本研究以電化學沉積方式製備Cu2O膜於FTO導電薄膜表面，使用0.5 M Na2SO4作為電化學溶液並且添加催化劑NiSO4作為促進Cu2O膜產氫之觸媒，以三極式光電化學檢測氧化亞銅薄膜的電化學特性。試片為(111)優選取向的Cu2O膜，經150 W鹵素燈照光下於0.5 M Na2SO4溶液添加催化劑NiSO4後，進行光電化學檢測。結構分析與成分分析則使用XRD，FE-SEM 和 EDS。
實驗結果顯示Cu2O有光電化學效應。添加NiSO4催化劑進行陰極端循環掃描，有很明顯的響應電流值，與無NiSO4催化劑者比較，電流值明顯增大。Cu2O進行光電化學檢測，隨著催化劑濃度增加與照射催化反應時間越長，響應電流值也越高。根據EDS檢測結果顯示，催化劑濃度增加與照射催化反應增長，經陰極掃描會還原較高鎳成份含量至薄膜表面。根據XRD的檢測結果，鍍膜經0至-1 V陰極循環掃描後，部份Cu2O會還原成銅至鍍膜表面。

In this syudy, Cu2O films were electrodeposited on the FTO transparent conducting glass. A conventional cell of 3-electrodes was used for the photoelectrochemical testings. The water solution for the experiments consists of 0.5 M Na2SO4 and additive of NiSO4. The NiSO4 plays a role as a catalyst for the promotion of hydrogen production. All tested samples are (111) prefer-orientated. A halogen lamp of 150 W was used as the light source for the experiment of photoelectrochemical properties. Structure and composition of the films were detected by using using XRD,FE-SEM and EDS.
Experimental results show that Cu2O have photoelectrochemical effect. By the cathodic cyclic voltammetry (CV) scan, the cathodic current response for those with additive of NiSO4 catalyst was obviously higher than those without catalyst. The current increased with increasing the content of additive and the time of light exposure. According to EDS results , more additive content and longer exposure time resulted in higher composition of reduced nickel on the film surface. According to the XRD results, the Cu2O film was partly reduced and deposited on the film surface, which was scanned by using cathodic cyclic voltammetry in the range of 0 to -1 V (vs. OCP).

目 錄
明志科技大學碩士學位論文指導教授推薦書 i
明志科技大學碩士學位論文口試委員審定書 ii
明志科技大學學位論文授權書 iii
誌謝 iv
摘要 v
ABSTRACT vi
目 錄 vii
圖目錄 ix
第一章 序論 1
1.1 前言 1
1.2 研究目的 2
第二章 研究背景 3
2.1氧化亞銅簡介 3
2.1.1氧化亞銅性質 3
2.1.2 氧化亞銅光觸媒性質 4
2.1.3光觸媒的催化原理 4
2.1.4 光電化學分解水 5
2.2 鎳催化劑應用產氫研究 8
2.3 電化學沉積法 11
2.3.1 氧化亞銅之電化學沉積 11
第三章 實驗部份 16
3.1 實驗流程圖 16
3.2基板前處理 18
3.3 鍍液用化學藥品 18
3.4 電沉積氧化亞銅製程 18
3.5 電化學測試裝置與溶液配置 19
3.6氧化亞銅膜光性質 20
3.7 電化學測試 21
3.7.1循環伏安測試 22
3.7.2線性掃描伏安測試 23
3.8實驗分析檢測備 24
3.8.1 X光繞射儀 24
3.8.2場發射掃描式電子顯鏡 24
3.8.3 能量散佈光譜儀(EDS) 25
3.8.4紫外光/可見光/紅外光光譜儀 25
3.8.5輪廓儀 27
第四章 實驗結果與討論 28
4.1氧化亞銅結構分析 28
4.2氧化亞銅能隙 30
4.3氧化亞銅電化學檢測 31
4.3.1氧化亞銅開迴路測試 31
4.3.2氧化亞銅光電性質效應 34
4.3.3氧化亞銅作循環伏安測試 37
4.3.4氧化亞銅陰極端作循環伏安測試 39
4.3.5不同掃描速率對氧化亞銅在線性掃描的影響 57
4.3.6氧化亞銅作線性掃描測試 59
4.3.7 定電位掃描對氧化亞銅的影響 74
4.3.8添加催化劑對於增加電流反應之探討 82
第五章 結論 83
第六章 參考文獻 85

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