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研究生:邱德弘
研究生(外文):Chiu, Tehung
論文名稱:細長型晶元於四點彎矩測試中邊緣缺陷效應之研究
指導教授:林派臣
指導教授(外文):Lin, Paichen
口試委員:劉德騏張國恩屈子正
口試日期:2012-07-16
學位類別:碩士
校院名稱:國立中正大學
系所名稱:機械工程學系暨研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:107
中文關鍵詞:晶圓切割晶圓強度崩缺刀痕四點彎矩
外文關鍵詞:dicingdie strengthchippingsaw marksfour-point bending
相關次數:
  • 被引用被引用:1
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  • 下載下載:23
  • 收藏至我的研究室書目清單書目收藏:0
本研究針對細長型晶元以四點彎矩測試法對邊緣缺陷進行實驗觀察與模擬分析。晶元試片有三種:電路試片、裸片試片及鍍鋁膜試片。實驗觀察顯示邊緣缺陷有兩類:邊緣崩缺(chipping)及切割面刀痕(saw marks)。大型崩缺通常對晶元強度及破壞行為無顯著影響;反之,微型缺陷的平均尺寸越大越深,則晶元強度越低。其次,利用化學蝕刻法和研磨抛光法將切割面刀痕去除,可使晶元強度提升達82%。建立中央圓孔平板受四點彎矩之有限元素模型,利用理論解確認圓孔周圍網格分格方式。接著,建立邊緣缺陷平板受四點彎矩之有限元素模型,探討材料方向性及缺陷尺寸與應力集中係數的關係。結果顯示,材料方向性的影響不顯著;然而,當缺陷之曲率半徑越小、水平深度越大及垂直深度越大時,應力集中係數會急遽升高,晶元強度則減少。簡言之,邊緣崩缺及切割面刀痕皆對細長型晶元的強度及破壞模式有顯著地影響,適當地研磨抛光切割面可有效提升晶元強度。
In this study, the effects of the edge defects on the die strength and fracture behavior of slender dies are investigated by experimental and numerical approaches. Four-point bending tests are considered. Circuit dies, raw dies and aluminum-coated dies are investigated. Two main defects, chippings and saw marks, can be found on the dicing surfaces. In general, the large surface chippings have weak correlations with the die strength, while the micro backside chippings have strong correlations with it. The die strength decreases as the size of micro chippings increases. The saw marks on the dicing surface have significant effects on the die strength as well. By removing the saw marks properly by etching or polishing, the die strength can significantly improve up to 82%.
The analytical and computational solutions for a model of a central hole in a square plate under four-point bending conditions are taken to benchmark the refined meshes surround the hole. Another model of double edge notches in a square plate representing the edge defects on a die is then considered to investigate the effects of the notch size and material orientation on the stress concentration factors. The results indicate that the stress concentration factors increase rapidly and the die strengths decrease significantly when the notch radius decreases, the notch length increases, and the notch depth increases. On the other hand, the material orientation has insignificant effects on the stress concentration factors. In brief, the die strength is strongly affected by chippings and saw marks due to stress concentration and can be improved by properly removing them.

目錄
圖目 V
表目 IX
第一章 緒論 1
1-1 研究動機 1
1-2 研究目的 2
1-3 文獻回顧 3
1-4 文獻回顧總結 19
1-5 研究方法與流程 20
第二章 四點彎矩實驗 22
2-1 四點彎矩實驗之目的與簡介 22
2-2 試片之製備 22
2-3 四點彎矩實驗之設備 26
2-4 實驗機台校正 31
2-5 四點彎矩測試實驗方法與步驟 31
2-6 實驗結果與討論 35
2-6-1 電路試片 36
2-6-2 裸片試片 40
2-6-3 鍍鋁層試片 46
2-6-4 化學蝕刻試片 48
2-6-5 研磨拋光試片 52
第三章 四點彎矩之有限元素分析 63
3-1 四點彎矩有限元素分析目的 63
3-2 圓孔無限平板受四點彎矩之理論解 63
3-3 圓孔平板受彎矩之有限元素分析 67
3-3-1 圓孔平板受彎矩之有限元素模型 67
3-3-2 圓孔平板模型尺寸效應 74
3-4 邊緣缺陷平板受四點彎矩之有限元素分析 77
3-4-1 邊緣缺陷平板模型建立 77
3-4-2 邊緣缺陷平板之曲率半徑及水平深度效應 80
3-4-3 邊緣缺陷平板之深度效應 84
3-4-4 模擬結果與現行規範比較 90
第四章 結論與未來研究方向 92
4-1 結論 92
4-2 未來研究方向 94
參考文獻 95


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[8]Z. Yang, C.B. Kim, H.G. Beom, C. Cho, “The concentrations of stress and strain out-of-plane bending plate containing a circular hole”, International Journal of Mechanical Sciences 45,pp.713-731,2008.
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