在這篇論文中，為了消除製程因素影響，我們採用外界機械單軸張硬力與壓應力在金氧半場效電晶體上來研究負偏壓溫度不穩定之特性。在單軸張應力下汲極電流與電洞遷移率皆減少，且負偏壓溫度不穩定之特性變得更嚴重。在單軸壓應力下汲極電流與電洞遷移率皆增加，且負偏壓溫度不穩定之特性更輕微。藉著分離式電容量測法，可發現單軸張應力下與單軸壓應力下，在反轉層的電荷分別增加與減少。這是因為應力會導致能帶分裂與有效質量改變。根據反應與擴散模型，介面缺陷產生率正比於反轉層的電動數目。因此藉著單軸張應力，因為反轉層的載子增加導致較差的負偏壓溫度不穩定之特性。但藉著單軸壓應力因為反轉層的載子減少導致較好的負偏壓溫度不穩定之特性。

In this thesis, in order to eliminate process issue, an external mechanical uniaxial tensile and compressive stress applied on p-type metal-oxide-semiconductor field effect transistors (p-MOSFETs) is used for the study of negative bias temperature instability (NBTI) characteristics. Drain current and hole mobility decreases under uniaxial tensile strain, and the NBTI characteristics also become more serious simultaneously. And drain current and hole mobility increases under uniaxial compressive strain, and the NBTI characteristics also become less serious simultaneously. By analyzing split capacitance-voltage (C-V) characteristics, inversion charge increases and decreases due to strain induced change of band splitting and effective mass under uniaxial tensile strain and uniaxial compressive strain, respectively. According to Reaction-Diffusion model, interface trap generation rate is proportional to the number of holes in inversion layer. Therefore, the worse NBTI degradation resulted from increased inversion charge induced by uniaxial tensile strain. And the better NBTI degradation resulted from decreased inversion charge induced by uniaxial compressive strain.

Chinese Abstract
English Abstract
Figures Captions
Chapter 1- Introduction
1-1 Semiconductor Device Building Blocks………………………...1
1-2 Strain Technology……………………………………………….3
1-3 Motivation………………………………………………………..8
1-4 Organization of this Thesis……………………………………...9
Chapter 2 Foundation of Theory
2-1 MOSFET………………………………………………………..11
2-2 NBTI…………………………………………………………….12
2-2-1 Background
2-2-2 Experimental signatures of NBTI
2-2-3 The standard R–D model of NBTI
2-2-3-1 Description of the R–D model
2-2-3-2 Discussion of the R–D model
2-2-3-3. Enhancement of the R–D model
2-2-3-3-1. Model for NBTI field (or voltage) dependence
2-2-3-3-1. Role of holes and field-dependence through hole density
2-2-3-3-2. Activation energy of the diffusion process
2.3 Charge Pumping………………………………………………..24
2.3.1 Basic Theory
2-3-2-1 Fixed Amplitude Sweep
2-3-2-2 Fixed Base Sweep and Fixed Peak Sweep
2-4 Mobility Measurement by Split CV…………………………..28
Chapter 3 Apparatus and Parameters
3-1 Steps of Experiments…………………………………………..30
3-1-1 Preparation before Experiments
3-1-2 Polish the sample
3-1-3 The setting of the IV measurement
3-1-4 Mobility Measurement by Split CV
3-1-5 Charge Pumping Measurement
3-2 Parameter………………………………………………………34
3-3 Apparatus of experiment………………………………………35
3-3-1 Polishing machine
3-3-2 Measurement machine
Chapter 4 Results and Discussion
4-1 The influence of electrical analysis by strained effect………..37
4-2 The influence of reliable analysis by strained effect at invariable temperature………………………………………..38
4-3 The influence of reliable analysis by strained effect at variable temperature……………………………………………………40
4-4 The influence of CV by strained effect………………………..43
4-5 The influence of charge pumping current by strained effect..44
Chapter 5 Conclusion………………………….……………..46
Reference……………………………………………….……..47
Figures………………….……………………………………..60

Chapter 1
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