為了滿足顧客在電子產品對輕、薄、小的需求，在電子組裝製程上由表面黏著技術(Surface Mount Technology，SMT)取代傳統人工穿孔式插件波焊(Wave Soldering)，SMT製程包含三大主要的製造程序：錫膏印刷、電子零件的表面黏著、迴焊爐作業等。其中，迴焊爐作業為影響電子產品印刷電路板與電子零件焊接關鍵品質之一，焊接的品質的良劣會直接的影響到電子產品的弁鄔吽B可靠度、與安全性。整個迴焊製程又包含四個程序：預熱區、浸潤區、迴焊區、冷卻區，各迴焊程序中各有不同加熱溫度與時間所構成的溫度曲線。因此，當迴焊爐迴焊溫度曲線可以獲得有效的監控，潛在迴焊品質不良的問題，如錫球(Solder Ball)、墓埤(Tombestoning)、歪斜(Skewing)、開路(Opens)、元件破裂(Component cracking)、助焊劑活化不良(Inadequate fluxing activity)等就可以減少發生。有鑑於此並考量實際應用性與成本因素，本研究期望以微軟辦公室軟体中的EXCEL試算表程式結合自動化量測技術與網路技術建立對迴焊作業溫度的即時監控EWMA管制圖，選擇迴焊關鍵溫度做有效的管制，期陸j焊溫度在各程序點發生異常時，可以有效並及時被偵測出，以減少損失。

In order to satisfy the requirement of customers in the electronic products feature on the light, thin, little, the electronic assembly process by the surface mount technology to replace the traditional manual punch-plug-in wave soldering. A SMT assembly process consists of three major manufacturing processes: solder paste stencil printing, component placement and solder reflow. Which reflow operations affecting the electronics printed circuit board and electronic key to the quality of welded parts, one of the good poor welding quality will directly affect the functionality of electronic products, reliability, and security. The reflow process also contains four programs: warm areas, infiltration areas, reflow zone, cooling zone, the reflow process of heating temperature and time vary the temperature curve of the form. Therefore, when the temperature profile of hot air reflow oven has been effective monitoring, the potential problem occurrence rate of the poor quality, such as solder balls, tomb-stoning, skewing, opens, component cracking, and inadequate fluxing activity can be reduced. According to the reasons description above, the Microsoft Office software EXCEL program combined with automatic measurement techniques and network technology to establish an experimental system, and using EWMA control chart to monitor temperature profile of hot air reflow oven. Results on this study will be a reference example for SMT industry.

摘要 i
Abstract ii
誌謝 iii
目錄 iv
表目錄 v
圖目錄 v
第一章 緒 論 1
第一節　研究背景與動機 1
第二節　研究目的 3
第三節 研究範圍與對象 3
第四節 研究架構與章節配置 5
第二章 文獻探討 7
第一節 SMT製程 7
第二節 迴焊 9
第三節 品質與變異 12
第四節 管制圖 14
第五節 EWMA管制圖 16
第六節 平均連串長度ARL 20
第三章 溫度量測系統的建立 23
第一節 電腦自動化量測對品質管理影響 23
第二節 溫度量測系統建立 24
第三節 溫度量測系統使用說明 29
第四章 溫度量測系統測試 39
第一節 溫度模型的建立 40
第二節 溫度量測系統管制圖的測試 43
第三節 測試的結果與比較 47
第五章 結論與建議 64
參考文獻 65

一、中文文獻
1. 蔡聰男，自適應式表面黏著製程品質預測控制系統之發展，國立成奶j學製造工程研究所博士論文(2003)
2. 葉俊吾，運用類神經網路建構SMT錫膏印刷製程品質管制系統，台南，碩士論文，成奶j學製造研究所(2002)。
3. 蔡秋文，表面黏著迴焊溫度曲線決策支援模式，高雄，碩士論文，樹德科提大學，經營管理研究所(2005)。
二、英文文獻
1. Wassink, R. J. and M. M. F. Verguld, Manufacturing Technology for Surface Mounted Assemblies, Electrochemical Publicatons Ltd., Isle of Man, British(1995)
2. Marcoux, P. P., Surface Mount Technology – Design for Manufacturing, Marketing Letters, PPM Associstes, Michigan(1989).
3. Lee, N. C., Optimizing the reflow profile via defect mechanism analysis, Soldering & Surface Mount Technology, Vol. 11, pp. 13-20(1999)
4. Fledmann, K. and Stum, J., Closed Loop Quality Control in Printed Circuit Assembly , IEEE Transactions on Components, Hybrids, and Manufacturing Technology –Part A, Vol. 17, No. 2, pp. 270-276(1994)
5. Robinson, P. B. and Ho, Average Run Lengths of Geometric Moving Average Charts by Numerical Methods. Technometrics, 20 (1978)
6. Crowder, Stephen V., Design of Exponentially Weighted Moving Average Schemes, Journal of Quality Technology, 21 pp.155-162(1989)
7. Lucas, James M. and Saccucci, Michael S., Exponentially Weighted Moving Average Control Schemes: Properties and Enhancements, Technometrics, 32,pp.1-12(1990)
8. MacGregor, J. F., and T. J. Harris, The Exponentially Weighted Moving Variance,Journal of Quality Technology, Vol. 25, No. 25, pp. 106-118. (1993)
9. Srivastava, M.S. and Wu, Yanhong., Evaluation of Optimum Weights and Average Run Lengths in EWMA Control Schemes, Commun. Statist -simula.,26,pp.979-1008(1997)
10. Lucas, James M. and Crosier, Ronald B., Fast Initial Response for CSSUM Quality-Control Schemes: Give Your CUSUM A Head Start., Thechnometrics,42,pp.102-107(2000)
11. Lau, J . H. & Pao, Y. H., Solder Joint Reliability of BGA, CSP, Filp Chip, and Fine Pitch SMT Assemblies, Mcgraw-Hill, New York.(1997)
12. Manko, H. H., Soldering Handbook for Printed Circuits and Surface Mounting Van Nostand Reinhold, New York (1995)
13. Marcoux, P. P., Surface Mount Technology – Design for Manufacturing, PPM Associates, Michigan.(1989)
14. Prasad, R. P., Surface Mount Technology: Principles and Practice, Van Nostrand Reinhold, New York.(1989)
15. Juran, J. M., Quality Control Handbook, 3rd ed., MacGraw-Hill, (1974).