(3.239.33.139) 您好!臺灣時間:2021/03/07 23:02
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:劉玴維
研究生(外文):I-Wei Liu
論文名稱:一種能快速計算封裝電源供應系統的電磁干擾之二維時域有限差分法
論文名稱(外文):An Efficient 2D FDTD Method for Computing EMI Due to Power Delivery System of Packages
指導教授:郭志文郭志文引用關係
指導教授(外文):Chih-Wen Kuo
學位類別:碩士
校院名稱:國立中山大學
系所名稱:通訊工程研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:中文
論文頁數:74
中文關鍵詞:時域有限差分法去耦合電容槽孔修正近遠場轉換
外文關鍵詞:Decoupling CapacitorTheory for Slot-correctedNear- to Far-Field TransformationFinite-Difference Time-Domain
相關次數:
  • 被引用被引用:0
  • 點閱點閱:118
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
現今封裝電源供應系統,運作速度以提升到GHz階段,當邏輯閘快速切換時,瞬間的電流變化會經由IC接腳,傳至電源供應系統的動力平面造成電源面電壓波動之現象進而導致電磁輻射(EMI)的問題產生。
在本論文中,將用在二維時域有限差分法的快速方法去分析對封裝電源供應系統裡的電磁輻射效應分為三部分探討。第一部分,利用時域有限在差分法在二維結構計算EMI;第二部分,在時域有限差分法二維結構去探討更複雜的電源供應面結構如EBG的研究;第三部分,把實際上常用的去耦合電容降低EMI的特性加到二維結構的研究。
經由以上的研究,期待能夠建立出快速的方法去計算電磁輻射效應以解決現今比較常用的全波模擬軟體的冗長運算時間,以利工程師能夠更有效率的解決封裝系統的類似問題。

The operation speed of power delivery system of packages has been upgraded to GHz. The instant current will pass to the power plane of the mother board by way of the IC pins and result in electromagnetic wave propagation between the power plane and the ground plane, then to produce the programs of electromagnetic interference.
In this thesis, we will analyze the EMI of power delivery system of packages by finite-difference time-domain in two dimensions structure in three sections. In firist section, to computing EMI in finite-difference time-domain in two dimensions structure. In second section, to analyze more complicated power delivery plane, ex: EBG, in finite-difference time-domain in two dimensions structure. In three section, to add property of capacitors on power plane to reduce EMI in two dimensions structure.
Above all, we hope to built a fast computing method to compute EMI to solve the time-consuming problems of full-wave simulated software. And to supply the engineer to deal with the similar problems in packages efficiently.

目錄
第一章 序論………………………………………………………………………………………………………….1
1.1 研究目的與方法..……..………………………………………………………………………………1
1.2 論文大綱..……………..………………………………………………………………………………….3
第二章 FDTD演算法……………………………………………………………………………………………4
2.1馬克斯威爾方程式………………...……..………...………………………………………………….4
2.2三維方程式.………………………………..…..………………………………….……………………….4
2.2.1中央差分法與Yee網格配置……………………………………………………..………5
2.2.2 邊界條件…………………………………………………………………………………..………8
2.3 二維方程式………………………………………………………………………………………………...9
2.3.1 模態之中央差分法與網格配置………………………………………………..10
2.3.2 TMz模態之邊界條件…………………………………………………………………..….12
2.4 Courant穩定準則…………………………………………………………………………….………...12
2.5集總電路元件…………………………………………………………………………………….….…..13
2.5.1電阻………………………………………………………………………………………………....14
2.5.2阻抗性電壓源……………………………………………………………………………..…..14
2.5.3電感…………………………………………………………………………………………….…...15
2.5.4電容…………………………………………………………………………………………….…...15
2.6程式執行流程……………………………………………………………………………………….…….16
第三章 二維時域近遠場轉換……………………………………………………………………………17
3.1二維時域有限差分法對封裝系統結構的描述…..……………………………………...17
3.1.1利用2D-FDTD模擬電源供應系……………………………………………………..17
3.2近遠場轉換方法…………..………………..……………………………................................19
3.2.1三維時域有限差分法計算空間分……………………..…………………………….19
3.2.2二維時域有限差分法計算遠場分析…………………..……………………………22

第四章 槽孔修正理論與模擬………………………………………………………………….30
4.1二維時域有限差分法狹縫槽孔修正式…………………………………………………….30
4.2電源供應平面開槽孔模擬…………………………………………………………….………...34
4.3電磁能隙結構之模擬…………………………………………………………….………...........40
第五章 去耦合電容數值模擬方法………………………….………………………………………….45
5.1 FDTD單網格的RLC串聯方法………………………………………………………………45
5.2模擬結果…………………………………………………………….………...............................50
第六章 結論………………………………………………………………………………………………………..58
參考文獻……………………………………………………………………………………………………………….60

