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研究生:翁嘉君
研究生(外文):Chia-Chun Weng
論文名稱:小型化低溫共燒陶瓷天線前端模組之開發
論文名稱(外文):Development of a Compact Low-Temperature Co-fired Ceramic Antenna Front-End Module
指導教授:鍾世忠鍾世忠引用關係
指導教授(外文):Shyh-Jong Chung
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電機學院碩士在職專班電信組
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:97
語文別:中文
論文頁數:55
中文關鍵詞:射頻前端模組倒F天線低溫共燒陶瓷無線區域網路系統化封裝
外文關鍵詞:RF Front-End ModuleInverted-F antennaLow Temperature Co-fired Ceramic (LTCC)Wireless Local Area Network (WLAN)System-on-Package (SoP)
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本篇論文旨在利用低溫共燒陶瓷(LTCC)多層架構的基板,設計一嵌入式內含天線的一個小型化5 GHz的射頻前端模組,而且能夠將這個模組用於IEEE 802.11a無線區域網路的應用當中。在這個LTCC模組當中,包含了一個嵌入式的倒F型天線,一個帶通濾波器和一個低通濾波器。而這兩個所提出來的濾波器能在截止的頻帶產生額外的傳輸零點,並且能夠抑制一些不需要的訊號。再者,我們在這個LTCC的基板表面上黏著了一個雙刀雙擲(DPDT)的傳送/接收裸晶片開關切換器,並且利用金屬鎊線的方式將這個裸晶片開關切換器與內埋式的被動元件電路連接起來。所以在我們設計的濾波器當中,必須要把鎊線近似於等效電感的效應考慮和計算進去。整個完成後的LTCC天線射頻前端模組的尺寸大小為6.2 mm × 5.4 mm × 0.98 mm,在整個模組的設計當中,為了使天線有最佳的輻射效能,所以大部份的空間是保留給所設計的天線使用(接近三分之二的空間)。並且,為了避免內埋式的被動電路元件和天線之間產生潛在性的近距離耦合效應,也為了增加元件和天線之間的隔離度,所以在模組的設計上,利用許多的金屬貫穿孔將上層的接地面和下層的接地面互相連結起來。由於小型天線的輻射場型容易受到附近電路接地面所感應出的接地電流所影響,所以我們將所設計出來的天線射頻模組放在兩種不同大小的FR4印刷電路板(PCBs)上面做測試(即55 mm × 20 mm和80 mm × 46 mm兩種不同的印刷電路板),用來驗證天線射頻模組在這兩個不同大小的PCB上都能夠有不錯的特性。
This thesis proposes a compact 5 GHz front-end module with embedded antenna on a low-temperature co-fire ceramic (LTCC) substrate, which is to be used for the IEEE 802.11a wireless local area network (WLAN) applications. This module comprises an embedded inverted-F antenna, a band-pass filter, and a low-pass filter. Both the proposed filters possess transmission zeros at out band for suppressing unwanted signals. Also, a double-pole double-throw (DPDT) bare die transmitting/receiving (T/R) switch is mounted on the surface of the substrate. The interconnection between the bare die switch and the buried circuits is established by bond wires. The effect of the bond wire is considered by incorporating its equivalent inductance into the design of the filters. The overall size of the antenna front-end module is only 6.2 mm × 5.4 mm × 0.98 mm, with most of the space (near two third of the volume) reserved for the antenna so as to have a better radiation performance. Also, to avoid the potential close proximity coupling among the buried circuits and the antenna, numerous metal vias connecting the top and bottom grounds in the module are designed for shielding. Since the radiation of a small antenna is influenced by the nearby circuit ground due to induced ground current, the developed antenna front-end module is tested on two FR4 printed circuit boards (PCBs) with different sizes (i.e., 55 mm × 20 mm and 80 mm × 46 mm). It is demonstrated that the antenna module performs well on these two grounded PCBs.
第一章 緒論 1
1.1背景簡介 1
1.2 LTCC簡介 2
1.3文獻探討 9
1.4章節介紹 11
第二章 關鍵模組元件之設計與開發 12
2.1 鎊線連接技術(Wire Bonding) 12
2.2 天線切換模組系統方塊圖 14
2.3 帶通濾波器(BPF)設計 17
2.4 低通濾波器(LPF)設計 21
2.5 內嵌式5 GHz天線設計 24
2.6 DPDT收發切換器(T/R Switch) 30
2.7 濾波器不良特性分析與探討 33
第三章 射頻前端天線模組的整合與測試 37
3.1 元件之間的耦合效應 37
3.2 天線切換模組的佈局設計 39
3.3 天線切換模組在傳送路徑上的量測 41
3.4 天線切換模組在接收路徑上的量測 45
3.5 天線切換模組在大型FR4 PCB上的量測 48
第四章 結論 53
參考文獻 54
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