臺灣博碩士論文加值系統

電子零組件是電子產品中不可或缺的基本元件，而其中晶片電阻在我國的總產量更是佔全球的一半以上。此產品的特性為產品種類的變異以及產量皆非常的龐大，是典型的大量客製化產品，故如何能完整的表達此產品的變異製造知識，以及規劃配置出高產量的製造工廠，最後整合這些資訊來達到有效的執行管控模式，對此類型的產業而言是相當重要的研究方向。
本研究是採用精敏製造(Agile Manufacturing)的理論背景，及MR-IE(Enterprise Integration Reference Model)的企業塑模方式為其製造模型的建構基礎。主架構以產品變異結構模型(VPC Model)、通用精敏製造途程模型(GAMP Model)、通用精敏製造模組(GAMM)來建構出整體的製造模型以及整合出互相的關聯性質。在工廠的佈局中，則運用了物流動線搭配生產流程做出規劃配置，並實際的根據各種設施以及區域的使用面積規劃配置出實體的製造工廠。在所有的製造知識釐清之後，產生包括訂單展開至工令的排程及派工等等的相關資訊，並用E-R Model建構出執行管控的關聯模式，進而產生各種實際的關聯資料表，再以事件驅動程序鏈(EPC)搭配各種相關的資訊建構其執行管控的運作模式，最後達成晶片電阻產品之精敏製造在執行管控方面的整合應用。

Chip resistors are necessary basic components in the electronic products. The total production quantity of chip resistors in our country are half of the total usage in the world. The unique characteristics of chip resistor production are wide variation in product configuration, big production quantity and high demand in mass customization. To make the manufacturing of such components be an agile system, it is very important to properly represent the manufacturing knowledge of such wide variation products and to deploy the manufacturing plant for such high volume production. As well as to effectively execute and control the operation of the whole plant, which is the aim of this research.
To achieve the aim, agile manufacturing and enterprise model MR-IE (Enterprise Integration Reference Model) proposed by Y. C. Yu was adopted as the basic manufacturing system model. In MR-IE, there are VPC, GAMP and GAMM sub-models that were adopted to represent the variations in product configuration, manufacturing process, and production facility structure, respectively. As to the manufacturing plant deployment, the model of material flow and manufacturing process are integrated to design the deployment of production areas, production lines, AS/RS and material transportation. Based on all the manufacturing knowledge represented and the manufacturing plant deployed, we can then model the whole plant operation from work order receiving, scheduling, dispatching, and execution with EPC (Event-Driven Process Chain). Integrating all the properly designed manufacturing knowledge and execution control, it is expected that an agile manufacturing for chip resistor production can be achieved.

中文摘要 ................................................ i
英文摘要 ............................................... ii
誌謝 ................................................... iv
目錄 .................................................... v
表目錄 ................................................. ix
圖目錄 .................................................. x
第一章 緒論 ............................................. 1
1.1 研究背景與動機 ...................................... 1
1.2 研究方式與目的 ...................................... 3
1.3 研究流程 ............................................ 5
第二章 文獻探討 ......................................... 7
2.1 企業整合塑模 ........................................ 7
2.1.1 企業整合塑模之定義 ................................ 7
2.1.2 CIMOSA模型探討 .................................... 8
2.1.3 ARIS模型探討 ..................................... 10
2.1.4 MR-IE模型探討 .................................... 11
2.2 精敏製造系統 ....................................... 16
2.2.1精敏製造系統之定義 ................................ 16
2.2.2精敏製造系統之規劃設計與整合管控 .................. 19
2.3 BOM探討 ............................................ 21
2.4 事件驅動程序鏈 ..................................... 23
第三章 晶片電阻產品背景與變異探討 ...................... 25
3.1 產業背景 ........................................... 25
3.2 產品種類變異 ....................................... 26
3.3 產品結構簡介 ....................................... 30
3.4 產品外觀變異探討 ................................... 32
第四章 晶片電阻產品製造知識模型建構 .................... 34
4.1 研究架構及流程 ..................................... 34
4.2 變異型構設計方式 ................................... 37
4.3 產品變異參數式型構模型 ............................. 40
4.3.1晶片電阻片狀製程雷射切割前型構 .................... 41
4.3.2晶片電阻片狀製程雷射切割後型構 .................... 44
4.3.3晶片電阻條狀至粒狀製程後型構 ...................... 46
4.3.4晶片電阻電鍍製程後型構 ............................ 48
4.3.5晶片電阻包裝製程後型構 ............................ 50
4.3.6晶片電阻產品總型構 ................................ 52
4.4 製造途程設計方式 ................................... 53
4.5 產品製造途程模型 ................................... 55
4.5.1晶片電阻雷射切割前片狀製程 ........................ 55
4.5.2晶片電阻雷射切割後片狀製程 ........................ 57
4.5.3晶片電阻條狀至粒狀製程 ............................ 58
4.5.4晶片電阻電鍍製程 .................................. 59
4.5.5晶片電阻包裝製程 .................................. 60
第五章 晶片電阻工廠佈局 ................................ 61
5.1 工廠組成定義 ....................................... 62
5.2 各工廠中各生產區之產線配置及流程規劃 ............... 63
5.2.1主要生產工廠中各生產區之產線配置及流程規劃 ........ 63
5.2.2電鍍工廠中生產區之產線配置及流程規劃 .............. 66
5.2.3品檢及包裝工廠中生產區之產線配置及流程規劃 ........ 67
5.3 各工廠內區域之物流動線規劃 ......................... 69
5.3.1主要生產工廠物流需求From-To表 ..................... 70
5.3.2電鍍工廠物流需求From-To表 ......................... 71
5.3.3品檢及包裝工廠物流需求From-To表 ................... 72
5.4 各工廠之佈局 ....................................... 74
5.4.1主要生產工廠之佈局 ................................ 75
5.4.2電鍍工廠之佈局 .................................... 79
5.4.3品檢及包裝工廠之佈局 .............................. 82
第六章 晶片電阻精敏製造執行管控模式 .................... 85
6.1 訂單產生至工令生成之處理流程 ....................... 86
6.2 工令總排程及派工總覽 ............................... 89
6.3 執行管控之關聯資料建構 ............................. 97
6.3.1派工總覽之物料搬運及倉儲備料展開 .................. 97
6.3.2執行管控之關聯資料E-R Model ....................... 98
6.3.3執行管控之關聯資料表設計 ......................... 101
6.4 基本執行令之執行管控運作流程 ...................... 115
6.4.1工令執行管控運作流程 ............................. 115
6.4.2物料搬運令執行管控運作流程 ....................... 118
6.4.3倉儲備料令執行管控運作流程 ....................... 120
6.5 產品實際訂單之整體生產流程範例 .................... 122
第七章 結論及未來展望 ................................. 125
7.1 結論 .............................................. 125
7.2 未來展望 .......................................... 126
參考文獻 .............................................. 127

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