臺灣博碩士論文加值系統

Flip chip technology (FCT) with ball grid array interconnection has attracted a great deal of attention in today’s microelectronic packaging. In flip chip technology, one of the challenging issues is the material selection for under bump metallization (UBM). The Ni-based UBM is of interest in FCT owing to the lower growth rate of the Ni-Sn compound and limited spalling effect. In this study, the elemental distribution and related phase transformation between lead-free and eutectic solders and Cu/Ni(V)/Ti UBMs were investigated with the aid of quantitative analysis with an electron probe microanalyzer. Various types of IMC, such as (Cu1-x,Agx)6Sn5, (Cu1-y,Agy)3Sn and (Ag1-z,Cuz)3Sn were observed.
The major task of this study is to evaluate the electrical characteristics in the IMC for the solder joint. Conventionally, the two-point method could only derive the resistance data, which failed to provide effective reference in the industry. To accurately determine the resistivity performance of IMC, a novel method incorporated with SELA-EM2 and FIB was developed to prepare the joint sample. It was demonstrated that more accurate evaluation of resistivity in IMCs could be achieved by this innovative technique. The SEM nano-probing with the four-points probing method to measure resistivity of a lead free solder ball was proposed. In this study, more accurate IMC/solder joint resistivity can be measured by utilizing the reliable system which integrates the SEM nano-probing technique, the four-points probing method and the precise cutting method (SELA and FIB) together, which was introduced to evaluate the electric characteristics in the intermetallic compounds of solder joints after various test conditions. The electric data would be correlated to microstructural evolution due to the interfacial reaction between solder and UBM.
The electrical properties of FC-BGA lead-free solder joints after various environmental tests among temperature cycle tests (TCT) from 200 to 1000 cycles, high temperature storage tests (HTST) from 500 to 2000 hrs and highly accelerate stress test (HAST) were evaluated. The resistivity comparison among different environment test conditions, such as TCT, HAST and HTST, was studied. The results conclusively showed that the resistivity of every component in the solder joint could be precisely measured. Moreover, results of resistivity, which were constants in repeated measurements, (6 points/location) indicated the reliability of the data. By comparing electrical resistivities of data for overall resistivity in solder joint, the order was solder ball [Sn-3.5Ag-0.5Cu] (51.3 %) >Cu6Sn5 (36.2 %,)> Cu3Sn (6.6 %) >Ag3Sn (5.9 %) among all environmental tests.
In addition, the effect of sample thickness on the electrical properties for thin IMC layers (Cu6Sn5 and Cu3Sn) formed within lead free solder was investigated by using the in situ resistance measurement equipped in TEM, along with treated samples ion milled through precision etching and Selected Area Diffusion Pattern (SADP) technique. It is demonstrated that the SEM/TEM combined with 4pp method display the capability to measure straight resistivity in tiny areas of the IMC layer. This advanced technique provides the receptivity information of solder joint material in the assembly technology.

Contents
List of Tables............................................................................................ IV
Figures Caption....................................................................................... VI
Abstract.................................................................................................... XIV
Chapter I Introduction............................................................................ 1
1.1 Background................................................................................... 1
1.2 Motivations and Goals in This Study............................................ 2
1.2.1 Electrical Characteristics for Sn-Ag-Cu Solder Bump
with Ti/Ni(V)/Cu Under-Bump-Metallization after
Temperature Cycling Tests…………………………….... 3
1.2.2 Extensive Electrical Measurement in Lead-Free Solder
Assembly after Environmental Tests by SEM Internal
Probing Technique……………………………................. 3
1.2.3 Electrical Measurement with Four Points Probes for
Sn-Ag-Cu Solder Joints after Various Environment
Tests……………………………....................................... 4
1.2.4 In situ electrical measurements and manipulation of IMC
layer in lead free solder balls by high-resolution
transmission electron microscopy (HR-TEM).................. 5
Chapter II Literature Review................................................................. 6
2.1 Electronic Package....................................................................... 6
2.2 Flip Chip Technology................................................................... 6
2.3 Solder Bump................................................................................. 7
2.3.1 Solder Materials.................................................................. 7
2.3.2 SnPb Solder......................................................................... 8
2.3.3 Lead-Free Solder................................................................. 10
2.4 Under Bump Metallization........................................................... 11
2.4.1 Cu-Based UBM.................................................................. 11
2.4.2 Ni-Based UBM................................................................... 12
2.4.2.1 Electroplated Ni........................................................ 12
2.4.2.2 Electroless Ni-P (EN)............................................... 12
2.4.2.3 Sputtered Ni(V)......................................................... 13
2.5 Metallurgical Reactions in Solder Joints...................................... 13
2.5.1 Metallurgical Reactions between Solders and Cu-Based
UBM................................................................................... 14
2.5.2 Metallurgical Reactions between Solders and Ni-Based
UBM................................................................................... 14
2.6 Electrical Measurements of Solders …………………………… 17
2.7 Electrical and Mechanical Measurements of Pb-Free Solders 18
After Wave Soldering…………………………………………..
2.8 Conventional 4pp Basics and Theory…………………………... 19
2.9 Reduction of positional errors in a four-point probe resistance 20
Measurement……………………………………………………
Chapter III Experimental Procedure.................................................... 48
3.1 Fabrication of Joints and Environmental Treatment.................... 48
3.1.1 Lead Free FC-BGA Specimens……………….................. 48
3.1.2 Environmental Tests for Sn-3.5Ag-0.5Cu lead-free
solder……………………………………………………... 48
3.2 Sample Preparation....................................................................... 49
3.2.1 The sample preparation of cross-sectional observation
for EPMA………………………………………………... 49
3.2.2 The sample preparation of cross-sectional sample for
Electrical Measurement 50
3.3 Characterization and Analysis....................................................... 51
3.3.1 Microstructure Evolution.................................................... 51
3.3.2 Composition Analysis......................................................... 52
3.3.3 Electrical Analysis and Test…………………………….... 52
Chapter IV Results and Discussion…………………………………… 67
4.1 Electrical measurement between the Sn-3.5Ag-0.5Cu solder
and Ti/Ni(V)/Cu Under-Bump-Metallization after Temperature
Cycling Tests (TCT)…………………………………………….. 67
4.2 Extensive Electrical Measurement in Lead-Free Solder
Assembly after Environmental Tests by SEM Internal Probing
Technique……………................................................................... 83
4.3 Electrical Measurement with Four Points Probes for Sn-Ag-Cu
Solder Joints after Various Environment Tests (Temperature
Cycling Tests (TCT) from 0 cycles to 1000 cycles, High
Temperature Storage Tests (HTST) from 500 to 2000 hrs and
HAST.)…………………………………………………………... 95
4.4 In situ electrical measurements and manipulation of IMC layer
in lead free solder balls by high-resolution transmission electron
microscopy (HR-TEM)………………………………………….. 112
Chapter V Conclusions………………………………………………… 132
References……………………………………………………………….. 135
個人簡歷………………………………………………………………… 147
自傳............................................................................................................ 148
Publication Lists………………………………………………………... 150
Appendix A : Local resistance measurements via four points probe
(4pp) method in eutectic solder assembly after
temperature cycling test by SEM Internal probing
technique……………....……………………………….... 151
Appendix B : Decapsulation Method for Flip Chip with Ceramics
in Microelectronic Package…………………………….. 177

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