在半導體業中成本競爭力是最主要的研發驅動力。單顆的晶片製程成本是直接與它的尺寸成比例的。先進的製程科技縮了小晶片尺寸致使線路活動區縮減，因此銲墊旁的可用區域相對的縮小，而又因在鋁墊下方的區域未完全運用，那是因為在銲線會有之電性傳導失敗之可靠度考量的問題。
最近許多研究企圖想改善並使用鋁墊下方之空間，因而修改線路之設計之規則，鋁墊下有電路(Circuit Under Pad, CUP)元件結構被發展出來，且需求大量的驗證工作來符合可靠度水準。
CUP元件結構最主要的用意是增加每片晶圓當中的產能，其中有一些是為了線路的安排及測試所特殊設計致使線路跨過鋁墊下。
本論文是針對CUP 元件結構以實際封裝生產所引發之銲線製程缺點，以銲線製程中所能改善之參數、銲針，及晶圓供應商所提供之晶圓差異，利用實驗計畫等工程手法作驗證分析，改善CUP元件結構在銲線站之缺點，提升封裝良率。

Cost competitiveness is a major driving force in the semiconductor industry. The processing cost of an individual die is directly proportional to its size. Advances in processing technology have shrunk the device sizes in wire-bonded chips resulting in a smaller die core size. However the space below wire-bond pads remains relatively underutilized because of the reliability concern that electrical load transmitted during bonding can cause failures in the underlying devices. Recently studies have attempted to improve the use of space below wire-bond pads. Hence the circuits under pads (CUP) structure modified layout rules to include circuits structure under pads was developed and extensive qualification work is required to meet reliability standards.
The main purpose of this paper is to investigate the damage caused by the wire bonding process of CUP devices on the in-line assembly packaging manufacture. The root cause of wire bonding failures analyzed was based on the CUP structure and several wire bond parameters; such as bonding force ultrasonic current bonding time period capillary type machine and wafer source that were also confirmed with the experiment plan of engineering technique. Finally results were also used to implement the corrective action and the assembly yield of CUP Device has been improved successfully.

中文摘要......................................................................I
英文摘.......................................................................II
誌謝 .......................................................................III
目錄.........................................................................IV
附表目錄 ..................................................................VII
附圖目錄 ..................................................................VIII

第一章 序論 ...............................................................1
1-1 封裝製程之區分 ........................................................1
1-2 釘架產品封裝製程簡易說明...............................................2
1-3 CUP元件結構之發展由來及介紹 ……….....................................4
1-4 研究動機 ..............................................................4
第二章 理論基礎.......................................................…..12
2-1 銲線原理 .............................................................12
2-2 銲針介紹 .............................................................13
2-3 拉力原理 .............................................................14.
2-3-1斷球頸時之拉力原理 ..................................................14
2-3-2 弧高與拉力強度之關係 ...............................................14
2-4 推球原理 .............................................................15
2-5 彈坑實驗 .............................................................15
2-6 開/短路測試的原理 ....................................................16
2-7 可靠度測試 ….........................................................17
2-7-1 前處理實驗 .........................................................18
2-7-2 可靠度實驗 .........................................................18
第三章 實驗方法與步驟 ....................................................32
3-1 實驗規劃 .........................................................…..32
3-2 實驗材料與設備......................................................…32
3-3 量測儀器 .............................................................33
3-4 實驗操作步驟 .........................................................34
第四章 結果與討論 ........................................................40
4-1 實驗結果分析..........................................................40
4-2 實驗結果驗證 .......................................................…41
4-3 主要因子分析與比較 .................................................…42
第五章 結論與未來展望 .............................................….....50
5-1 結論 ...............................................................…50
5-2 未來展望 ....................................................…….…..50
參考文獻 ...............................................................…53

附表目錄

頁次
表2-1 銲針各部名稱........................................................................20
表3-1 KS-8028參數實驗組 ...………………………............……....….......35
表3-2 KS-Maxum參數實驗 ...……………………….................……….......35
表3-3 機台差異驗證計劃.......................................……….......36
表3-4 414FD-2240與SPT-30ZA銲針外部尺寸比較表 ……….…....................36
表3-5 銲針差異實驗計劃 ...............................................……37
表4-1 KS-8028銲線機台實驗結果 ............................................45
表4-2 KS-Maxum銲線機台實驗結果 .........................................…45
表4-3 銲針差異實驗結果 ..........................................….…....46
表4-4 銲線機台差異實驗結果 .......................................………..46
表4-5 銲針差異開/短路測試驗證結果 ...............…….....................47
表4-6 KS-8028與KS-Maxum之差異 .........................…...........…....47

附圖目錄

頁次
圖1-1裝技術層級區分 .............................................….......6
圖1-2封裝製程流程圖 .............................................….......6
圖1-3晶背研磨裝置圖 ............................................…........7
圖1-4晶圓切割裝置圖 ...............................................….....7
圖1-5黏晶片側視圖 ..................................................…....8
圖1-6銲線流程圖 ....................................................…....8
圖1-7模封膠流程圖 ................................................…......9
圖1-8晶圓製程之發展 ..............................................…......9
圖1-9 CUP元件結構之剖面側視圖 ...........................................10
圖1-10 CUP元件結構與非CUP元件結構晶片尺寸之比較圖........................10
圖1-11 CUP元件結構與非CUP元件結構之鋁墊剖視圖 .....................…....11
圖1-12 CUP元件結構主要之缺點圖 ..........................................11
圖2-1為第一銲點及第二圖銲點之接合位置圖 .................................21
圖2-2銲線溫度之作用 .....................................................21
圖2-3為原子擴散穿過接觸的介面關係圖 .................................... 22
圖2-4 超音波振幅與時間關係圖 ............................................22
圖2-5 銲針之輪廓結構圖 ...............................................….23
圖2-6 孔徑與金線關係圖 ................................................…23
圖2-7 金線在孔徑內之進給關係圖 .......................................….24
圖2-8 銲針外徑與金球關係圖 ...........................................….24
圖2-9 金球在銲針外徑的中心位置偏移 ...................................….25
圖2-10 內槽角度(CA)與燒球直徑(MBD)之關係圖 .........................…...25
圖2-11銲針尖端外徑(T)與第二銲點形狀的關係圖 ........................…...26
圖2-12 銲針剖面圖(OR與 FA) .......................................….....26
圖2-13 銲線角度關係圖 ..........................................….......27
圖2-14 拉力時之分力及力矩關係圖 .................................…......27
圖2-15弧高與拉力強度之關係 .......................................….....28
圖2-16推球時之推刀與金球位置關係圖 ...............................….....28
圖2-17彈坑測試失敗之現象 .........................................….....29
圖2-18鋁墊腐蝕過程因金線張力造成彈坑 ………………………..................29
圖2-19探針印造成鋁墊崩裂 .....................………..............….....30
圖2-20可靠度測試流程圖 ...........................................….....31
圖3-1銲線機台KS-8028(a)、Maxum(b) .................................…...38
圖3-2.推球機 DAGE BT 2000 .................................…............38
圖3-3 拉力機 DAGE BT 14 .....................................…..........39
圖3-4 拉力破壞模式 ..................................................…..39
圖4-1 拉力缺鋁現象 ....................................................…48
圖4-2 最佳參數分析 ....................................................…48
圖4-3 最佳參數分析結果 ................................................…49
圖4-4 銲針外徑(CD)與孔徑(H)的關係圖 ………………..……….................49
圖5-1金屬層破裂與橫切圖 ………………….................................…52
圖5-2 共晶成長與孔洞之比較 ............................................…52

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