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研究生:施政宏
研究生(外文):Cheng-Hung Shih
論文名稱:差模傳輸線在LPC-EBG結構上SI和EMI的影響
論文名稱(外文):The Effects on SI and EMI for Differential Coupled Microstrip Lines over LPC-EBG Power/Ground Planes
指導教授:吳宗霖吳宗霖引用關係
指導教授(外文):Tzong-Lin Wu
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:電信工程學研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2008
畢業學年度:97
語文別:中文
論文頁數:71
中文關鍵詞:低週期型共平面電磁能隙信號品質電磁輻
外文關鍵詞:low-period coplanar electromagnetic bandgapLPC-EBGsignal integritySIelectromagnetic interferenceEMI
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  • 被引用被引用:2
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在電源與接地面間加去耦合電容抑制接地彈跳雜訊為一般常見的作法,但往往侷限於電容本身接腳的電感性,使電容在GHz以上便失去抑制的效果,而電磁能隙結構是一種被提出用來抑制高頻接地彈跳雜訊新的方法。
電磁能隙結構主要是利用週期性結構所產生的禁止頻帶抑制雜訊,而週期性結構使的參考平面不在是一個完整平面,平面上因為槽線,產生信號完整性和電磁相容的問題。由於差模信號具備有低雜訊產生與抑制共模雜訊的能力,本論文中將利用差模信號佈局在LPC-EBG結構上,探討耦合係數的影響,及適當位置的差模信號佈局,達到抑制高頻接地彈跳雜訊,並降低因槽線所引發信號完整性和電磁相容的問題。
Adding decoupling capacitors between the power and ground planes is a typical way to suppress the ground bounce noise(GBN). However, they are not effective at the higher frequency than GHz due to their inherent lead inductance. In recent, a new method for eliminating the GBN at higher frequency is proposed by electromagnetic bandgap structure.
To make use of period structure main of EBG, it produces the stopband to suppress the noise. But the reference plane of period structure is not a solid plane, it produces problems on Signal Integrity (SI) and Electromagnetic Compatibility (EMC) because of the slot of the plane. The differential signals have ability on producing low noise and suppressing common noise. In this paper, we discuss the influence of differential coupling coefficient and appropriate layout to design differential signals. Accomplish the purpose of eliminating the GBN at higher frequency, and reduce the Signal Integrity and Electromagnetic Compatibility from the slot of LPC-EBG structure.
目錄

中文摘要 I
英文摘要 II
目錄 III
圖目錄 V
表目錄 IX
第一章 簡介 1
1.1 研究背景與動機﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒1
1.2 文獻回顧﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒4
1.3 論文大綱﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒4

第二章 差模傳輸線佈局在LPC-EBG結構之設計概念 5
2.1 LPC-EBG抑制接地雜訊﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 5
2.1.1 LPC-EBG應用簡介﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 5
2.1.2電磁能隙結構抑制雜訊的原理﹒﹒﹒﹒﹒﹒﹒﹒ 6
2.2 傳輸線跨槽線不連續之分析與探討﹒﹒﹒﹒﹒﹒﹒﹒﹒10
2.2.1單根傳輸線跨槽線的影響﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 11
2.2.2差模傳輸線跨槽線的影響﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 13
2.3 奇模與偶模傳輸原理﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒15
2.4 混合模態散射參數轉換﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒18

第三章 差模傳輸線跨電磁能隙結構槽線之信號完整性分析 21
3.1 差模傳輸線跨電磁能隙結構槽線電路架構﹒﹒﹒﹒﹒﹒23
3.2 混合模態散射參數特性分析﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒24
3.2.1實驗設備及環境﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 24
3.2.2混合模態散射參數模擬與量測驗證析﹒﹒﹒﹒﹒ 26
3.3 特性阻抗特性分析﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒31
3.4 眼圖特性分析﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒35
3.4.1實驗設備及環境﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 35
3.4.1眼圖量測分析﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 36

