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研究生:黃國信
研究生(外文):Guo-Xin Huang
論文名稱:微電流放電加工法之人工牙根表面改質與製作
論文名稱(外文):Surface Modification and Fabrication of Dental Implant by Micro Current Electrical Discharge Machining
指導教授:陳順隆陳順隆引用關係
指導教授(外文):Sung-Long Chen
學位類別:碩士
校院名稱:國立高雄應用科技大學
系所名稱:機械與精密工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:中文
論文頁數:79
中文關鍵詞:放電加工再鑄層牙根植體
外文關鍵詞:Electrical discharge machiningRecast layerDental implant
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微電流放電加工法(micro current-EDM)係利用傳統的放電加工原理,以微小且穩定放電電流能量、高加工精度、去除工件加工部份;是製作形狀複雜之微細元件的有效方法。本研究以純鈦做為牙根材料與電極,放電加工液為去離子水添加純鈦粉末,進行放電加工牙根表面改質與製作。藉由不同放電加工參數;放電電流、脈衝時間、及鈦粉末添加濃度,探討對純鈦片加工後的表面特性,量測水滴接觸角與再鑄層相鑑定來探討其生物相容性。經由SEM觀察表面形貌,當加工液添加之純鈦粉末量增加,表面裂縫密度降低。隨著電流與脈衝時間增加,再鑄層厚度則相對增加。以GI-XRD做相鑑定,得知再鑄層為氧化鈦(TiO)結構,再經由TEM比對證實結果與XRD鑑定相同。放電加工後之再鑄層經表面分析,氧化層為TiO、TiO2及一些鈦的氫氧化物所組成,有助於試片表面親水性,經由水滴接觸角量測,經放電加工後表面親水性佳具潤濕效果。最後以實驗最佳放電加工參數製作人工牙根,且已成功製造出人工牙根植體。
The principle of micro current-EDM (MCEDM) is similar to traditional EDM. It can be utilized to machine the conductive materials with micro current for product the high precision part. MCEDM is an effective method to fabricate fine devices with complex shapes. In this study, used pure titanium as electrode and dental implant, MCEDM fluid is added the titanium powder in deionized water, to improve the surface modification and fabrication the dental implant. By different MCEDM parameters such as, peak current, pulse duration and the added amount of titanium powder were performed to explore the surface characteristics of pure titanium. Then discuss the biocompatibility with water contact angle measurement and recast layer of phase identification. The experimental results show that surface cracks reduce when the more of titanium powder concentration, and the recast layer thickness increase when the peak current and pulse duration increased. According to GI-XRD phase identification, we can found that the recast layer is titanium dioxide structure. After confirmed by TEM, the result is the same as the XRD identification. And found the oxide layer by MCEDM is composed of TiO, TiO2 and titanium hydroxide by surface analysis of the recast layer, and it contributes to the surface hydrophilic. The samples have good wettability performance, measured by water contact angle. Apply the beat experiment parameters fabricate the dental implant successfully.
中文摘要 ------------------------------------------------ I
英文摘要 ------------------------------------------------------- III
目錄 ----------------------------------------------- III
表目錄 ------------------------------------------------ V
圖目錄 ------------------------------------------------ VI
第一章 緒論---------------------------------------------- 1
1.1 研究背景與動機目的---------------------------------- 1
1.2 文獻回顧------------------------------------------- 2
第二章 基礎理論----------------------------------------- 8
2.1 生醫材料------------------------------------------ 8
2.1.1 生醫材料之選擇------------------------------------ 8
2.1.2 生醫材料之分類------------------------------------ 8
2.2 鈦金屬材料及特性---------------------------------- 9
2.3 放電加工------------------------------------------ 11
2.3.1 放電加工原理------------------------------------- 11
2.3.2 放電加工之優缺點--------------------------------- 15
2.3.3 放電加工參數------------------------------------- 16
2.3.4 放電加工之特性----------------------------------- 20
2.3.5 放電加工之表面特徵------------------------------- 21
2.3.6 放電加工表層------------------------------------- 25
第三章 實驗方法---------------------------------------- 27
3.1 實驗流程----------------------------------------- 27
3.2 加工參數設定------------------------------------- 29
3.3 實驗儀器----------------------------------------- 30
3.4 牙根設計圖--------------------------------------- 31
3.5 牙根植體加工機構與電極製備----------------------- 33
3.6 實驗分析儀器------------------------------------- 36
3.6.1 掃瞄式電子顯微鏡(SEM)---------------------------- 36
3.6.2 低掠角X光繞射(GI-XRD)--------------------------- 36
3.6.3 穿透式電子顯微鏡(TEM)---------------------------- 38
3.6.4 X射線電子能譜儀(XPS)----------------------------- 42
3.6.5 水滴接觸角(Contact angle)------------------------- 43
第四章 結果與討論-------------------------------------- 44
4.1 加工特性----------------------------------------- 44
4.1.1 材料去除率與電極消耗率--------------------------- 44
4.1.2 於去離子水中放電加工後之表面形貌----------------- 46
4.1.3 於去離子水添純鈦粉末之放電加工表面形貌----------- 48
4.1.4 再鑄層厚度--------------------------------------- 54
4.2 再鑄層之成份與結構分析--------------------------- 59
4.2.1 XRD相鑑定---------------------------------------- 59
4.2.2 TEM結構分析-------------------------------------- 60
4.2.3 XPS分析------------------------------------------ 67
4.2.4 水滴接觸角量測----------------------------------- 69
第五章 結論-------------------------------------------- 72
參考文獻-------------------------------------------------- 74
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