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研究生:劉耿廷
研究生(外文):Kent-Ting Liu
論文名稱:聚亞醯胺的黏著劑殘留對QFN封裝影響之研究
論文名稱(外文):The study of the improvement of polyimide adhesive residue on QFN Package
指導教授:歐陽文忠歐陽文忠引用關係
指導教授(外文):W.-C. Ou-Yang
學位類別:碩士
校院名稱:國立高雄應用科技大學
系所名稱:化學工程與材料工程系
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:中文
論文頁數:82
中文關鍵詞:QFN封裝電漿清洗表面殘膠彈性模數熱穩定
外文關鍵詞:QFN (Quad Flat No Lead)
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本論文研究在QFN封裝中的最先進封裝技術,由於體積小,重量輕,製程中電漿清洗可以去除有機物污染物,提高對銲線能力並增加拉力值,在電漿清 洗時間600秒對銲線能力最好,但電漿清洗時間影響熱塑型膠帶造成表面殘膠,在五分鐘內發現效果較佳,時間越久殘膠越嚴重,故本研究提供一個實際有效的參考方向,找出具有熱穩定高之熱塑型膠帶及高彈性模數,有最少之殘膠、好貼合、與QFN封裝體有最好之結合性及可靠度,而且產品外觀正常。
關鍵詞:QFN封裝、電漿清洗、表面殘膠、彈性模數、熱穩定
This research has studied an advanced package type of QFN, the package can work in a small space and light weight. During assembly process, the “plasma clean” could remove most organic contaminants not only to enhance the ability of wire bonding but also increase the yield strength of wire. By the experiment, we have known that in the period less than 600 seconds is optimal for wire bonding in “plasma clean” process; the period of “plasma clean” also influence the thermo-plastic lead to the residue on the surface of tape. The residue is much less in five minutes than the longer period. By this study, we hope to provide an effective reference way to find a stable thermo plastic tape with high elastic modulus (Young’s Modulus) so that performance of QFN package could have the better characteristics of reliability, adhesion ability, less residue and good appearance.


Keywords::QFN (Quad Flat No Lead) ,plasma clean, residue on surface,
elastic modulus, stable thermo
圖目錄

Figure1 QFN (quad flat no-lead package)……………………………………………………1
Figure 1-1 DQFN VS PicoPicoPkg、SSOP, and TSSOP………………………………………2
Figure 1-2 銲線………………………………………………………………………5
Figure 1-2-1 封膠………………………………………………………………………5
Figure 1-2-2 封膠後撕膠………………………………………………………………5
Figure 2-1 封裝製程的技術層級…………………………………………………10
Figure 2-2 外部接腳連接型態 ……………………………………………………12
Figure 2-3 無引腳型塑膠封裝製程介紹…………………………………………13
Figure 2-4 自動晶圓研磨機台……………………………………………………14
Figure 2-4-1 粗磨跟細磨……………………………………………………………14
Figure 2-4-2 研磨程序………………………………………………………………14
Figure 2-4-2 研磨程序晶片撕膠……………………………………………………15
Figure 2-4-3 晶圓安置時序圖………………………………………………………16
Figure 2-4-4 晶圓切割………………………………………………………………17
Figure 2-4-5 晶粒黏示意圖…………………………………………………………18
Figure 2-4-6 銀膠烘烤說明&烘烤溫度曲線…………………………………………19
Figure 2-4-7 烤箱……………………………………………………………………19
Figure 2-4-8 電漿清洗………………………………………………………………20
Figure 2-4-9 電漿清除原理…………………………………………………………20
Figure 2-4-10銲線圖……………………………………………………………………21
Figure 2-4-11自動封膠機台……………………………………………………………22
Figure 2-4-12封膠製程說明:(a)封膠機台(b)封膠時序圖……………………22
Figure 2-4-13油墨正印…………………………………………………………………23
Figure 2-4-14印字製程說明:(a)油墨正印(b)雷射正印………………………24
Figure 2-4-15電鍍製程說明:電鍍前後示意圖………………………………………24
Figure 2-4-16切割成型…………………………………………………………………25
Figure 2-2 半導體浴缸曲線(Bathtub Curve) …………………………………………………………………26
Figure 2-2-2 Precondition 測試流程……………………………………………29
Figure 2-2-3 環境測試流程……………………………………………………………29
Figure 2-2-4半導體封裝常見之裂傷…………………………………………………30
Figure 2-2-5壓力鍋測試示意圖………………………………………………………31
Figure 2-2-6溫溼度測試示意圖………………………………………………………32
Figure 2-2-7溫度循環測試示意圖……………………………………………………32
Figure 3 IC封裝製程常用材料之熱膨脹係數…………………………………………38
Figure 3-1填充劑比例與熱膨脹係數之關係…………………………………………40
Figure 3-2熱塑型膠帶材料組成………………………………………………………40
Figure 3-3低彈性模量與溫度…………………………………………………………42
Figure 3-3-1電漿產生的反應機構……………………………………………………44
Figure 3-3-2電漿清洗方式……………………………………………………………46
Figure 3-3-3 Electron Spectroscopy for Chemical Analysis…………………48
Figure 3-3-3導線架電漿清洗前………………………………………………………49
Figure 3-3-4導線架電漿清洗後………………………………………………………50
Figure4-1-1光探針式自動對焦伺服探頭感測法原理 ………………………………52
Figure 4-1-2中心線平均粗糙度(Ra)求法…………………………………………53
Figure 4-1-3在四十倍下顯微鏡的封模膠餅外觀……………………………………53
Figure 4-1-4在電子顯微鏡二千倍下顯微鏡的外觀…………………………………54
Figure 4-1-5 塑封模膠餅表面粗糙度Ra………………………………………………………………………………54
Figure 4-1-6電漿清洗前導線架金屬表面……………………………………………55
Figure 4-1-7電漿清洗後導線架金屬表面……………………………………………55
Figure 4-1-9熱塑型膠帶黏著劑電漿清洗前數據……………………………………56
Figure 4-1-10 熱塑型膠帶黏著劑電漿清洗後數據…………………………………57
Figure 4-2以五種不同型號的熱塑型膠帶作FTIR分析………………………………58
Figure 4-3熱塑型膠S1之TGA ……………………………………………………………………………………………………60
Figure 4-3-1熱塑型膠帶S2之TGA……………………………………………………………………………………………60
Figure 4-3-2熱塑型膠帶S3之TGA……………………………………………………………………………………………61
Figure 4-3-3 熱塑型膠帶S4之TGA………………………………………………………………………………………61
Figure 4-3-4熱塑型膠帶S5之TGA……………………………………………………………………………………………62
Figure 4-4四十五度角撕離膠帶………………………………………………………63
Figure 4-4-1殘膠量測試………………………………………………………………63
Figure 4-4-2 plasma作業時間與熱塑型膠帶殘膠關係圖…………………………64
Figure 4-4-3表面殘膠…………………………………………………………………64
Figure 4-4-4電漿清洗時間與銲線拉力關係圖………………………………………65
Figure 4-5溫度上昇曲線………………………………………………………………66
Figure 4-5-1少量殘膠銲錫性潤濕較低………………………………………………67
Figure 4-5-2無殘膠銲錫性潤濕較高…………………………………………………67
Figure 4-6 QFN熱分析………………………………………………………………68
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【21】Hitachi RT-tape Materials , R&D Dept.
【22】EIA/JEDEC Standards Solderability Test Method EIA/JESD 22-B102E.
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