目前市面上半導體產業採用的主流自動光學檢測（Automatic Optical Inspection）法，是為X-射線斷層影像合成法（X-ray computed Tomosynthesis）。比較起其它的影像重建法，X-射線斷層影像合成法有相對簡單、計算量小的優點。但X-射線斷層影像合成法在本質上存在一些缺點，如常見的：採用「位移疊加」（shift & add）而產生的殘影效應（Shadow effect）。而在此研究中將殘影效應分為兩類：1. 「連續體殘影效應」、2. 「遮蔽物殘影效應」。
本研究針對殘影效應使用三種改善的方法。
第一：使用醫學影像處理領域中改善殘影效應的技術：「斷層影像濾波合成法（Ectomography）」。
第二：兼具「位移疊加法（shift-and-add）」及「位移取最大值法（shift-and-maximum）」特性的「整合型斷層影像合成術（Hybrid-tomosynthesis）」。
第三：針對投影取像架構的轉換函數（Transfer function），推導出濾波方程式進行濾波去殘影效應的「逆反濾波法（Inverse filtering）」。
本論文從理論出發，介紹上述三種方法，並電腦模擬實際工業光學檢測環境下的三種去殘影技術的結果，並分析給出使用建議。

Chapter 1 簡介 1
1.1 問題背景與研究動機 1
1.1.1 連續體的殘影效應 1
1.1.2 遮蔽物殘影效應 3
1.2 文獻回顧 6
1.2.1 斷層影像合成法（Tomosynthesis）[3] 6
1.2.2 濾波背投影法（Filtered back-projection）[4] 7
1.2.3 斷層影像濾波合成法（Ectomography）[5][6] 11
1.2.4 平移式x光斷層檢測法之影像分離法[2] 13
1.2.5 逆反濾波法（Inverse filtering） [7] 21
1.3 研究策略與論文架構 24
Chapter 2 斷層影像濾波合成法推展 26
2.1 理論補充[5] 26
2.1.1 三維頻域取樣密度 27
2.1.2 二維頻域取樣密度 30
2.2 適用於非圓軌跡架構之修改 33
2.3 電腦模擬 36
2.3.1 圓形軌跡平行光掃描架構 36
2.3.2 工業光學檢測非圓形掃描架構 39
Chapter 3 整合型斷層影像合成術 41
3.1 最大亮度斷層影像合成術 41
3.2 整合型斷層影像合成術 43
3.3 電腦模擬及實際圖片驗證 46
3.3.1 電腦模擬驗證 46
3.3.2 實際工業檢測圖片驗證 49
Chapter 4 逆反濾波法推展 53
4.1 非圓形軌跡架構下之逆反濾波法 53
4.1.1 非圓形軌跡架構光源分析 54
4.1.2 D1 detector逆反濾波器公式推導 55
4.1.3 D3 detector逆反濾波器公式推導 58
4.2 電腦模擬 60
4.2.1 D1 detector逆反濾波 61
4.2.2 D3 detector逆反濾波 63
4.2.3 模擬結果分析 64
Chapter 5 三種去殘影技術之比較 65
5.1 理論分析 65
5.2 三種去殘影技術模擬比較 65
5.2.1 單顆錫球模擬 67
5.2.1.1 錫球無空洞存在 67
5.2.1.2 錫球有空洞存在 70
5.2.2 雙層BGA模擬 73
5.2.2.1 錫球無空洞存在 74
5.2.2.2 錫球有空洞存在 76
5.3 結果分析 78
Chapter 6 結論 80
6.1 本研究之貢獻 80
6.2 未來發展方向 80
參考文獻 82

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