臺灣博碩士論文加值系統

在1969 年時，最早的探針卡被研發出來，並被延用至今，其名為環氧樹脂
(needle/epoxy)探針卡，此型式所製造出來的探針卡結構，於目前仍然是半導體測試
探針所應用的主要技術。然而在現今的積體電路(IC)等元件往輕薄短小的方向發展
的過程中，使用上述的傳統方式所製造出來的探針卡，已逐漸在裸晶數目越來越驅
複雜化及其電極板的間距縮小化暴露出其缺點，就是其探針在某些頻率的使用中，
探針的結構非常的脆弱且無法進行高效能的探測，由於探針卡必須於高密度和較小
的間距做有效的高頻率測試，其探針的結構逐建被探討並做改良，目前的主流為利
用矽晶元配合微加工製程做批量製造，在基材上形成數千甚至是數萬個小於微米的
微探針結構，以便能有效的達到其現今的測試要求，然而到目前為止，雖然有一些
研究團隊已利用此技術嘗試製造出不同的探針形狀來解決其問題，但這些技術在製
造與測試探針中仍有許多需改善的地方，如接觸力太小、過短的位移行程以及複雜
的製作過程，故為了改善上述問題，本實驗利用4 吋晶元當作基板，並結合微機電
製程技術，在製造出微奈米級的刀片型探針模具，之後利用微電鑄技術在模具中沈
積出鎳鈷探針，而此技術可有效的解決探針於短間距及高頻應用上的相關問題。

The first probe card, called a needle/epoxy ring probe card, was developed in
1969 and the same basic technology is still used today. However, conventional needletype
probes including those for memory probe cards have poor control of the interface’s
electrical environment and very fragile contacts and the implementation of high
performance probe becomes difficult with the conventional technology. Because MEMS
probe cards are requisite to higher pad-density and smaller pad-pitch chips, and effective
in high frequency testing. In order to achieve these requirements, there are several
attempts fabricate probe structure with batch silicon micro fabrication process, Some
groups have developed MEMS type probe cards with various structures. However, these
technologies have some problems probe tip fabrication and testing including: low contact
force, short overdrive, complex process steps, and poor reliability. In other words, the
critical problem of the probe cards is the leakage current between one pin and the other
pins was high. In order to improve the above bottlenecks existing for getting better die
test results, MEMS probe technology makes it possible to produce a fine pitch and
perform high reliable contact. I have designed, fabricated with 4 in. silicon wafer as the
main body and the blade was fabricated with electroplating nickel-cobalt and silicon on
oxide wafer to solve the limitation of fine pitch and high frequency, and problem of

中文摘要.............................................................................................................................. I
ABSTRACT.......................................................................................................................II
Acknowledgement ............................................................................................................ III
Contents ............................................................................................................................ IV
List of Table...................................................................................................................... VI
List of Figure....................................................................................................................VII
Chapter 1 Introduction ........................................................................................................ 1
1.1 Background............................................................................................................... 1
1.2 Literature review....................................................................................................... 3
1.3 Objectives of the thesis ............................................................................................. 6
1.4 Layout of the thesis................................................................................................... 6
Chapter 2 Theoretical........................................................................................................ 12
2.1 Electroplating.......................................................................................................... 12
2.2 Photolithography..................................................................................................... 13
2.3 Etching and Patterning Techniques ........................................................................ 14
2.3.1 Lift-off.................................................................................................................. 14
2.3.2 Wet etching ...................................................................................................... 15
2.3.3 Dry etching....................................................................................................... 15
2.4 Micro-electroplating nickel and cobalt ................................................................... 16
2.4.1 The basic structure of plating........................................................................... 16
2.4.2 The results of the operating conditions of electroplating................................. 19
2.4.3 Reaction mechanism of the electroplating process.......................................... 20
2.4.5 Ni-Co alloys strengthen and the binary phase diagram system ....................... 21
Chapter 3 Microprobe Design........................................................................................... 27
3.1 Design and test mechanisms ................................................................................... 27
3.2 ANSYS simulated................................................................................................... 28
Chapter 4 Experimental and Analysis Processes .............................................................. 37
4.1 Process design......................................................................................................... 37
4.2 Optical Lithography................................................................................................ 40
4.3 Mask design ............................................................................................................ 40
4.4 Substrate Preparation .............................................................................................. 41
4.5 Spin Coating and Pre-Bake of Resist...................................................................... 41
4.6 UV Exposure and Development of Resist .............................................................. 42
4.7 Nickel-cobalt alloy plating...................................................................................... 42
4.7.1 Chemical agent and experimental parameters ................................................. 42
4.7.2 Experimental supplies and equipment ............................................................. 43
4.7.3 Experimental processes.................................................................................... 44
4.8 Titanium Etching .................................................................................................... 52
4.9 Analytical Instruments ............................................................................................ 53
4.9.1 Surface Profile Measurement Instrument ........................................................ 53
4.9.2 Scanning Electron Microscope (SEM) and Energy Dispersive Spectrometer
(EDS) ........................................................................................................................ 53
4.9.3 Four-point probe measurement system............................................................ 55
4.9.4 Nanoindentation............................................................................................... 55
Chapter 5 Results and Discussion..................................................................................... 57
5.1 Nickel-cobalt alloy plating...................................................................................... 57
5.1.1 Measurement of growth rate ............................................................................ 57
5.1.2 Measurement composition of Ni-Co alloy....................................................... 59
5.1.3 Coating hardness measurement........................................................................ 62
5.1.4 Electrical measurements .................................................................................. 65
5.2 Microprobe.............................................................................................................. 67
Chapter 6 Conclusion........................................................................................................ 68
Chapter 7 Future work ...................................................................................................... 69
References........................................................................................................................ 71

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