臺灣博碩士論文加值系統

摘要

由於低原子序原子在電子顯微鏡中所得到之相位對比很低，為提升相位板之相位對比，本論文之實驗目的為研究並且利用微機電之方式製造靜電式之相位板，並且利用外加電壓，使相位板之孔洞內部產生均勻的積分電位使電子束轉換 /2之相位，因而可得到更好之相位對比。

我們將相位板製做成環狀，並且使穿透電子穿過環之中央而改變了相位，繞射電子則從環的周圍通過並維持原來之相位，因此不僅改良了碳膜相位板之問題，更因為整個元件都在矽晶圓上加工，更加適合大量生產之目標。更因為所設計之相位板具有光圈之功能，可以很容易的隨時決定要不要裝入相位板，以得到我們要之相位影像。

本研究目標在於設計新的相位板並且盡可能的減少電子束被遮擋訊號之面積，並且對於相位板製程上所遇到之問題一一提出解決之法。

章節目錄
章節 頁碼
摘要..............................................................................................................................................i
誌謝詞......................................................................................................................................iii
章節目錄....................................................................................................................................iv
圖目錄..........................................................................................................................viii
第一章 前言.............................................................................................................................1
1.1為何需要相位板.......................................................................................................1
1.2什麼是相位板...........................................................................................................1
1.3電子顯微鏡之成像理論…......................................................................................2
1.4相位增強技術之介紹...............................................................................................3
1.4.1 DPC法...........................................................................................................4
1.4.2 ZPC法............................................................................................................4
1.4.3 HDC法...........................................................................................................4
1.5相位板之種類介紹...................................................................................................5
1.5.1 Zernike 相位板.............................................................................................5
1.5.2 薄膜式相位板...............................................................................................6
1.5.3 靜電式相位板...............................................................................................7
1.6近代相位板之發展歷史...........................................................................................7
1.6.1日本Endo團隊-磁場式相位板(1985) ..........................................................7
1.6.2日本Matsumoto團隊-靜電式相位板(1996) .................................................8
1.6.3日本Nagayama團隊-碳膜式相位板(2001) ...................................................8
1.6.4德國Schroder團隊-靜電式相位板(2003) ....................................................9
1.6.5日本Nagayama團隊-碳膜式相位板(2004) .................................................9
1.6.6美國Cambie團隊-靜電式相位板(2006) .....................................................9
1.6.7台灣 F.R.Chen & F.G.Tzeng團隊-靜電式相位板(2006)............................10
1.6.8日本Nagayama 團隊-磁場式相位板(2008) ...............................................10
1.7 本研究之設計理念及其優點................................................................................11
第二章 相位板之設計與製程介紹及使用儀器簡介.............................................................23
2.1微系統加工技術...................................................................................................23
2.1.1面型微加工技術..........................................................................................23
2.1.2體型微加工技術..........................................................................................24
2.1.2.1溼式蝕刻法...................................................................................24
2.1.2.2乾式蝕刻法...................................................................................25
2.2鍍膜之儀器介紹以及方法...................................................................................26
2.2.1物理氣相沉積法..........................................................................................26
2.2.1.1電子束蒸鍍法...............................................................................26
2.2.2化學氣相沉積法..........................................................................................27
2.2.2.1低壓化學氣相沉積.......................................................................27
2.2.2.2電漿增強化學氣相沉積法...........................................................28
2.3反應離子蝕刻機...................................................................................................28
2.4聚焦離子束...........................................................................................................29
2.5製程流程介紹.......................................................................................................29
2.5.1低壓化學氣相沉積法鍍膜..........................................................................30
2.5.2黃光微影製程定義懸臂樑寬度..................................................................30
2.5.2.1清潔...............................................................................................30
2.5.2.2犧牲層以及正光阻之塗佈...........................................................30
2.5.2.3雙面對準曝光機曝光...................................................................31
2.5.2.4懸臂樑之顯影定義.......................................................................31
2.5.2.5中間層電極之定義.......................................................................31
2.5.2.6金屬之掀離...................................................................................32
2.5.2.7背後光圈之開孔以及對準...........................................................32
2.5.2.8背面低應力氮化矽之蝕刻開孔...................................................33
2.5.2.9正面及側面保護光阻之去除.......................................................34
2.5.2.10背面矽晶圓之溼蝕刻.................................................................34
2.5.2.11正面氮化矽之去除.....................................................................35
2.5.2.12正面之電漿氮化矽薄膜成長.....................................................35
2.5.2.13上下層金屬電極之定義.............................................................35
2.5.2.14電極部分之氮化矽去除.............................................................36
2.5.2.15聚焦離子束挖中央孔洞.............................................................36
2.6製程之圖示.........................................................................................................36
2.7製程之規劃.........................................................................................................38
2.7.1光圈開孔之尺寸決定............................................................................38
2.7.2相位板位置............................................................................................39
第三章 實驗之結果與討論.....................................................................................................49
3.1相位板製作之問題與解決方法.........................................................................49
3.1.1潔淨度之克服........................................................................................49
3.1.2光阻附著度之增強................................................................................49
3.1.3曝光劑量與顯影時間............................................................................50
3.1.4掀離後懸臂樑之不規則撕裂面之改良................................................50
3.1.5體型微加工製程....................................................................................50
3.1.6正面保護光阻之選擇............................................................................51
3.1.7光罩之對準............................................................................................51
3.1.8光阻之去除............................................................................................52
3.1.9懸臂樑之應力問題................................................................................52
3.1.10懸臂樑斷裂之問題..............................................................................52
3.1.11相位板中央孔洞之尺寸選擇..............................................................52
3.1.12聚焦離子束後之簾幕效應..................................................................54
3.2相位板之安裝.....................................................................................................53
3.3光圈大小之影響.................................................................................................54
3.4懸臂樑之彎曲應力之計算.................................................................................55
3.5相位板載入穿透式電子顯微鏡之拍攝.............................................................56
第四章 結論及未來研究方向.................................................................................................70
參考文獻...................................................................................................................................72

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