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研究生:林志偉
研究生(外文):Lin, Chih-Wei
論文名稱:CapturePowerReductionforAt-SpeedScan-BasedTestingUsingLayout-AwareLocationX-Filling
論文名稱(外文):降低區塊間高速測試所消耗功率
指導教授:張慶元張慶元引用關係
指導教授(外文):Chang, Tsin-Yuan
學位類別:碩士
校院名稱:國立清華大學
系所名稱:電機工程學系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:英文
論文頁數:65
中文關鍵詞:消耗功率高速測試降低區塊間消耗功率
外文關鍵詞:Capture Power ReductionAt-Speed Scan-Based TestingX-FillingLayout-Aware Location X-Filling
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With the rapid improvement of testing technique, the basic of testing function is a necessary technique. It also needs to reduce the testing time and power dissipation as well as testing cost. Nowadays, it is important to solve problem which is the more power dissipation during testing. The more power dissipation can cause the effect of IR-drop and hot-spots. The chip is easy to fail with the high power dissipation. Therefore, applying the concept of gate density, this thesis proposes two methods (Probable Weighted Switching Activity X-Fill, PWSA X-Fill; and Location-Aware X-Filling) to reduce the power dissipation and distributes the accumulated heat.
Applied in ISCAS-89 benchmark circuits (s9234, s13207, and s38417), the simulation results show that the original power is reduced about 10% peak and 20% average in the launch cycle and 9% peak and 12% average by the proposed x-fill methods. Compared with other x-filling, the proposed x-filling has better result on reducing launch and shift cycle power and would reduce the occurrence of IR-drop and hot-spots for at-speed scan-based testing.

隨著晶片測試技術快速的提升下。在測試領域中,除了要求最為基本的測試功能外,還需要能達到降低測試時間、降低測試所消耗的功率以至於將成本耗損減少到最低,以得到最佳的測試效果。然而當前最為學者們所討論的是要如何在測試中降低測試功率的消耗。這是由於測試時有可能會造成過高的功率消耗,進而使得熱能不斷產生於晶片中不容易散去。如此,導致晶片內的溫度過高。相當容易使得晶片內的測試電路因燒毀而測試失敗。因此為了預防測試時所發生的熱損壞現象,本篇論文提出了一個測試填入方法。運用機率計算方法,計算預估出最為可能在電路邏輯運算完後出現0或1的機率,再填入適當的邏輯值。如此,不但能夠降低測試功率消耗還能分散熱能過度密集於某些區塊,以防止熱損壞的現象。並且還用密集程度去研究如何降低測試時所導致過熱的損壞情形。
本篇論文在高速測試環境下,所使用的測試電路為ISCAS-89中的標準電路,如s9234, s13207和s38417等電路。將比較於其他相關測試填入方法上,本論文所提的方法在觸發周期所消耗的功率可以減少大約10%的最大功率與大約20%的平均功率。在捕捉周期所消耗的功率可以減少大約9%的最大功率與大約12%的平均功率。除了在消耗功率可達到理想的降低外,本篇論文所提的方法在實驗數據上,皆能明顯有效的將過度密集的熱能區塊分散開來。以預防熱能過度集中而導致晶片在測試時燒壞現象,而提高測試的良率。

致謝................................................ II
ABSTRACT............................................ III
中文摘要............................................ IV
目錄................................................ V
第一章 簡介......................................... VI
第二章先前研究與背景................................ VII
第三章提出改善方法.................................. VIII
第四章實驗數據與比較................................ IX
第五章結論與未來期望................................ X
英文附錄............................................ XI
LIST OF FIGURE...................................... XIV
LIST OF TABLES...................................... XV
CHAPTER 1........................................... 1
CHAPTER 2........................................... 4
2.1 AT-SPEED TESTING METHODOLOGY [3]................ 4
2.2 WEIGHTED SWITCHING ACTIVITY..................... 6
2.3 AUTOMATIC TEST PATTERN GENERATION (ATPG)........ 7
2.3.1 Basic Automatic Test Pattern Generation (ATPG) 7
2.3.2 Applied Automatic Test Pattern Generation (ATPG)[13][14]................................................ 10
2.4 X-FILLING METHOD................................ 12
2.4.1 Direct X-Filling Method [5]................... 14
2.4.2 Preferred X-Filling Method [15]............... 16
2.4.3 Adjacent X-Filling Method [16]................ 17
2.4.4 APAF X-Filling Method [14].................... 18
2.5 CALCULATE SIGNAL PROBABILITIES [15]............. 19
2.6 SCANED FLIP-FLOP LOCATION [29].................. 21
CHAPTER 3........................................... 22
3.1 PWSA X-FILLING.................................. 24
3.1.1 Definition of Probable Weighted Switching Activity (PWSA).............................................. 25
3.1.2 Calculation of the PWSA of X-Bits with Filling Logic 1 and 0............................................. 27
3.1.3 Reordering of the X-Bits...................... 29
3.1.4 Procedures of PWSA X-Filling.................. 30
3.2 LOCATION-AWARE X-FILLING........................ 31
3.2.1 Ordering of the Location...................... 33
3.2-2 Ordering of the X-Bit within the Location..... 35
3.2.3 The Procedure of the Location-Aware X-Filling. 36
3.2.4 Problem of the Location-Aware X-Filling....... 38
3.3 RE-FILLING...................................... 39
3.3.1 Definition of Switching Density Value (SDV)... 40
3.3.2 Return to the Initial Pattern Test Cube....... 44
3.3.3 The Procedure of the Re-Filling............... 44
CHAPTER 4........................................... 46
4.1 EXPERIMENTAL RESULTS ON PROPOSED PWSA X-FILLING. 47
4.2 EXPERIMENTAL RESULTS ON PROPOSED LOCATION-AWARE X-FILLING............................................. 49
4.3 EXPERIMENTAL RESULTS ON PROPOSED REFILLING...... 55
CHAPTER 5........................................... 60
5.1 CONCLUSIONS..................................... 60
5.2 FUTURE WORKS.................................... 61
BIBLIOGRAPHY........................................ 63

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