第四章 差模傳輸線在電磁能隙結構之電磁輻射的效應 40
4.1 混合模態散射參數與電磁輻射的關連性探討﹒﹒﹒﹒﹒40
4.1.1利用混合模態散射參數分析電磁輻射﹒﹒﹒﹒﹒ 40
4.1.2混合模態散射參數與電磁輻射模擬比較﹒﹒﹒﹒ 42
4.2 電磁輻射驗證分析﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒50
4.2.1實驗設備及環境﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 50
4.2.2電磁輻射模擬與量測驗證分析﹒﹒﹒﹒﹒﹒﹒﹒ 55

第五章 差動傳輸線佈局在LPC-EBG結構設計建議 59
5.1 結構的影響﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 59
5.2 耦合係數的影響﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒61
5.3 參考平面的影響﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒63

第六章 結論 68

參考文獻 69
圖目錄

圖1.1 CMOS邏輯閘輸出端電路的等效電路圖﹒﹒﹒﹒﹒﹒﹒﹒2

圖2.1 LPC-EBG電源平面示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 5
圖2.2 LPC-EBG結構圖(a)實際結構示意簡圖 (b)正方形基本單元的四個參數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 6
圖2.3 LPC-EBG實際製作圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 7
圖2.4 LPC-EBG與相同尺寸的裸板量測與2D-TL模擬結果﹒﹒﹒7
圖2.5 LPC-EBG等效模型﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 8
圖2.6 等效電容C與等效電感L並聯示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒8
圖2.7 多層電路板信號走線跨槽線示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒10
圖2.8 單根傳輸線跨槽線結構圖(a)立體圖 (b)平面圖﹒﹒﹒ 11
圖2.9 單根傳輸線跨越槽線之信號完整性分析(a)反射係數 (b)穿透係數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒12
圖2.10 差模傳輸線跨槽線結構圖(a)立體圖 (b)平面圖﹒﹒﹒ 14
圖2.11 微帶線電場場型(a)奇模態 (b)偶模態﹒﹒﹒﹒﹒﹒﹒ 15
圖2.12 微帶線磁場場型(a)奇模態 (b)偶模態﹒﹒﹒﹒﹒﹒﹒ 16
圖2.13 傳輸線對稱之等效電路(a)奇模態 (b)偶模態﹒﹒﹒﹒ 16
圖2.14 奇模阻抗與偶模阻抗﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒18
圖2.15 四埠網路系統﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒19
圖2.16 雙埠網路系統﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒19
圖3.1 (a)高頻電路板佈局圖 (b) LPC-EBG結構電源平面示意圖(c)高頻電路版結合LPC-EBG結構電源平面示意圖﹒﹒﹒﹒﹒﹒﹒ 22
圖3.2 差模傳輸線跨LPC-EBG不同位置設計結構(a)Case A (b)Case B (c)Case C (d)Case D﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 24
圖3.3 混合模態散射參數量測示意圖(a)量測儀器 (b)側視圖 25
圖3.4 差模信號插入損失Sd2d1 模擬結果﹒﹒﹒﹒﹒﹒﹒﹒﹒27
圖3.5 差模信號反射損失Sd1d1 模擬結果﹒﹒﹒﹒﹒﹒﹒﹒﹒27
圖3.6 Case B_down插入損失Sd2d1量測結果﹒﹒﹒﹒﹒﹒﹒﹒28
圖3.7 Case B_down反射損失Sd1d1量測結果﹒﹒﹒﹒﹒﹒﹒﹒28
圖3.8 Case D_down插入損失Sd2d1量測結果﹒﹒﹒﹒﹒﹒﹒﹒29
圖3.9 Case D_down反射損失Sd1d1量測結果﹒﹒﹒﹒﹒﹒﹒﹒29
圖3.10 Case B_down插入損失(Sd2d1 Sc2c1 )模擬結果﹒﹒﹒ 30
圖3.11 Case B_down反射損失Sc2c1 量測結果﹒﹒﹒﹒﹒﹒﹒ 30
圖3.12 (a)TDR模擬比較圖(b) TDT模擬比較圖﹒﹒﹒﹒﹒﹒﹒ 31
圖3.13 完整平面與LPC-EBG測試結構圖(a)Case B_down (b)Case D_down﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 32
圖3.14 Case B_down完整平面與LPC-EBG TDR模擬比較圖(a)TDR (b) TDT﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒33
圖3.15 Case D_down完整平面與LPC-EBG TDR模擬比較圖(a)TDR (b) TDT﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒34
圖3.16 眼圖量測儀器圖(a)高頻脈衝訊號產生器 (b)寬頻數位示波器﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 35
圖3.17 同軸線差模信號眼圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒36
圖3.18 Case B_down差模信號眼圖(a)完整平面 (b) LPC-EBG﹒37
圖3.19 Case D_down差模信號眼圖(a)完整平面 (b) LPC-EBG﹒38

