|
[1] X. Chen, J. Xu, R.M. Wang, and D. Yu, Adv. Mater. 15 (2003) 5. [2] C.B. Cao, X. Xiang, and H. Zhu, J. Cryst. Growth. 273 (2005) 375. [3] T. Kuykendall, P.J. Pauzauskie, Y.F. Zhang, J. Goldberger, D. Sirbuly, J. Denlinger, and P.D. Yang, Nature Materials 3 ( 2004) 524 [4] 施敏 原著,黃調元 譯,“半導體元件物理與製作技術(第二版) ”,交大出版社. (2006) pp.441 [5] S. Strite, M.E. Lin and H. Morkos, Thin Solid Films. 231 (1993) 197. [6] S. Strite, J. Ruan, Z. Li, N. Manning, A. Salvador, H. Chen, D.J. Smith, W.J. Choyke and H. Morkoc, J. Vac. Sci. Technol. B, 9 (1991) 1924 [7] S. Yoshida, S. Misawa, and S. Gonda, Appl. Phys. Lett. 42 (1983) 427. [8] H. Amano, N. Sawaki, I. Akasaki, and Y. Toyoda, Appl. Phys. Lett. 48 (1986) 353 [9] S. Nakamura, T. Mukai, and M. Senoh. J. Appl. Phys. 76 (1994) 15. [10] P. Kung, A. Saxler, X. Zhang, D. Walker, R. Lavado, and M. Razeghi, Appl. Phys. Lett. 69 (1996) 2116. [11] S. Duan, X. Teng, P. Han, and D. Lu, J. Cryst. Growth. 195 (1998) 304. [12] J.J. Lee, Y.S. Park, C.S. Yang, H.S. Kim, K.H. Kim, K.Y. Kang, T.W. Kang, S.H. Park, and J.Y. Lee, J. Cryst. Growth. 213 (2000) 33. [13] C. Klemenz, H.J. Scheel, J. Cryst. Growth. 211 (2000) 62. [14] 楊文福, 國立中山大學材料科學研究所碩士論文, 民國九十八年. [15] M. M.C.Chou, L. Chang, C. Chen, W.F. Yang, C.A. Li, and J.J. Wu, J. Cryst. Growth. 311 (2009) 448. [16] T. Lei, M. Fanciulli, R.J. Molnar, T.D. Moustakas, R.J. Graham, and J. Scanlon, Appl. Phys. Lett.. 59 (1991) 944. [17] T. Ishii, Y. Tazoh, and S. Miyazawa, J. Cryst. Growth. 189 (1998) 208. [18] S. Keller, U.K. Mishra, and S.P. DenBaars, Appl. Phys. Lett.. 73 (1998)10. [19] C. Liua, Z. Xiea, P. Hana, B. Liua, L. Lia, J. Zhoub, S. Zhoub, L.H. Baic, Z.H. Chenc, R. Zhanga and Y. Zhenga, J. Cryst. Growth. 298 (2007) 228. [20] M. Marezio, Acta Cryst. 18 (1965) 481. [21] K. Xu, P.Z. Deng, J. Xu, G.Q. Zhou, W.J. Liu", and Y.L. Tian, J. Cryst. Growth. 216 (2000) 343. [22] S. Nanamatsu, K. Doi, and M. Takahashi, Jpn. J. Appl. Phys. 11 (1972) 816. [23] W.A. Melton, J.I. Pankove, J. Cryst. Growth. 178 (1997)168 [24] J.Lu, L. Haworth, D.I. Westwood, and J.E. Macdonald, J. Appl. Phys. 78 (2001) 1080. [25] H. Lahrèche, M. Leroux, M. Laügt, M. Vaille, B. Beaumont, and P. Gibart, J. Appl. Phys. 87 (2000) 577. [26] D. R. Hang, M. M.C. Chou, L. W. Chang, Y. Dikme, M. Heuken, J. Cryst. Growth 311 (2009) 452. [27] M. M.C. Chou, D. R. Hang, H. Kalisch, R.H. Jansen, Y. Dikme, M. Heuken, and G. P. Yablonskii, J. Appl. Phys. 101 (2007) 103106. [28] T. Ishii, Y. Tazoh and S. Miyazawa, Jpn. J. Appl. Phys. 36 (1997) 139. [29] M. Losurdoa, D. Giuvaa, G. Brunoa, S. Huangb, T. H. Kimc, A. S. Brown, J. Cryst. Growth 264 (2004) 139. [30] A.S. Brown, W.A. Doolittle, S. Kang, J.J. Shen, Z.L. Dai, J. Electronic Materials. 29 (2000) 894. [31] R. Klauser, P.S. Asoka Kumar, T.J. Chuang, Surface Science 402 (1998) 87. [32] Y. Tazoh, T. Ishii and S. Miyazawa, Jpn. J. Appl. Phys. 36 (1997) 746. [33] W. A. Doolittle, S. Kang, T. J. Kropewnicki, S. Stock, P. A. Kohl and A. S. Brown, J. Electronic Materials 27 (1998) L59.
[34] F. Hamdani, A. Botchkarev, W. Kim, H. Morkoc, M. Yeadon, J. M. Gibson, S-C. Y. Tsen, D. Smith, D. C. Reynolds, D. C. Look, K. Evans, C. W. Litton, W. C. Mitchel, and P. Hemenger, Appl. Phys. Lett. 70 (1997) 467. [35] H. Okumura, S. Misawa, and S. Yoshida, Appl. Phys. Lett. 59 (1991) 1058. [36] R.G. Wilson, B.L.H. Chai, S.J. Pearton, C.R. Abernathy, F. Ren, and J.M. Zavada, Appl. Phys. Lett. 69 (1996) 25. [37] A. Kuramata, K. Horino, and K. Domen. FUJITSU Sci. Tech. J. 34 (1998) 191. [38] H. Morkoc, S. Strite, G.B. Gao , M.E. Lin, B. Sverdlov and M. Burns, J. Appl. Phys. 76 (1994) 1363. [39] H. Xiao, Introduction to semiconductor manufacturing technology, Prentice Hall. (2001). [40] D.L. Smith, Thin Films by Chemical Vapor Deposition Principle and Practice. (1995). [41] 莊達人 編著, “VLSI 製造技術” , 高立圖書有限公司. (2006) pp.150-159.
|