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研究生:李佳霖
研究生(外文):Jia-Lin Li
論文名稱:螢光薄膜型白光發光二極體晶粒之光電特性分析
論文名稱(外文):The optoelectronic analysis white LED chip applied by yellow phosphor film
指導教授:李晉東黃建盛黃建盛引用關係
指導教授(外文):Tsin-Dong LeeChien-Sheng Huang
學位類別:碩士
校院名稱:國立雲林科技大學
系所名稱:光學電子工程研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:中文
論文頁數:84
中文關鍵詞:白光發光二極體釔鋁石榴石螢光粉
外文關鍵詞:white LEDyttrium aluminum garnet (YAG) phosphor
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1996年日本日亞化學公司發展出以發黃光系列之釔鋁石榴石(YAG)螢光粉配合藍光發光二極體可做為高效率之白光光源,至此開啓白光LED應用於照明之時代。白光LED為最被看好之LED新興產品,其在照明市場之發展潛力值得期待。與白熾鎢絲燈泡及日光燈相比,LED具有體積小、發熱量低、耗電量小(白熾燈泡之八分之一,日光燈之二分之一)、壽命長(十萬小時,日光燈之十倍)、反應速度快、環保、可平面封裝與易開發成輕薄短小之產品等優點。
  本論文主要是探討螢光薄膜型白光發光二極體晶粒的光電特性,製成白光二極體的方法則採用“藍光發光二極體+釔鋁石榴石(YAG)螢光粉”;其與一般傳統之白光發光二極體最大的差別是,傳統的白光二極體製作方式為將完成製成的藍光發光二極體晶粒在封支架時,直接用螢光膠取代一般的透明膠材注入藍光發光二極體,然後高溫固化;而本論文則是於完成製成的藍光發光二極體背面塗佈一層螢光層,相較於一般傳統的白光發光二極體,其優點有:螢光層分佈均勻較佳、成本較低、較省時間,可以大批生產、增加光取出效率,並提高發光效率。論文中並討論該製程結講於不同晶粒尺寸、螢光層厚度及不同膠材下,對各種光電特性的影響。
In 1996, Nichia Chemical Company in Japan developed yttrium aluminum garnet (YAG) phosphor which can emit yellow fluorescence by blue light excitation, This technology also can lead to high-efficiency white light. White LED is a new product in illumination field and its marketing potential is also highly expected. In comparison with bulbs and fluorescent lamps, white LED has some advantages, such like smaller volume, low heat generation, lower operating power, longer lifetime, higher response speed and lower environmental impact.
  In my thesis, optoelectronic analysis of white LED chip applied by yellow phosphor film will be discussed. There are two components making up for white LED. The largest different design of new structure in our study is to coat a yellow phosphor thin film on the back of blue LED. Comparing to conventional white LED which is casted phosphor epoxy on the LED lead frame, our white LED has some advantages, such as the phosphor layer is uniform, lower cost, convenient process and higher radiant efficiency. And in our study, optoelectronic properties of our new white chip structure design such like different chip sizes, different thickness of phosphor layer, different glue will be discussed.
中文摘要 ---------------------------------------------------------------------i
英文摘要 --------------------------------------------------------------------ii
誌謝 -------------------------------------------------------------------iii
目錄 --------------------------------------------------------------------iv
表目錄 --------------------------------------------------------------------vi
圖目錄 -------------------------------------------------------------------vii
第一章 緒論-----------------------------------------------------------------1
第二章 文獻回顧-------------------------------------------------------------2
2-1 氮化鎵發光二極體製程簡介---------------------------------------------2
2-2 LED晶粒製程說明------------------------------------------------------4
2-2-1 常用製程技術簡介-----------------------------------------------------5
2-2-2 晶粒前段製程---------------------------------------------------------9
2-2-3 晶粒後段製程--------------------------------------------------------18
2-2-4 晶粒檢驗方法--------------------------------------------------------25
2-3 白光發光二極體及螢光材料介紹----------------------------------------26
2-3-1 固態發光材料之發光原理及其特性--------------------------------------26
2-3-2 螢光粉種類概述------------------------------------------------------37
2-3-3 釔鋁石榴石型螢光粉之介紹--------------------------------------------37
2-4 光源及照明術語------------------------------------------------------40
2-4-1 光源術語------------------------------------------------------------40
2-4-2 照明術語------------------------------------------------------------43
第三章 研究動機與元件製作--------------------------------------------------45
3-1 研究動機------------------------------------------------------------45
3-2 元件製作------------------------------------------------------------45
3-3 發光二極體晶片的製作------------------------------------------------45
3-4 白光發光二極體晶粒的製作--------------------------------------------48
3-5 儀器介紹------------------------------------------------------------49
3-5-1 鎢絲式掃描式電子顯微鏡----------------------------------------------49
3-5-2 光束角(Beam Angle)--------------------------------------------------49
3-5-3 積分球--------------------------------------------------------------49
第四章 結果與討論----------------------------------------------------------54
4-1 Device1晶粒特性分析-------------------------------------------------55
4-2 Device2晶粒特性分析-------------------------------------------------58
4-3 Device3晶粒特性分析-------------------------------------------------61
4-4 Device4晶粒特性分析-------------------------------------------------65
第五章 結論與未來展望------------------------------------------------------68
5-1 結論----------------------------------------------------------------68
5-2 未來展望------------------------------------------------------------70
參考文獻 --------------------------------------------------------------------71
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