臺灣博碩士論文加值系統

本論文提出一種創新型之微機電式壓力感測器構裝方法，其做法為使用一可圖樣化之超厚膜光阻(150毫米厚度) ，來定義出壓力計構裝體中之感測通道，在相同之創新構裝概念下，依據不同光阻材料之材料特性可開發出犧牲-置換和圍籬環等兩個不同之構裝架構。
本論文中採用實驗量測與有限元素模型分析之方法，來驗證構裝後之壓力計感測特性。以犧牲-置換和圍籬環構裝方式研製之已構裝壓力計的零位偏移溫度係數(TCO)分別為-0.07和-0.19 % span/oC，皆符合未構裝壓力計之零位偏移溫度係數規格(TCO < -0.2% span/oC)，實驗證實，本論文中所提出之兩個構裝方式中的光阻，皆能在165度C與1.86Mpa之模成型製程條件下，避免高溫/高壓之液態模成型化合物對壓力計構裝體之感測通道的污染。以犧牲-置換和圍籬環構裝方式完成之壓力計構裝體之構裝尺寸皆為4.0 x 4.0 x 1.5 mm，相對於目前已商業化之壓力計構裝之體積至少縮小7倍以上。除此之外，本論文同時開發一150

This dissertation proposes a novel packaging methodology for micro-electro-mechanical systems (MEMS) based pressure sensors by using a patterned ultra-thick (150

Contents
Chinese Abstract …………………………………………………….………………… I
English Abstract ……………………………………………………………………… II
Acknowledgement ……………………………………………………………………. IV
Contents …………………………………………………………..…..……................. V
List of Figures ……………………………………………………...…………………. VII
List of Tables …………………………………….…………….……………………… X

Chapter 1 Introduction 1
1.1 Background……………………………………………………………………. 1
1.2 Motivation and objectives……………………………………………………… 1
1.3 Thesis organization…………………………………………………………….. 3

Chapter 2 Pressure sensor packages 5
2.1 MEMS-based pressure sensors………………………………………………. 5
2.2 Piezoresistive theory………………………………………………………….. 10
2.3 Wheatstone bridge……………………………………………………………... 13
2.4 Pressure sensor packages………………………………………………………. 15
2.5 Our approaches………………………………………………………….……. 22
2.6 References……………………………………………………………………… 24

Chapter 3 The lithographic Dam-ring Approach 27
3.1 Introduction…………………………………………………………………….. 27
3.2 MEMS-based pressure sensors………………………………………………… 27
3.2.1 Piezoresistive Pressure Chip…………………………………………… 27
3.2.2 Packaging process…………………………………………………….. 29
3.3 Finite element analysis………………………………………………………… 34
3.3.1 Calculation of the signal output………………………………………... 34
3.3.2 FE model of the package………………………………………………. 35
3.4 Measurement setup 38
3.5 Results and discussion……………………………………..…………………... 39
3.5.1 Verification of the FE model…………………………………………….. 39
3.5.2 Packaged pressure sensor………………………………………………… 43
3.5.3 Package characterization…………………………………………………. 45
3.6 Summary……………………………………………………………………….. 52
3.7 Reference………………………………………………………………………. 53


Chapter 4 The Sacrifice-replacement Approach 54
4.1 Introduction…………………………………………………………………….. 54
4.2 Packaging design………………………………………………………………. 54
4.2.1 Piezoresisive pressure sensor ……………………………..……………... 54
4.2.2 Packaging process ……………………………………………………….. 57
4.3 Finite element analysis…………………………………………………………. 65
4.4 Results and discussion…………………………………………………………. 68
4.4.1 Validation of the FE models ……………………………………………... 68
4.4.2. Packaged pressure sensor……………………………………………….. 70
4.4.3 Characterization………………………………………………………….. 73
4.5 Summary……………………………………………………………………….. 80
4.6 Reference………………………………………………………………………. 82

Chapter 5 Conclusions 84

Curriculum Vitae 86

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