compact MID solution is investigated based on USB2.0 Network Interface Card (NIC) configuration. USB2.0 standard will be considered for reducing the size of NIC. The high frequency response and manufacturing procedure of passive element of NIC are also considered. The impedances of the transmission line on the Printed Circuit Board are improved by simulation software. The position and efficiency of antenna are analyzed. Finally, the system evaluation will be compared between the implemented and the commercial NIC. The performance of the realized USB2.0 Network Interface Card will be better than that of the original design and is suitable for current economic products.

目 錄

中文摘要 .……………………………………..………………………………….…… i
英文摘要 .………………………………………….…………………………………. ii
誌謝.. .………………………………………………….………………………………iii
目錄.……………………………………………………...………………………….…iv
表目錄 .………………………………………………………………………. ………vi
圖目錄 ..………………………………………………………………………………vii

第一章 緒論 .………………………………………..…………………………………1
1.1 電子產品小型化的趨勢 ……..….……………..…………………………………1
1.2 無線網路簡介………...……………....…..…………..……………………………2
1.2.1. IEEE802.11標準……………...………..…………..………………………2
1.2.2. IEEE802.11b標準……………...………..…………..…………..…………2
1.2.3. IEEE802.11a標準………………...……..…………..……………………..2
1.2.4. IEEE802.11g標準…………………...…..…………..…………………..…2
1.2.5. IEEE802.11n標準……………...………..…………..…………………..…2
1.3研究動機………..……………...…….….…..…………..………………………….4
1.4 小型化USB網路卡之設計架構…….…………..…………………………………5
第二章 USB網路卡簡介….……..…….…..…………..…………………………………..6
2.1 PCB (印刷電路板) ………………….…..…………..……………………………...6
2.1.1. RF4……………….…....…………..………..............……………………....6
2.1.1.1. 電源佈線和旁路的基本原則….……..............……………………....7
2.1.2. 傳輸線………..............……………………..............................................8
2.2 高頻下的被動元件…….…..............……………………......................................9
2.2.1. 電阻………..............……………………................................................10
2.2.2. 電容………..............……………………................................................11
2.2.2. 電感………..............……………………................................................13
2.3 USB介紹………..............…………………….....................................................15
2.3.1. 前言……..............……………………....................................................15
2.3.2.機構部份……..............……………………..............................................16
2.4. USB無線網路卡....……………………..............................................................19
第三章 小型化USB網路卡設計..............……………………...................................... 20
3.1. 電源..............……………………...................................................................... 20
3.2. 頻率..............……………………......................................................................21
3.3. 傳輸線阻抗模擬..............…………………....................................................... 22
3.4. 天線..............……………………...................................................................... 23
3.5. 小型化USB網路卡組裝..............…………………….........................................26
第四章 小型化USB網路卡測試與分析……………………..........................................28
4.1. 硬體規格……..............…………………….......................................................28
4.1.1.傳輸功率……..............……………………..............................................28
4.1.1.1.測試儀器和配置……..............……………………...........................28
4.1.1.2.測試結果……..............……………………......................................29
4.1.2.傳輸頻譜遮罩.........…………………….....................................................29
4.1.2.1.測試儀器和配置.........……………………........................................32
4.1.2.2. 測試結果.........…………………….................................................32
4.1.3. 發射中心頻率.........…………………….................................................33
4.1.3.1.測試儀器和配置.........……………………........................................33
4.1.3.2.量測結果.........……………………...................................................34
4.1.4. 傳輸調變準確性測試.........…………………….....................................34
4.1.4.1. 測試儀器和配置.........……………………......................................35
4.1.4.2. 量測結果.........…………………….................................................36
4.1.5. 最小輸入接收靈敏度.........…………………….....................................36
4.1.5.1. 測試儀器和配置.........……………………......................................37
4.1.5.2. 量測設定.........…………………….................................................38
4.1.3.3.量測結果.........……………………...................................................38
4.2. 吞吐量效能測試分析.........…………………….................................................39
4.2.1. 電波隔離室測試.........……………………..............................................40
4.2.1.1. 測試儀器和配置.........……………………......................................40
4.2.1.2. 量測結果.........…………………….................................................41
4.2.2 室內測試.........…………………….........................................................42
4.2.2.1. 測試儀器和配置.........……………………......................................43
4.2.2.2. 量測結果.........…………………….................................................44
4.2.3 室外測試.........…………………….........................................................45
4.2.3.1. 測試儀器和配置.........……………………......................................45
4.2.3.2. 量測結果.........…………………….................................................46
第五章 結論與未來研究方向.........……………………...............................................47
參考文獻 ……………………………………………………………………………..48

參考文獻
1.http://www1.oc.com.tw/forums/msgexcel.asp?id=C11&msgid=4746&n=1&remsgid=4558&allfrom=4558&page=3&itype=2
2.http://big5.china.com.cn/military/txt/2009-06/01/content_17865378.htm
3.http://www.cndw.com/tech/network/2006041441601.asp
4.鄭同伯，WLAN 無線網路系統剖析與應用，博碩文化，2003，P286-P299
5.IEEE Std 802.11b-1999,Part 11:Wireless LAN Medium Access Control(MAC) and Physical Layer(PHY) specifications. IEEE Std 802.11b 1999.
6.IEEE Std 802.11a-1999,Part 11:Wireless LAN Medium Access Control(MAC) and Physical Layer(PHY) specifications. IEEE Std 802.11a 1999.
7. IEEE Std 802.11g-2003.Part11:Wireless LAN Medium Access Control(MAC) and Physical Layer(PHY) specifications. IEEE Std 802.11g 2003
8.Draft Std. 802.11n, Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Amendment: Enhancements for Higher Throughput, IEEE Draft Std. P802.11n/D2.00 2007.
9.阪田史郎 著，溫榮弘 譯，無線區域網路，全華科技，2006,P3-47-P3-50
10.http://www.epoch.com.tw/new%20hardware/PC/techart13.htm
11.台灣電路板協會，電路板機械加工技術， 台灣電路板協會，2004,P4-45
12.印刷電路板設計與製作，林水春，全華科技圖書，1993,P9-P22
13.無線通信之射頻被動電路設計，張盛富、戴明鳳，全華科技，1998,P3-2-P3-17
14.高頻電路設計實例，木宗正，全華科技，1999,P40-P45
15.射頻電路原理與實用電路設計，範博，機械工業，2006,P57-60
16.RF Circuit Desigan:Theory and Applications,Reinhold Ludwig & Pavel Bretchko,Pearson Education Taiwan Ltd,2006,P10-P28
17.Universal Serial Bus Specification Revision 2.0,2000,P120-P127
18.太陽誘電產品型錄，P60-P63
19.EUP3409 Data sheet,EUTECH Microelectronics,P8
20.Calculation of PCB Track Impedance,Andrew J Burkhardt,P1-P5
21.Multilayer Ceramic Antenna Approval Sheet,Walsin Technology Corporation,P3
22.Hardware test report ,Abocom systems,
23.IEEE Standard for Safety Levels with Respect to Humna Exposure to Radio Frequency Electromagnetic Fields,3KHz to 300GHz,IEEE Std C95.1,1999 Edition