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研究生:許晉榮
研究生(外文):Shiu, Jin-Rung
論文名稱:運用六標準差步驟與實驗設計於半導體電子元件PDIP之脫層現象不良率改善
論文名稱(外文):To Apply Six-Sigma Steps and DOE Techniques in improving Delamination Deviations of PDIP Package of Semiconductor
指導教授:陳啟政陳啟政引用關係
指導教授(外文):Chen Chee-Cheng
學位類別:碩士
校院名稱:國立屏東科技大學
系所名稱:企業管理系所
學門:商業及管理學門
學類:企業管理學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:82
中文關鍵詞:六標準差DMAIC實驗設計變異數分析良率
外文關鍵詞:Six SigmaDMAICDOEANOVAYield
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  本研究旨在運用六標準差品質系統之(DMAIC)手法,作為品質改善專案的進行步驟,結合實驗設計(DOE)技術,藉著變異數分析為方法,找出影響製程能力的重要因素及最佳製程能力條件組合,比較改善前與改善後之產出不良率,進行最佳參數製程能力之驗證,並將最佳參數標準化列為管制項目;作為管理者進行每一次品質改善決策時,快速且有效有益之決策依據。
  故本研究期望建立乙套可靈活運用於屬性別不同之製造商之上,模式設計上以結合「六標準差品質系統」與「實驗設計」品質改善方法,目的在於優化、提昇與導入產品良率改善機制,用以預防最終結果可能發生不符顧客或公司目標。

  The study integrates Six-Sigma D-M-A-I-C and design of experiments (DOE) techniques in process capability improvement in Semiconductor PDIP Package Delamination Deviations. The process begins by identifying the critical quality characteristics and process variables. “DOE” plays pivotal role in Six Sigma implementation, including the fish-bone chart, analysis of variance (ANOVA), defining critical process factors (CF) to determine the best process control parameters and tolerance setting. Yield measurement and improvement are used to standardize the optimum operating parameters.
  The major contribution of this study is establishing an application model appropriate to local enterprises. This model is combined with the DMAIC and DOE techniques to promote and sustain built-in capabilities and organizational culture changes. This study uses the Delamination Deviations in the Semiconductor PDIP Package as a case study to prove the model’s applicability and suitability.

目 錄
摘 要..............................................I
Abstract..........................................II
謝 誌............................................III
目 錄.............................................IV
圖表索引............................................V
第壹章 緒論.........................................1
第一節 研究背景與動機................................3
第二節 研究目的.....................................6
第三節 研究流程.....................................8
第四節 論文架構....................................10
第貳章 文獻探討....................................11
第一節 六標準差....................................11
第二節 DMAIC之概念.................................27
第三節 實驗設計....................................37
第四節 變異數分析 ..................................41
第五節 良率........................................46
第參章 研究方法....................................49
第一節 研究步驟....................................49
第二節 研究架構....................................52
第肆章 實例驗證....................................53
第一節 界定與衡量 - 確定改善主題與現況分析............53
第二節 分析 – 抓出影響製程產出變異之關鍵因子..........56
第三節 改善 – 獲得穩建設計之製程水準.................64
第四節 控制 - 標準化管理............................70
第伍章 結論與建議 ..................................71
第一節 研究結論....................................71
第二節 研究貢獻與建議...............................72
第三節 研究限制....................................73
參考文獻...........................................74
中文部分...........................................74
英文部分...........................................76
作者簡介...........................................82

圖表索引
圖1-3- 1 研究架構圖.................................9
圖2-1- 1 六個標準差之常態分配圖......................13
圖2-1- 2 製程偏離正負1.5個標準差之偏移圖..............14
圖2-2- 1 六標準流程步驟.............................30
圖2-2- 2 六標準差管理之改善步驟......................34
圖3-1- 1 DMAIC步驟結合實驗設計方法...................52
圖4-1- 1 PDIP(Plastic)電子元件....................53
圖4-1- 2 物料與脫層資訊.............................54
圖4-1- 3 第三生產子批之中子掃描測試圖.................54
圖4-1- 4 PDIP之高倍電子顯微鏡圖......................55
圖4-1- 5 PDIP之電子橫切面圖.........................55
圖4-2- 1 特性要因圖.................................56
圖4-2- 2 點線圖(1)................................59
圖4-2- 3 實驗設計點線圖類型..........................59
圖4-2- 4 變異數分析表(1)...........................60
圖4-2- 5 直交配列表(1).............................60
圖4-2- 6 變異數分析結果..............................61
圖4-2- 7 變異數分析合併後結果.........................61
圖4-2- 8 貢獻度柏拉圖分析 ............................62
圖4-2- 9 主因子水準平均值回應圖(1)...................62
圖4-2- 10 平均值比較表(1)...........................63
圖4-3- 1 點線圖(2).................................64
圖4-3- 2 變異數分析表(2)............................64
圖4-3- 3 因子B三水準切分方式圖.........................65
圖4-3- 4 直交配列表(2)..............................66
圖4-3- 5 平均值比較表(2)............................66
圖4-3- 6 主因子水準平均值回應圖(2)....................67
圖4-3- 7 第二階段實驗設計因子B及因子D之最小顯著差異 .....67
圖4-3- 8 測試批試產結果...............................69
圖4-3- 9 中子掃描測試圖...............................69
表2-1- 1 規格界限與缺點數對照表........................14
表2-1- 2 六標準差之定義...............................15
表2-1- 3 製程改善技術比率 .............................22
表2-2- 1 六標準差推動步驟 .............................31
表2-2- 2 DMAIC 流程之定義.............................31
表2-2- 3 DMADV 流程之定義.............................32
表2-2- 4 各階段目的與任務 .............................33
表2-2- 5 六標準差 DMAIC 法常見工具.....................34
表2-4- 1 一因子變異數分析表,固定效應模型................44
表4-2- 1 因子篩選表...................................57
表4-2- 2 因子水準對照表................................58
表4-2- 3 第一階段實驗結論 ..............................63
表4-3- 1 第二階段實驗結論 ..............................68

中文部分

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張鈞程 (2006),動態ANOVA模型於混合產品生產之應用,國立清華大學化學工程學系碩士論文。
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許 平 (2007),中小企業導入精實生產和六標準差之可行性研究-以台灣中小型電鍍廠為案,朝陽科技大學工業工程與管理系碩士論文。
陳瀅中 (2007),運用六標準差DMAIC 方法於提昇印刷電路板底片品質之研究,大葉大學工業工程與科技管理研究所碩士論文,。
喬廣文 (2003),應用六標準差方法提升半導體封裝製程品質,交通大學管理學研究所碩士論文。
曾英富 (2006),應用六標準差的專案手法改善塗裝製程不良率 -以A公司為例,朝陽科技大學工業工程與管理系碩士論文。
曾慶毅 (2003), Six Sigma 之實務應用方法研究-以飛機零組件維修為例,元智大學工業工程與管理研究所碩士論文。
黃上杰 (2006),應用六標準差設計於新產品開發流程績效評估之研究,國立勤益科技大學工業工程與管理系碩士論文。
黃國材 (2002),六標準差在製造業之應用,大葉大學工業工程研究所碩士論文。
劉惠敏 (2006),應用六標準差之DMAIC模式降低證券商之錯帳率,勤益技術學院生產系統工程與管理研究所碩士論文。
鄭崇義 (2000),田口品質工程技術理論與實務,中華民國品質學會。
鄭榮郎 (2003),完成6 sigma目標22個行動步驟,品質月刊,19-22。
鑽石.六標準差研究會 (2007),六標準差簡單學,晨星出版。

英文部分

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