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研究生:陳威達
研究生(外文):Wei-Ta Chen
論文名稱:重新設計產品空間配置之方法以簡化選擇性拆卸序列的綠色設計
論文名稱(外文):Methods for Redesigning Product Spatial Configuration to Simplify a Selective Disassembly Sequence for Green Design
指導教授:陳湘鳳
指導教授(外文):Shana Smith
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:機械工程學研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2010
畢業學年度:98
語文別:英文
論文頁數:108
中文關鍵詞:重新設計方法產品空間配置設計為了拆卸拆卸簡化綠色評估選擇性拆卸序列
外文關鍵詞:Redesign methodProduct spatial configurationDesign for disassemblySimplification of disassemblyGreen assessmentSelective disassembly sequence
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在現今商業市場中,大多數產品的生命週期因為激烈的市場競爭、科技進步與產品多樣性而越來越短,產品廢棄物也因越來越多的產品被製造出來而急遽增加。在這環境意識高漲的世代,製造產品不只是著重於數量,也著重於品質。高品質的綠色產品具有較長的生命週期以及能在其使用壽命結束後減少對環境的影響。在本篇論文中,作者提出一個針對選擇性拆卸序列而作的產品空間配置重新設計的方法架構。此架構主要包含兩個重新設計的方法:元件的重新設計以及針對拆卸的元件叢集化設計。設計為了拆卸的方針也在此篇論文中提及當成是重新設計方法的參考準則。產品設計工程師可應用此方法針對現有的產品空間配置作分析與重新設計以簡化對產品中的目標元件或模組的選擇性拆卸步驟。另外,本篇論文也考慮到元件之間的功能輸入與輸出之設計限制,像是元件之間必需如何設計的特殊關係,如此產品的原有功能才不至於改變。此外,本論文也提出一個可計算產品綠色性能的綠色評估方法,此評估方法可幫助產品設計工程師檢驗元件在壽命結束後其回收處理的選擇之配置狀況與處理難易程度。作者利用控制器為實例,實作如何利用此論文方法進行產品空間配置重新設計。

In the current business market, the life-cycle of most products is getting short, due to severe market competition, advances in technology and variety of available products. Product wastes increases dramatically because more products are manufactured. In the era of rising environmental awareness, products are made not only with quantity but also with quality. High quality green products possess longer life-cycle and reduce environmental impacts at theirs end-of-life stage. In this research, a method framework for redesigning product spatial configurations for a given selective disassembly sequence is proposed. The framework mainly contains two redesign methods: redesigning of components, and clustering design of components for disassembly. Design for disassembly guidelines are also introduced as the basic reference principals of the redesign methods. Product design engineers can analyze and redesign an existing product spatial configuration to simplify the steps needed to selectively disassemble the target components or modules using the developed methods. In addition, design constraints concerning input and output functions among components, such as specific required relationships among parts, are considered so that the original function of products will not change. Besides, a method for green assessment is provided to evaluate the green performance of products. Thus, product design engineers can examine the arrangement of components for different end-of-life options and level of difficulty in end-of-life treatments. A controller assembly is used as a case study to show how these methods performed to the product spatial configuration redesign.

口試委員會審定書 i
誌謝 ii
中文摘要 iii
Abstract v
Contents vii
Figure of Contents ix
Table of Contents xi
Chapter 1 Introduction 1
1.1 Background and Motivation 1
1.2 Thesis Framework 2
Chapter 2 Literature Review 4
2.1 Assembly/Disassembly Evaluation 5
2.2 Design for X 7
2.2.1 Design for Assembly/Disassembly 8
2.2.2 Design for Environment 9
2.3 Modular Design 9
2.4 Green Product Configuration Design 12
Chapter 3 Evaluation of Disassemblability 14
3.1 Numeric Analysis of Disassemblability 14
3.2 An Example for Illustration 19
Chapter 4 Methods for Redesigning Product Spatial Configuration 22
4.1 Design for Disassembly 23
4.1.1 Design of Components 24
4.1.2 Design of Product Spatial Configuration 25
4.1.3 Design and Use of Fasteners 26
4.1.4 Use of Materials 27
4.2 Redesign of Components 30
4.2.1 Inputs and Outputs of Function 30
4.2.2 Methods for Redesigning of Components 35
4.2.2.1 Redesign Shapes of Components 42
4.2.2.2 Redesign Locations of Components 43
4.3 Clustering Disassembly and Redesign 47
4.4 Green Assessment of Product 60
4.5 Flowchart of Redesign Methods 70
Chapter 5 Case Study 73
5.1 Redesign of Component 81
5.1.1 Redesign Shapes of Component 81
5.1.2 Redesign Locations of Component 88
5.2 Clustering Disassembly and Redesign 93
5.3 Discussion 99
Chapter 6 Conclusions and Future Work 101
6.1 Conclusions 101
6.2 Future Work 102
Reference 103


