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研究生:周政賢
研究生(外文):Chou, Jason
論文名稱:B2B企業的客製化產品之產品創新模式探討-以印刷電路板業A公司軟硬複合板的開發為例
論文名稱(外文):B2B business' customization product innovation model research:a case of A-company rigid-flex PCB product development
指導教授:吳豐祥吳豐祥引用關係
指導教授(外文):Wu, Feng Shang
學位類別:碩士
校院名稱:國立政治大學
系所名稱:經營管理碩士學程(EMBA)
學門:商業及管理學門
學類:企業管理學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:118
中文關鍵詞:軟硬複合板產品創新製程創新創新組織文化
外文關鍵詞:Rigid-Flex PCBProduct InnovationProcess InnovationOrganizational Culture
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關於產品創新的研究,絕大多數學者均以B2C的企業產品作為研究探討的對象,強調以新的產品設計帶給消費者全新的生活體驗與感受。相較之下B2B的企業產品,特別是客製化零組件產品,業者大多只能以改善製程生產效率、提升良率等手法來維持競爭力。印刷電路板業即為上述B2B客製化零組件產品在台灣地區的代表性產業。本研究即以我國印刷電路板業A公司軟硬複合板的開發為例,探討此種B2B企業的客製化產品之產品創新模式。
本研究由相關文獻探討,推展出以「新產品開發管理」、「製程技術開發管理」與「組織文化」此三個構面的研究架構來探討印刷電路板業在產品創新活動的關鍵因素與管理項目,採個案研究法深入訪談個案公司的高階主管,以瞭解其產品創新過程的實務作為。由個案分析與研究發現得出研究結論如下:
結論一:在B2B企業的客製化產品開發過程中,明確的產品策略,具體的產品概念,和互動良好的客戶參與,是新產品開發成功的關鍵因素。
結論二:機器設備的開發與實驗活動,對B2B製造業的製程技術開發占有關鍵地位。
結論三:有效的知識管理及技術開發人員的管理與領導,是B2B客製化產品企業之製程開發活動中重要的管理項目。
結論四:差異化的企業組織策略,創新的價值觀與高階主管對創新活動的支持,對產品技術創新的成功有正面的影響。
Regarding product innovation, a lot of studies did focus on B2C business, try to find a way to create “new feeling” product for consumers. For B2B business, especial for customization product, most firms do effort for production efficiency increasing, yield rate improvement, and cost reduction to maintain the competition. Printed circuit board (PCB) is this kind of industry in Taiwan typically.
This research bases on a PCB company (A-company) rigid-flex PCB development case, to study B2B business’s product innovation model. The three major constructs of the research framework include new product development and its management, new process development and its management, and organizational culture. This research adopts case-study method to analysis the practice actions in A-company. The research results as below:
1. Clear product strategy, solid product concept, and good customers’ join, are the key points to get new product development success.
2. Equipment development and experiment actions are very important factors for process technology development in B2B firms.
3. Well knowledge management, good R&D people management and leadership, are the important management items for process technology development in B2B firms.
4. Differentiation strategy, innovation value, and top managers’ attitude for innovation action supporting, will lead product technology innovation success.
摘要 I
Abstract II
目錄 III
圖目錄 VI
表目錄 VII

第一章 緒論.................................................1
第一節 研究背景與動機........................................1
第二節 研究目的與問題........................................2
第三節 研究流程與論文結構.....................................3
第二章 文獻探討.............................................4
第一節 印刷電路板產業........................................4
一、硬板、軟板、軟硬複合板....................................5
二、產業環境分析............................................8
(一) 供應鏈分析.............................................8
(二) 市場現況..............................................9
第二節 技術創新............................................16
一、產品創新與管理.........................................19
二、製程創新與管理.........................................35
  第三節 創新組織文化.....................................48
第四節 小結...........................................57
第三章 研究方法............................................59
第一節 研究架構............................................59
第二節 研究變項........................................60
第三節 研究設計與資料蒐集...................................61
一、研究方法..............................................61
二、研究對象選取...........................................61
三、資料蒐集方式...........................................62
第四節 研究限制............................................63
第四章 個案研究............................................64
第一節 個案公司背景........................................64
一、個案公司基本資料.......................................64
二、個案公司開發新產品軟硬複合板之發展背景....................67
第二節 個案公司新產品開發活動...............................67
第三節 個案公司製程技術開發活動.............................73
第四節 個案公司組織文化....................................77
第五節 小結...............................................80
第五章 研究發現與討論......................................82
第一節 新產品開發與管理.....................................82
第二節 製程技術開發與管理...................................85
第三節 創新組織文化........................................89
第四節 新產品開發與製程技術開發活動之間的關連性................91
第五節 組織文化對新產品開發的影響............................93
第六節 組織文化對製程技術開發的影響..........................95
第六章 研究結論與建議......................................96
第一節 研究結論...........................................96
第二節 建議...............................................99
參考文獻.................................................100


