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研究生:戴東敬
研究生(外文):Tung-Ching Tai
論文名稱:燒結式均溫板之製造與性能分析
論文名稱(外文):Manufacturing and Performance Analysis of Sintered-Type Vapor Chamber
指導教授:趙隆山
指導教授(外文):Long-Sun Chao
學位類別:碩士
校院名稱:國立成功大學
系所名稱:工程科學系專班
學門:工程學門
學類:綜合工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:110
中文關鍵詞:接觸熱阻擴散熱阻扣具力量熱傳導量燒結式均溫板
外文關鍵詞:Vapor ChamberHeat FluxContact Thermal ResistDiffuse Thermal ResistLoad Forces
相關次數:
  • 被引用被引用:3
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  • 下載下載:172
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本研究的目地,主要是探討由自行設計與製作的銅粉燒結式均溫板,在具負載力量下的熱傳導效能量測,其中包含內部增設銅柱後,以增加均溫板可承受負載力量與熱傳導量的性能測試。同時,量測在具有負載壓力下,以同尺寸的銅塊來驗證均溫板的熱傳導效能與均溫性,並可從中得到最佳的負載力量。實驗設計中,各別有三組受測件,即是銅塊、無銅柱均溫板與具銅柱均溫板,在局部熱源面積及相同熱沉元件與負載力量的系統下,比較三組受測件之接觸熱阻值與擴散熱阻值,並再由經驗公式估算均溫板的有效毛細結構及蒸氣流之熱傳導係數與其熱傳量極限。從實驗結果得知,施以相同的負載力量時,自製均溫板的熱傳導效能與均溫性是遠優於銅塊;而比較內部增設銅柱與無銅柱之均溫板的熱傳導效能,其在不同的負載力量時,各別有其最佳的量測值,可分別作為後續使用均溫板之最佳扣具力量的依據。由此可知,以均溫板作為應用於局部熱源面積及高功率的電子產品內,將是解決電子產品因局部積熱而導致元件損壞的最佳方法之一。
This work has its own designed and manufactured copper powder sintered-type vapor chamber. In this paper, the performances of heat transfer and temperature uniformity were evaluated under different load forces and powers for three testing cases, the vapor chambers with and without copper pillars and a pure copper block with the size as the chamber. In the analysis, the comparisons of contact thermal resist and diffuse thermal resist were made and their effects the conductivity to were also evaluated. Furthermore, the empirical formulas were used to estimate the effective wick structures, the effective thermal conductivity of vapor and the limit of heat transfer rate. From the experimental results, the performances of heat transfer and temperature uniformity of vapor chambers are superior to those of the copper block. Under different load forces, the vapor chambers with and without copper pillars have their own optimum measured values, whose results could offer the optimum values of proper buckle force. From this study, it was found that the vapor chamber could be used to solve the problem of thermal damage caused by the locally accumulated heat of electric components.
總目錄 頁數
摘要 Ⅰ
英文摘要 Ⅱ
誌謝 Ⅲ
目錄 Ⅳ
表目錄 Ⅷ
圖目錄 Ⅸ
符號表 ⅩⅤ
第一章 研究目的與背景 1
1-1 研究動機及目的 1
1-2 發展背景 4
1-3 文獻回顧 7
第二章 理論分析 9
2-1 均溫板構造 9
2-2 均溫板工作原理 10
2-2-1 表面張力性質 11
2-2-2 接觸角與潤濕能力關係 12
2-2-3 毛細作用力 14
2-2-4 滲透率 16
2-3 熱管的限制條件因素 18
2-3-1 黏滯力限制 18
2-3-2 音速限制 19
2-3-3 毛細力限制 20
2-3-4 飛散傳輸限制 21
2-3-5 沸騰限制 23
2-4 金屬粉末基本燒結理論 23
2-4-1 燒結驅動力與溫度的影響 24
2-4-2 粒子間的接著機構 25
2-4-3 空隙的緻密化機構 26
2-5 二相流變化的熱傳導機制 27
2-5-1 擴散熱阻對熱傳導機制的影響 29
2-6 扣具壓力與接觸熱阻關係 30
第三章 實驗設備與方法 32
3-1 實驗設備介紹 32
3-1-1 燒結設備 33
3-1-2 除氣充填設備 33
3-1-3 重量量測設備 34
3-1-4 溫度量測設備 35
3-1-5 均溫板熱傳導性能量測系統 36
3-2 實驗材料介紹 38
3-2-1 氫氧化鈉溶液 38
3-2-2 鹽酸溶液 38
3-2-3 無鉛錫膏 38
3-2-4 散熱膏 39
3-2-5 脫模劑 39
3-3 製作方法 39
3-3-1 銅盒與石墨盒設計 40
3-3-2 粉末燒結程序 40
3-3-3 迴焊程序 41
3-3-4 負壓測漏程序 41
3-3-5 注水、除氣程序 42
3-3-6 封口程序 43
3-4 實驗步驟 44
3-4-1 實驗條件 45
3-4-2 實驗方法 46
第四章 結果與討論 49
4-1 負載壓力與接觸熱阻關係 49
4-2 V.C、V.C(pillar)、Block 熱阻值的比較 50
4-3 擴散熱阻值之分析 52
4-4 V.C 與V.C(pillar)最佳扣具壓力的量測 53
4-5 keff 有效熱傳導係數估算 55
4-6 熱沉之熱阻值分析 57
4-7 均溫板之最大熱傳量( ) 60
第五章 結論 61
參考文獻 64
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