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研究生:柯柏丞
研究生(外文):Ko, Po-Chang
論文名稱:熱電致冷器應用於高功率發光二極之封裝與散熱
論文名稱(外文):Thermoelectric cooler application in high power LED packaging and heat transfer
指導教授:饒達仁
指導教授(外文):Yao, Da-Jeng
學位類別:碩士
校院名稱:國立清華大學
系所名稱:動力機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:中文
論文頁數:81
中文關鍵詞:熱電致冷器高功率LED
外文關鍵詞:TE CoolerHigh Power LED
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高功率發光二極體(Light Emitting Diode ,LED)之熱管理分為內部與外部熱管理,而內部熱管理主要是將熱傳導至封裝結構,因此低熱阻的封裝結構使熱可以迅速傳導至封裝結構外,再進行第二階段的散熱;而外部熱管理主要是將封裝結構的熱散至環境中。本研究主要以理論推導熱電致冷器(Thermoelectric Cooler , TEC)對於高功率LED之散熱,以簡單的一階熱電致冷模組進行理論分析,進而推導二階熱電致冷模組對於高功率LED散熱的理論分析,最後設計一高功率LED封裝結構,再結合熱電致冷器進行外部散熱,並且以有限元素分析模擬軟體(ANSYS)進行模擬熱電致冷模組對於高功率LED散熱分析。
ANSYS模擬部分以高功率LED封裝材料模擬分析,因此本研究利用Si做為LED封裝之材料,利用半導體製程與Flip chip Bonding完成高功率LED封裝,再以紅外線熱像儀(IR Scope)量測LED的溫度分佈。
利用ANSYS模擬分析熱電致冷模組對於LED封裝之散熱效率,分析結果得知高功率LED在熱電致冷模組冷端以陣列排列最佳間距為3.8mm。研究得知改變熱電致冷模組之熱電接腳高度由2.5mm降為1.9mm時,熱電致冷模組之致冷功率較佳。LED陣列排列間距為3.8mm時,不同封裝材料之理論與模擬數據相互比較結果求得其擴散熱阻,且利用理論分析得知二階熱電致冷模組能夠更有效的將LED所產生之熱帶出封裝結構外。最後將LED以2×2陣列排列,其間距為3.8mm以銀膠進行固定並利用wire bonding將LED以串聯方式做電性連接,利用IR scope量測LED陣列溫度為55oC,且於模擬數據比較得知模擬與實驗數值相符。

Thermal management of high power LED (Light Emitting Diode) is divided into internal and external parts. The internal thermal management discusses the problem between LED chip and thermal structure. Low thermal resistance of package structure will improve the heat dissipation. Otherwise, the external management discusses heat transfer phenomenon between heat sink and ambient. High power LED heat transfer behavior is derived in this research using one- and two-stage thermoelectric cooler.
According to simulations, Si is chosen to be LED packaging material. This study utilizes MEMS fabrication to define the electrode and flip chip bonding is used to finish LED package. Temperature of LED is measured by IR scope.
Simulations of heat transfer behavior of LED package and thermoelectric cooler is achieved to predict the temperature of LED by the software, ANSYS. In this part, the optimized pitch of the LED array is 3.8mm. Decreasing the height of thermoelectric leg from 2.5 to 1.9mm, the performance of thermoelectric cooler is increased. When the pitch of LED array is 3.8mm, spreading resistance is derived from the comparison of theory and simulation results. Finally, a 2×2 LED array is arranged with 3.8mm pitch and fixed by silver epoxy. After that, the LED chip is wire bonded in series. Temperature of LED chip is measured by IR scope. The measurement results are consistent with the trend of simulations, which show a good agreement.

摘要 i
Abstract iii
致謝 v
目錄 vi
圖目錄 ix
表目錄 xiv
第一章 xiv
第二章 xiv
表 2.2- 1熱電材料參數.............................................................................................25 xiv
第三章 xiv
第四章 xiv
第一章 序論 1
1.1. 前言 1
1.2. 研究動機與目的 2
1.3. 文獻回顧 3
1.4. 研究架構 15
第二章 熱傳導與熱電致冷器之原理 17
2.1. 熱傳導理論介紹 17
2.2. 熱電效應理論介紹 20
第三章 理論與模擬分析 28
3.1. 理論分析 28
3.1.1. 一階熱電致冷對高功率LED散熱理論分析 28
3.1.2. 二階熱電致冷模組理論分析 32
3.2. 模擬分析 37
3.2.1. 高功率LED封裝模擬分析 37
3.2.2. 熱電致冷器散熱模擬分析 43
第四章 LED封裝量測與熱電致冷器量測 57
4.1. 高功率LED封裝 57
4.2. 量測設備介紹與實驗架設 61
4.3. 高功率LED封裝散熱量測 64
4.3.1. Silicon Base LED封裝散熱量測 64
4.3.2. 市售高功率 LED封裝散熱量測 65
4.4. 熱電致冷器量測 67
第五章 結果與討論 70
5.1. 模擬與實驗數據比較討論 70
5.1.1. 高功率LED封裝散熱模擬與實驗數據比較討論 70
5.1.2. 熱電致冷器理論、模擬與實驗數據討論比較 72
第六章 結論 78
參考文獻 80

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