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研究生:邱勝彬
研究生(外文):Sheng-Bin Chiou
論文名稱:奈米壓痕實驗應用於薄膜界面附著性質及殘留應力釋放之研究
論文名稱(外文):The Study of Interface Adhesion Properties and Release Residual Stresses via Nanoindentation Experiments
指導教授:林仁輝
指導教授(外文):Jen-Fin Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:機械工程學系碩博士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:80
中文關鍵詞:脫層挫曲應變能釋放率類鑽碳殘留應力
外文關鍵詞:DLCResidual stressStrain energy release rateBuckleDelamination
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本論文為奈米壓痕實驗應用於薄膜界面附著性質及殘留應力釋放之研究。內容主要可以分為三個部份:第一個部份為利用輝光放電分光儀(GDS)、拉曼光譜(Raman Spectrum)、聚焦離子束(Focus Ion Beam)與奈米壓痕試驗來檢測利用高功率磁控脈衝電漿源濺鍍法所鍍製之類鑽碳膜之薄膜機械性質。利用輝光放電分光儀作薄膜成份分析,觀察C元素之濺射深度,藉以判斷薄膜沉積厚度與過渡層之深度。再加上利用聚焦離子束將試片做剖面分析,藉以映證輝光放電分光儀成份分析C元素深度之準確性,以及確定所鍍製之薄膜的平整性與緻密性。再以拉曼光譜分析,類鑽碳膜的鑽石成份(sp3)與石墨成份(sp2)之比例,藉以來確定此類鑽碳膜成份是否接近鑽石。再藉由奈米壓痕試驗來量測薄膜之機械性質。結果顯示,利用聚焦離子束將試片剖面切開所觀察之沉積層的厚度與輝光放電檢測結果相當接近,且無論是厚度與表面形貌都有極佳的均勻性。
第二部份要為薄膜的附著性質之估算,利用週期性之動態負載奈米壓痕試驗,驅使薄膜產生突進(Pop-in)現象,在脫層之後其力-位移曲線會有相位落後之現象產生,將向位落後移除後其力-位移曲線之會成一線性之行為,用此結果去估算薄膜之附著性質。由實驗結果顯示,此次鍍膜的應變能釋放率相當高;若非經由週期性負載作用加上使用較尖銳的壓頭(Cube corner),試件並不會發生脫層現象。
第三部份為殘留應力釋放之研究分析,利用奈米壓痕試驗機,設定一連續震盪負載,使薄膜產生脫層的現象,在脫層發生同時,薄膜內殘留應力也會隨之釋放出來,利用負載斷與卸載段之線性行為,將薄膜殘留應力估算出來。同時再利用不同震盪頻率之週期性負載,來檢視薄膜殘留應力是否會因施工條件不同,而造成估算的結果不同。再利用週期性動態負載,所量測之壓痕應力與殘留應力,去分析挫曲後造成薄膜隆起之行為與估算其應變能釋放率。由實驗結果顯示,有發生挫曲之情形者,其殘留壓深幾乎會回到原始壓深之點,且其應變能釋放率會較無發生挫曲之情形要來的高。
The aim of this paper is to study interface adhesion properties and release residual stresses via nanoindentation experiments. In the first part, glow discharge spectrometer(GDS)、Raman spectrum、focus ion beam and nanoindentation is used to detected Diamond-like-carbon mechanism properties deposited by high power impulse magnetron sputtering(HIPIMS). By using GDS thin film composition analysis to detect carbon sputtering depth, the thin thickness and overlap layer thickness can be known. By using focus ion beam, the carbon depth can be measure specific and the thin film’s smoothness and tightness can be known. Through the Raman spectrum analysis, the ratio of sp3 and sp2 in diamond-like-carbon can be measure. The ratio is to check that whether thin film composition is near diamond’s composition. The nanoindentation test is to measure mechanical properties of thin film. The results, film thickness, of two experiments, which are GDS and FIB are close. Also the thickness and surface smoothness are good.
In the part of estimation of thin film’s adhesion property, cyclic dynamic loading nanoindentation test forces the pop-in phenomenon which happens on thin film. After delamination the force-depth curve may have phase lag phenomenon. By removing the phase lag force-depth curve, the adhesion property of thin film can be measure. As the result shows, the strain energy release rate of thin film is high. The test may not delaminate without cyclic dynamic loading and using sharp indenter.
In the of residual stress release analysis, using nanoindentation test and cyclic dynamic loading, the thin film delaminates. When the thin film delaminates the residual stress in thin film may release. The residual stress can be calculated by the linear behavior of force-depth curve. Whether the difference frequency of cyclic dynamic loading may cause different residual stress of thin film is negative. Then by using cyclic dynamic loading, the buckle behavior and strain energy release rate can be analyzed by indentation stress and residual stress. According to the results, the residual depth may come back to the initial indenting point when the buckling of thin film happens. Also, the strain energy release rate may be higher when the buckling of thin film happens than when the buckling of thin film does not happen.
摘要 I
Abstract III
誌謝 V
目錄 VII
表目錄 X
圖目錄 XI
符號說明 XIV
第一章 緒論 1
1.1 前言 1
1.2 文獻回顧 3
1.3 研究目的與內容 6
第二章 基本理論 7
2.1 壓痕破裂模式 7
2.2 覆膜材料之附著能 8
2.2.1負載時突進的機制 8
2.2.2震盪時突進的機制 9
2.2.3分析線性負載-壓深行為 10
2.2.4應變能釋放率 12
2.3 覆膜材料受殘留應力而產生挫曲 13
2.4 覆膜材料經奈米壓痕之殘留應力釋放 14
2.5 覆膜材料經壓痕試驗造成薄膜挫曲 15
第三章 實驗規劃 29
3.1 實驗目的 29
3.2 高功率磁控脈衝電漿源鍍膜 30
3.2.1 試驗材料 30
3.2.2 製程步驟 30
3.3 壓痕試驗機與壓頭規格 33
3.4 表面分析 34
3.4.1 拉曼光譜分析 34
3.4.2 壓痕試驗 34
3.4.3 輝光放電縱深分析 35
3.4.4 磨耗試驗 35
3.5 動態負載量測附著能及殘留應力 36
第四章 結果與討論 42
4.1薄膜成份分析及剖面觀察 42
4.2薄膜機械性質檢測 43
4.3 附著力分析 46
4.3.1覆膜材料附著能分析 46
4.3.2電話線組織之附著能分析 46
4.4 殘留應力分析 48
4.5 壓痕試驗造成薄膜挫曲之附著能分析 49
4.5.1挫曲與未挫曲案例之比較 49
4.5.2薄膜臨界裂痕長度之估算 50
4.5.3 薄膜挫曲之附著能計算 51
第五章 結論與未來研究 73
5.1 引言 73
5.2 結論 73

5.3 未來研究方向 75
參考文獻 77
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