本論文探討之碳/鋁複合材料之目的即在開發一種高熱傳導率、低膨脹係數和低密度的碳/鋁複合材料。隨著資訊產品效能的提升，散熱難度也愈趨困難，整個電子產業對散熱的需求更形迫切。在所有先進散熱材料中，碳/鋁複合材料由於具有高熱傳導，同時具有比鋁、銅等具有較低的密度與熱膨脹係數，非常具潛力的散熱材料。
具有優越的熱傳導率，同時具有低的密度與熱膨脹係數的散熱材料，是現階段競相開發研究的方向。本文針對幾種不同高性能的碳材料，如1D碳纖維材料、發泡碳材料、鑽石顆粒材料，將鋁材利用較低成本的壓力鑄造成形方式，進行碳/鋁複材成形後的熱物理特性究。
應用壓力滲透製程開發出高體積分率(>60%)的1D碳纖維/鋁複材熱傳導率可達634 W/m•K(纖維方向)，密度在2.2 g/cm3，熱膨脹係數則在7.7μm/moC，碳纖維強化的體積分率介於60%~70%。鑽石/鋁複材熱傳導率可達770 W/m•K(纖維方向)，密度在3.1 g/cm3，熱膨脹係數則在7.2μm/moC。

The purpose of this study is to develop a high thermal dissipation density, low thermal expansion and low density composite for IC component. Along with the trends of increasing performance and reducing size of the electronic devices, thermal dissipation becomes one of the most urgent problem to be solved. This has lead to the requirement of developing a high performance material with high thermal conductivity better than conventional aluminum or copper. One of these high performance materials is a aluminum based carbon (fiber) reinforced composite.
In this study, we discussed the thermal physical properties of several carbon fibers, carbon foam and diamond particles reinforced composites. The result reveals that pressure infiltration fabricated 1D carbon fiber/Al composite has a volume fraction of 60%, a thermal conductivity of 634 W/m•k in fiber direction , a density of 2.2g/cm3 and coefficient thermal expansion (CTE) of 7.74μm/m℃ in fiber direction. Diamond/Al composite has a volume fraction of 57%, a thermal conductivity of 770W/m•k in fiber direction , a density of 3.1g/cm3 and coefficient thermal expansion (CTE) of 7.2μm/m℃ .

中文摘要 ................................................III
英文提要 .................................................IV
誌謝 ......................................................V
目錄 .....................................................VI
圖目錄 .................................................. IX
表目錄 ..................................................XII
第一章 緒論................................................1
　1.1 研究背景.............................................1
1.2 研究動機與目的.......................................2
第二章 文獻回顧............................................4
2.1 碳/鋁複材在電子元件封裝應用..........................4
2.2 熱傳導與熱膨脹之計算.................................7
2.3 碳/鋁複材競爭之材料.................................10
2.3.1 銅、鋁材料......................................10
2.3.2 鎢、鉬材料......................................11
2.3.3 kovar 材料.....................................12
2.3.4 銅/鎢、銅/鉬材料................................12
2.4 含碳之高導熱複材種類................................13
2.4.1 碳/金屬複合材料.................................13
2.4.2 碳/碳複合材料...................................16
2.4.3 鑽石/鋁複合材料.................................18
2.5 碳/鋁複合材料之製作.................................20
2.5.1 真空壓力液相滲透................................20
2.5.2 擠壓鑄造成形....................................21
2.5.3 真空熱壓成型....................................22
2.6 擠壓鑄造液相壓力滲透之理論..........................23
第三章 實驗方法...........................................27
3.1 高熱導材料預形體之製作..............................28
3.1.1 1D碳纖維預形體..................................28
3.1.2 發泡碳預形體....................................29
3.1.3 合成鑽石........................................30
3.2 複材擠壓成形製作....................................31
3.2.1 模具設計........................................32
3.2.2 液相滲透用鋁合金的選用..........................34
3.2.3 模具預熱溫度....................................35
3.2.4 預形體預熱溫度控制..............................35
3.3 密度量測............................................38
3.4 熱膨脹係數量測......................................39
3.5 強度測試............................................40
3.6 熱傳導率量測........................................40
第四章 結果與討論.........................................42
4.1 複材成形參數討論....................................42
4.1.1預形體預熱溫度的影響.............................42
4.1.2 鋁液滲透之壓力和速度控制........................44
4.1.3 擠壓鑄造擠桿壓力和澆鑄溫度......................44
4.1.4 複材成形缺陷分析................................46
4.2 碳/鋁複材組織分析...................................47
4.2.1 1D碳纖維預形體..................................47
4.2.2 發泡碳預形體....................................49
4.2.3 合成鑽石........................................50
4.3 密度量測............................................52
4.4 熱膨脹係數量測......................................54
4.5 強度測試............................................59
4.6 熱傳導率量測........................................60
第五章 結論...............................................67
第六章 未來研究方向.......................................70
參考文獻 .................................................71

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