[1] Desai, A., and Mital, A., 2003, “Evaluation of Disassemblability to Enable Design for Disassembly in Mass Production,” Industrial Ergonomics, 32:265-281.
[2] Smith, S., and Chen, W. H., 2009, “Rule-Based Recursive Selective Disassembly Sequence Planning for Green Design,” Proceedings of the 16th ISPE International Conference on Concurrent Engineering, pp. 291-302.
[3] Lambert, A. J. D., 1999, “Linear Programming in Disassembly/Clustering Sequence Generation,” Computers and Industrial Engineering, 36: 723–738.
[4] Brennan, L., Gupta, S.M., and Taleb, K.N., 1994, “Operations Planning Issues in An Assembly/Disassembly Environment,” International Journal of Operations and Production Management, 14(9):57-67.
[5] Mok, H. S., Kim, H. J., and Moon, K. S., 1997, “Disassemblability of Mechanical Parts in Automobiles for Recycling,” Computers and Industrial Engineering, 33(3-4):621-624.
[6] Kroll, E., and Carver, B., 1999, “Disassembly Analysis Through Time Estimation and Other Metrics,” Robotics and Computer Integrated Manufacturing, 15:191-200.
[7] Lai, X., and Gershenson, J.K., 2009, “DSM-based Product Representation for Retirement Process-based Modularity,” Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, DETC2009-87037.
[8] Ilgin, M. A., and Gupta, S. M., 2009, “Environmentally Conscious Manufacturing and Product Recovery (ECMPRO): A Review of The State of The Art,” Journal of Environmental Management, 91:563-591.
[9] Veerakamolmal, P., and Gupta, S.M., 2000, “Design for Disassembly, Reuse and Recycling,” Environmentally Responsible Engineering, Butterworth-Heinemann, pp. 69-82.
[10] Gungor, A., 2006, “Evaluation of Connection Types in Design for Disassembly (DFD) Using Analytic Network Process,” Computer & Industrial Engineering, 50:35-54.
[11] Veerakamolmal, P., and Gupta, S.M., 1999. “Analysis of Design Efficiency for The Disassembly of Modular Electronic Products,” Journal of Electronics Manufacturing 9:79-95.
[12] Boothroyd, G., Dewhurst, P., and Knight, W., 1994, Product Design for Manufacture and Assembly, New York: Marcel Dekker.
[13] Stone, R.B., McAdams, D.A., and Kayyalethekkel, V.J., 2004, “A Product Architecture-based Conceptual DFA Technique,” Design studies, 25:301-325.
[14] Feldmann, K., Meedt, O., Trautner, S., and Scheller, H., Hoffman, W., 1999. “The Green Design Advisor: A Tool for Design for Environment,” Journal of Electronics Manufacturing , 9:17-28.
[15] Lye, S.W., Lee, S.G., and Khoo, M.K., 2002, “ECoDE - An Environmental Component Design Evaluation Tool,” Engineering with Computers, 18:14-23.
[16] Huang, C.C., and Kusiak, A., 1998, “Modularity in Design of Products and Systems,” IEEE Transactions on Systems, Man, and Cybernetics- Part A: Systems and Humans, 28(1):66-77.
[17] Tseng, H.E., Chang, C.C., and Li, J.D., 2008, “Modular Design to Support Green Life-cycle Engineering,” Expert Systems with Applications, 34(4):2524-2537.
[18] Yen C.C., and Smith, S., 2009, “Green Product Design by Atomic Theory,” Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, DETC2009-87122.
[19] Gu, P., Hashemian, M., and Sosale, S., 1997, “An Integrated Modular Design Methodology for Life-cycle Engineering,” Annals for CIRP, 46:71-74.
[20] Gershenson, J.K., Prasad, G.J., and Allamneni, S., 1999, “Modular Product Design: A Life-Cycle View,” Journal of Integrated Design & Process Science, 3(4):13-26.
[21] Browning, T.R., 2001, “Applying the Design Structure Matrix to System Decomposition and Integration Problems: A Review and New Directions,” IEEE Transactions on Engineering Management, 48(3):292-306.
[22] Yassine, A.A., 2004, “An Introduction to Modeling and Analyzing Complex Product Development Process Using the Design Structure Matrix (DSM) Method,” Quaderni di Management (Italian Management Review), No.9.
[23] Tilstra, A.H., Seepersad, C.C., and Wood, K.L., 2009, “ Analysis of Product Flexibility for Future Evolution Based on Design Guidelines and A High-Definition Design Structure Matrix,” Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, DETC2009-87118.
[24] Umeda, Y., Fukushige, S., Tonoike, K., Kondoh, S., 2008, “Product Modularity for Life Cycle Design,” CIRP Annals-Manufacturing Technology, 57:13-16.
[25] Viswanathan, S., and Allada, V., 2001, “Configuration Analysis to Support Product Redesign for End-of-Life Disassembly,” International Journal of Production Research, 39(8):1733-1753.
[26] Viswanathan, S., and Allada, V., 2006, “Product Configuration Optimization for Disassembly Planning: A Differential Approach,” The International Journal of Management Science, 34:599-616.
[27] Kwak, M.J., Hong, Y.S., Cho, N.W., 2007, “Eco-Architecture Analysis As a Method of End-of-Life Decision Making for Sustainable Product Design,” Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, DETC2007-35882.
[28] Zhang, L., Liu, G., Liu, Z., and Huang, H., 2008, “Product Optimizing Configuration Method Oriented Green Design,” Transactions of the Chinese Society of Agricultural Machinery, 39(9):122-128.
[29] Internet Source, 2005, “Design for Disassembly Guidelines,” Active Disassembly Research.
[30] Tsai, Y. T., and Wang, K.S., 1999, “The Development of Modular-Based Design in Considering Technology Complexity,” European of Operational Research 119:692-703.
[31] Tsai, C., and Kuo, 2006, “Enhancing Disassembly and Recycling Planning Using Life-Cycle Analysis,” Robotics and Computer-Integrated Manufacturing, 22:420-428.


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