圖4.1 差模輸入源,不同結構的EMI比較示意圖﹒﹒﹒﹒﹒﹒ 43
圖4.2 共模輸入源,不同結構的EMI比較示意圖﹒﹒﹒﹒﹒﹒ 43
圖4.3 差模輸入源,混合模態散射參數的比較示意圖(a)Case A_down (b)Case B_down (c)Case C_down(d)Case D_down﹒﹒﹒ 44
圖4.4 差模輸入源,Case A_down耦合係數強弱的EMI比較示意﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒47
圖4.5 共模輸入源,Case A_down耦合係數強弱的EMI比較示意圖
﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒47
圖4.6 差模輸入源,Case D_down耦合係數強弱的EMI比較示意圖
﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ ﹒48
圖4.7 共模輸入源,Case D_down耦合係數強弱的EMI比較示意圖
﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ ﹒﹒48
圖4.8 差模輸入源,不同佈局結構的EMI比較示意圖(a)Case A
_down/ Case B_down (b) Case A_down/ Case C_down(c) Case A_down/ Case D_down﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒49
圖4.9 開放空間測試場地(OATS) ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 51
圖4.10 3M量測距離之全電波暗室(anechoic chamber) ﹒﹒﹒ 51
圖4.11 橫電磁波傳輸室(TEM Cell) ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 52
圖4.12 GHz橫電磁波傳輸室(GTEM Cell)(a)外觀結構圖 (b)量測示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 52
圖4.13 待測物三維旋轉示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒53
圖4.14 GTEM電磁輻射測試系統示意圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒54
圖4.15 型終端接匹配﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 55
圖4.16 傳輸線實際截面切片圖﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒56
圖4.17 Case B_down遠場輻射量測圖(a)完整平面板 (b) LPC-EBG結構板﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 56
圖4.18 Case D_down遠場輻射量測圖(a)完整平面板 (b) LPC-EBG結構板﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 57

圖5.1 差模輸入源,不同佈局結構的電場輻射﹒﹒﹒﹒﹒﹒﹒60
圖5.2 共模輸入源,不同佈局結構的電場輻射﹒﹒﹒﹒﹒﹒﹒60
圖5.3 差模輸入源,不同耦合係數的電場輻射﹒﹒﹒﹒﹒﹒﹒62
圖5.4 共模輸入源,不同耦合係數的電場輻射﹒﹒﹒﹒﹒﹒﹒62
圖5.5 差模輸入源,不同參考平面的電場輻射(a)CaseA_down/
Case B_down (b)CaseA_down/Case C_down (c)CaseA_down/
CaseD_down﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒63
圖5.6 共模輸入源,不同參考平面的電場輻射(a)CaseA_down/
Case B_down (b)CaseA_down/Case C_down (c)CaseA_down/
CaseD_down﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒65

表目錄

表3.1 差模傳輸線設計之各項參數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒23
表3.2 Case B_down眼圖量測參數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 36
表3.3 Case D_down眼圖量測參數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 38
表4.1 混合模態散射量測參數﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 44
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