參考文獻
[1]N. Na, M. Swaminathan, J. Libous, and D. O’Connor, “Modeling and simulation of core switching noise on package and board,” Elec. Comp. and Tech. Conf., pp. 1095-1101, 2001.
[2]J. G. Yook, V. Chandramouli, L.P.B. Katehi, K. A. Sakallah, T.R. Arabi, and T. A. Schreyer, “Computation of switching noise in printed circuit boards,” IEEE. Trans. Comp., Packag., and Manufact., vol. 20, pp.64-75, Mar. 1997.
[3]J. P. Berenger, “A perfectly matched layer for free-space simulation in finite-difference computer codes,” Annals of Telecommunications, 1996.
[4]Y. T. Lo, D. Solomon, and W. F. Richards, “Theory and experiment on microstrip antennas,” IEEE Trans. Antennas Propagat. , vol.27, pp. 137-145, March 1979.
[5]O. M. Ramahi, “Near- and Far-field calculation in FDTD simulations using Kirchhoff Surface Integral Representation,” IEEE Trans. Antennas Propagat., vol. 45, pp.753-759, May. 1997.
[6]S. G. Garcia, B. G. Olmedo, and R. G. Martin, “A time-domain near- to Far-field transformation for FDTD in two dimensions,” Microwave and Optical Technology Letters, vol. 27, No. 6, December. 2000.
[7]T. L. Wu, Y. H. Lin, and S. T. Chen, “ A Novel Power Planes with Low Radiation and Broadband Suppression of Ground Bounce Noise Using Photonic Bandgap Structures,” IEEE Microwave and Wireless Components Letters, Aug. 2004.
[8]J. N. Hwang, and T. L. Wu, “The Bridging Effect of the Isolation Moat on the EMI Caused by Ground Bounce Noise between Power/Ground planes of PCB,” in Proc. of IEEE Int. Symp. On EMC, vol.1 pp. 471-474, 2001.
[9]Y. Xiaoning, M. Y. Koledintseva, L. Min, and J. L. Drewniak, “DC power-bus design using FDTD modeling with dispersive media and surface mount technology components,” IEEE Trans. Electromag. Compat., vol. 43, pp579-587, Nov. 2001.
[10]T. L. Wu, Y. H. Lin, J. N. Hwang, and J. J. Lin, “The effect of test system impedance on measurements of ground bounce in printed circuit boards,” IEEE. Int. Symp. Electromag. Compat., vol. 43, pp. 600-607, Nov. 2001.
[11]K. Yee, “Numerical solution of initial boundary problems in isotropic media,” IEEE Trans. Antennas Propagat. AP-14, 302-307, 1966.
[12]K. Umashankar and A. Taflove, “A novel method to analyze electro-magnetic scattering of complex objects,” IEEE Trans. Electromagn. Compat. , vol. EMC-24, pp397-405, Nov. 1982.
[13]K. S. Yee, D. Ingham, and K. Shlager, “Time domain extra-polation to the far field based on FDTD calculations,” IEEE Trans. Antennas Propagat., vol. 39, pp. 410-413, Mar. 1991.
[14]R. J. Luebbers, K. S. Kunz, M. Schneider, and F. Hunsberger, “A finite-difference time-domain near zone to far zone transformation,” IEEE Trans. Antennas Propagat., vol. 39, pp. 429-433, Apr.1991.
[15]F. Xu, W. Hong, and X. Zhu, “A New Time Domain Near to Far field Transformation for FDTD in Two Dimensions,” Microwave Symposium Digest, IEEE MTT-S International, 2002.
[16]R. J. Luebbers, D. Ryan, and J. Beggs, “A Two-Dimensional Time-Domain Near-Zone to Far-Zone Transformation,” IEEE Trans. Antennas Propagat., vol. 40, no. 7, July , 1992.
[17]Y. H. Lin and T. L. Wu, “Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement,” in Proc. of IEEE Int. Symp. on EMC, vol.1 pp. 319-324, 2001
[18]F. R. Yang, K. P. Ma, and T. Itoh, “A uniplanar compact photonic-bandgap (UC-PBG) structure and its applications for microwave circuit,” IEEE Transactions on Microwave Theory and Techniques, vol.47 ,no. 8, pp. 1509-1514, Aug. 1999.
[19]R. Coccioli, K. P. Ma, and T. Itoh, “Aperture-Coupled Patch Antenna on UC-PBG substrate,” IEEE Transactions on Microwave Theory and Techniques, Vol.47, no. 11, pp. 2123-2130, Nov. 1999.
[20]J. Chen, M. Xu, T. H. Hubing, J. L. Drewniak, T. P. V. Doren, and R. E. Dubroff, “Experimental evaluation of power bus decoupling on a 4-layer printed circuit board,” IEEE Int. Symp. Electromag. Compat, pp. 335-338, 2000.
[21]F. Jun , J. L. Drewniak, N.W. Smith, A. Orlandi, T. P. V. Doren, T.H. Hubing, and R.E. Dubroff, “Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs,” IEEE Trans. Electromag. Compat., vol.43, pp. 588-899, Nov 2001
[22]F. Gisin and Z. P. Tanner, “Edge emissions from a PC board structure,” in Proc. of IEEE Int. Symp. on EMC, pp.1333-1334, 2001
[23]M. Swaminathan and A. E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems. Prentice Hall

QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