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研究生:陳建龍
研究生(外文):Chien-Lung Chen
論文名稱:利用模糊控制來保護探針卡及延長其壽命
論文名稱(外文):Protection and Lifetime Extension of Probe Card Using Fuzzy Control
指導教授:林志民林志民引用關係
指導教授(外文):Chih-Min Lin
學位類別:碩士
校院名稱:元智大學
系所名稱:電機工程學系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2009
畢業學年度:97
語文別:英文
論文頁數:48
中文關鍵詞:模糊控制探針卡
外文關鍵詞:fuzzy theoremprobe card
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在記憶體晶片測試的過程中,需要有一個介面來連結測試機台與晶片,此介面設備我們稱為探針卡。由於此探針卡價值不菲,所以本論文之主旨在於利用模糊控制理論,在不影響測試結果的前提下,制定一套晶圓測試生產前的設定規則來保護此探針卡設備。
由於在一般的測試情況下,環氧樹脂探針卡的壽命是取決於針尖至轉彎處之間的針臂長度,所以此論文使用模糊理論,利用製程的前後順序以及溫度的熱漲冷縮效應做為模糊輸入,模糊輸出為控制探針卡於針測行程下的針尖在鋁墊上所刮出的針痕大小,以減少鋁墊上的鋁削附著於針尖上,除了避免影響測試品質外,也減少探針卡送維修及降低磨針的頻率,進而降低損耗針臂長度,增長探針卡的壽命。另一方面,藉由減少探針卡送修的頻率衍生到效益評估可看出,確實降低了晶圓測試廠的測試成本以及增加產能。
During the process of chip probing (CP), there should be an interface to communicate between the tester and the wafer, that is, the probe card. Probe cards are very expensive. The purpose of this thesis is to try to make a setup rule in the beginning of testing to protect the probe card and extend its lifetime. Of course, the rule cannot let the testing result overkill as a prerequisite. In the normal situation, the lifetime of the epoxy probe card depends on the needle length between the needle tip and the bent position. This thesis employs the procedure and temperature using the fuzzy membership function to control the size of probe mark on the pad to decrease aluminum trifles adhering to the needlepoint; this will affect testing quality and yield. Therefore, we can decrease the frequency of maintenance and damage to the needle tip to achieve the purpose of protection and increase in probe card lifetime. This will reduce the testing cost and increase the productivity of wafer products.
書頁名 i
論文口試委員審定書 ii
摘 要 iii
ABSTRACT iv
誌 謝 v
Contents vi
List of Figures viii
List of Table xi
Nomenclature xii
Chapter 1 Introduction 1
1.1 General remark 1
1.2 The flowchart and method of research 3
1.3 Organization of the thesis 5
Chapter 2 Sketch of Probe Card 6
2.1 What is a probe card? 6
2.2 Classification of probe card 8
2.2.1 Epoxy type probe card 9
2.2.2 Blade type probe card 13
2.2.3 Cobra type probe card 14
2.2.4 VCPC type probe card 15
2.2.5 MEMS type probe card 17
2.3 Lifetime analysis 18
Chapter 3 Wafer Testing 22
3.1 Introduction of wafer 22
3.2 Architecture of wafer sort 23
3.3 Wafer testing procedure 26
3.4 Probe mark 28
Chapter 4 Probe Mark Control Using Fuzzy Theorem 32
4.1 Fuzzy theorem 32
4.2 Fuzzy controller 33
4.2.1 Fuzzification 34
4.2.2 Fuzzy rule table 34
4.2.3 Fuzzy inference engine 35
4.2.4 Defuzzification 35
4.3 Fuzzy controller design 36
Chapter 5 Experiment and Result 41
5.1 MTBF 41
5.2 Benefit estimate 45
Chapter 6 Conclusions 46
Reference 47
Reference
[1] Chenn-Jung Huang, Chi-Feng Wu and Chua-Chin Wang, “Image Processing Techniques for Wafer Defect Cluster Identification” IEEE Trans. Design & Test of Computers, vol. 19, no. 2, pp. 44-48, 2002.
[2] Shin-Yeu Lin and Shih-Cheng Horng, “Application of an Ordinal Optimization Algorithm to the Wafer Testing Process” IEEE Trans. Systems, Man and Cybernetics, Part A, vol. 36, no. 6, pp. 1229 – 1234, 2006.
[3] De-Shin Liu, Meng-Kae Shih, and Fang-Mao Zheng, “An Investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multiprobing Process” IEEE Trans. Components and Packaging Technologies, vol. 31, no. 1, pp. 196 – 203, 2008.
[4] Kenichi Kataoka, Toshihiro Itoh and Tadatomo Suga, “Characterization of fritting phenomena on AI electrode for Low contact force probe card” IEEE Trans. Components and Packaging Technologies, vol. 26, no. 2, pp. 382-387, 2003.
[5] Hitachi Chemical Corporation Limited. http://www.hitachi-chem.co.jp
[6] 王宏杰, 黃雅如, 蔡居恕, ”積體化碳針卡”, 機械工業雜誌257期.
[7] 施孟鎧, “評估晶圓針測參數的實驗方法與數值分析模型之研究”, 中正大學
機械工程學系博士論文, 2006.
[8] Dennis Bates, “The search for the universal probe card solution” International, Proceedings, Test Conference, pp. 533-538, 1997.
[9] Otto Weeden, “Probe Card Tutorial”, Keithley Instruments, Inc. 2003 in http://www.accuprobe.com.
[10] Burton Drive and Santa Clara, “Cobra Vertical Probe Cards”, svprobe.com
[11] Kulicke and Soffa, “Cobra Vertical Probe Cards” in http://www.knstaiwan.com/prodserv/TEST-DIVISION/Solutions/wafer-test.asp, 2004.
[12] Jem Europe Sarl in http://www.jem-europe.com/VCPC.htm, 2003.
[13] Vertical Contact Probe Card (VCPCTM), Southwest Test Workshop, San Diego in http://www.swtest.org/swtw_library/1997proc/PDF/jem_pm.pdf, 1997.
[14] MEMS and nanotechnology exchange in http://www.memsnet.org/mems/.
[15] Jae-Ha Lee and Byung-Ho Jo Dr, Phicom Corporation, “A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards”, 2003.
[16] Department of production of Winbond Electronics Corporation.
[17] 王文俊, ”認識Fuzzy”, 全華科技圖書公司, 2002.
[18] Shing-Fei Lee; You-Wei Teng and Wen-June Wang, “Highway ramp control via fuzzy logic” The ninth IEEE International Conference on Fuzzy Systems, vol. 1, pp. 274 – 278, 2000.
[19] 劉士銘, “多層探針之排列設計方法-應用有限元素分析”, 中正大學機械工 程研究所論文, 2005.
[20] 施孟鎧, “晶圓針測參數分析之測試方法與有限元素模擬”, 中正大學機械工 程研究所論文, 2002.
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