圖目錄

圖1-1-1 研究流程與論文結構................................3
圖2-1-1 硬質印刷電路板產業關連圖...........................8
圖2-1-1 軟質印刷電路板產業關連圖...........................9
圖2-1-3 我國PCB之各應用市場產值比重概況....................10
圖2-1-4 銅箔基板價格變化趨勢..............................11
圖2-1-5 我國PCB產業暨各產品產值之全球市占率變化趨勢..........12
圖2-2-1 技術演化循環圖...................................17
圖2-2-2 生產科技的水準及市場地點的互動模型..................18
圖2-2-3 新產品發展(產品創新)矩陣.........................21
圖2-2-3 產品開發各階段的重點任務...........................26
圖2-2-4 概念收斂與選取的過程..............................27
圖2-2-5 Calantone and Bendetto之新產品開發模式............29
圖2-2-6 Kossiakoff and Sweet流程模式流程圖...............31
圖2-2-7 Kuczmarski新產品發展過程.........................32
圖2-2-8 製程技術創新的四個階段............................36
圖2-2-9 知識創造活動:創新與實驗..........................40
圖2-2-10 研發、製造與行銷界面的互動........................45
圖3-1-1 本研究之研究架構.................................59





表目錄

表2-1-1 近年來中國推動之PCB相關法規........................13
表2-1-2 我國PCB各細項產業之產值概況........................14
表2-2-1 產品創新與製程創新的比較...........................16
表2-2-2 Kuczmarski的新產品發展差異表現....................30
表2-2-3 製程創新之四種類型................................37
表2-2-4 技術網路.........................................39
表2-3-1 組織外部適應與生存的步驟...........................49
表2-3-2 適應性的與非適應性的組織文化.......................50
表2-3-3 技術創新的組織環境................................55
表3-2-1 本研究各項變數之說明..............................60
表3-3-1 個案公司受訪人員..................................62
表4-1-1 A公司競爭及發展之有利、不利因素與因應對策............65
表4-1-2 A公司沿革與年度里程碑.............................66
表4-1-3 A公司開發軟硬複合板的里程碑........................68
表4-5-1 個案研究小結.....................................80
一、中文部份
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15.林婉萍(民86),從資源基礎探討影響技術引進因素及績效關係—我國電腦資訊業之實證,大同工學院事業經營研究所碩士論文
16.范剛明(民87),設備使用者與供應商間技術知識連結關係之研究—以臺灣積體電路製造業為例,輔仁大學企業管理研究所碩士論文
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19.張忠樸(民82), 實驗計劃速學活用法,電路板資訊雜誌
20.黃怡芳(民88),我國廠商製程創新活動之整合性探討,政治大學科技管理研究所碩士論文
21.曾俊洲(民97),2009年我國印刷電路板產業分析,臺灣經濟研究院產經資料庫
22.溫金豐(民96),組織理論與管理,學貫書局
23.詹文男,張萬權,王勝宏,高鴻翔,林羿分,秦素霞,陳文棠,楊中傑,戴基峰,張奇,黃麗虹(民95),決勝關鍵—新產品篩選與評估,資策會
24.臺灣電路板產業學院,印刷電路板概論—養成篇,臺灣電路板協會
25.賴士葆(民93),科技管理概論,國立空中大學
26.謝文雀譯(2007), Philip Kotler,Kevin Lane Keller,Swee Hoon Ang,Siew Meng Leong and Chin Tiong Tan 作,行銷管理,華泰書局


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