臺灣博碩士論文加值系統

Recently, one-dimensional metal silicide nanostructures have been extensively studied, because it can be applied to electronic and optoelectronic devices, such as schottky-barrier field effect transistors and field emission devices.
In this study, free-standing SiNW arrays were fabricated by the combining nanosphere lithography with metal-assisted catalytic etching. Then, cobllt silicide/Si heterostructure NW arrays were formed by a glancing angle deposition technique and a solid-phase reaction. The effects of annealing temperature of SiNWs on the formation of cobalt silicide/Si heterostructure NWs were investigated. In addition, the emission and electrical properties of the heterostructure NWs were examined.
The results show that the widths of the SiNWs were in the range of 170–190 nm. The activation energy for the formation of SiNWs, was 0.26 eV. After annealing at 500℃, the Co2Si phase with small grain size were formed in the front-end of SiNWs. After annealing at 600 and 700℃, polycrystalline Co2Si and CoSi phases coexisted in the front-end of SiNWs. The reaction rate for cobalt silicide formation increased with increasing temperature. On the other hand, the porous structure was formed in the front-end of SiNW because Si atoms is a dominant diffusing species during cobalt silicide formation. The cobalt silicide/Si heterostructure NWs formed by annealing at 500℃ has the lowest turn-on field, was 0.53 V/μm.

摘要...I
Abstract...II
表目錄...VII
圖目錄...VIII
第一章 前言...1
第二章 文獻回顧...3
2-1 奈米球微影術...3
2-1-1 奈米球微影術...3
2-1-2 奈米球自組裝機制...3
2-2 奈米球自組裝技術...4
2-2-1 自然滴製法...4
2-2-2 LB-like 自組裝技術...5
2-2-3 旋轉塗佈法...5
2-3 反應式離子蝕刻技術...6
2-4 矽奈米線...6
2-4-1 從下而上（Bottom-up）方式成長矽奈米線的機制...7
2-4-1-1 氣-液-固成長機制（Vapor-Liquid-Solid Mechanism,
VLS)...7
2-4-1-2 氧化物輔助成長機制（Oxide-Assisted Growth
Mechanism, OAG)...7
2-4-1-3 固-液-固成長機制(Solid-Liquid-Solid Mechanism,
SLS)...7
2-4-2 矽奈米線成長方法...8
2-4-2-1 化學氣相沈積法（Chemical Vapor Deposition, CVD） ...8
2-4-2-2 雷射消融法（Laser Ablation)...8
2-4-2-3 熱蒸鍍法（Thermal Evaporation)...8
2-4-2-4 金屬輔助催化蝕刻法(Metal-Assisted Chemical
Etching)...8
2-4-2-5 無電鍍化學蝕刻法...9
2-5 金屬矽化物...10
2-6 研究動機與目的...11
第三章 實驗步驟...12
3-1 製備聚苯乙烯球陣列與矽奈米線陣列...12
3-1-1 基材前處理...12
3-1-2 自組裝聚苯乙烯球陣列...13
3-1-3 縮減聚苯乙烯球作為微影之遮罩...13
3-1-4 鍍銀金屬作為催化劑...13
3-1-5 製備矽奈米線陣列...13
3-1-6 製備鈷矽化物/矽異質結構奈米線...14
3-2 鈷矽化物/矽異質結構奈米線陣列之場發性質量測...14
3-3 鈷矽化物/矽異質結構奈米線陣列之接面電性量測...14
3-4 實驗與分析儀器...15
3-4-1 感應耦合式電漿蝕刻系統...15
3-4-2 精密離子蝕刻鍍膜系統(Precision Etching Coating
System)...15
3-4-3 場發射掃瞄式電子顯微鏡（Field Emission-SEM)...15
3-4-4 穿透式電子顯微鏡（TEM)...15
3-4-5 高解析穿透式電子顯微鏡（HRTEM)...15
3-4-6 原子力顯微鏡（AFM)...16
第四章 結果與討論...17
4-1 利用奈米球陣列作為微影之遮罩...17
4-1-1 影響奈米球排列之因素...17
4-1-2 反應式離子蝕刻聚苯乙烯球...18
4-1-3 金屬輔助催化蝕刻法製備矽奈米線陣列...19
4-2 鈷矽化物/矽異質結構奈米線之製備及結構分析...21
4-2-1 鈷矽化物/矽異質結構奈米線結構分析...21
4-2-2 退火溫度對於鈷矽化物/矽異質結構奈米線表面性質影響 ...23
4-2-3 場發特性...23
4-2-4 鈷矽化物/矽異質結構奈米線之接面電性...25
第五章 結論...26
參考文獻...68

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