臺灣博碩士論文加值系統

本論文主要利用半導體製程技術結合微機電技術來製作高感度的微型帶狀式麥克風。在帶狀式麥克風感應線路設計上，為了增加感應線路切割磁場後所產生的電訊號，設計出以雙層感應線路，進而提高微型帶狀式麥克風輸出感度，並提出以不同形狀振膜開孔之方式，有效釋放振膜應力，進而提升振膜的振動速度與機械感度，並獲得良好的麥克風靈敏度。SU-8 1040光阻材料作為帶狀式麥克風振膜，易於運用黃光顯影製程技術在振膜結構上設計開孔圖形。
SU-8 1040光阻材料另一個優點是採低溫製程減少振膜與基板因熱膨脹係數不同所造成異質應力的產生。在本論文中，雙層感應線路設計下其感應線路尺寸為17 mm×3 mm×0.003 mm並將振膜兩邊開長方形開孔，振動速度為4.85 um/s。在1 kHz取樣頻率下，搭配變壓器後，量測其頻率響應值為-42.6 dBV/Pa，相當於輸出感度為7.41 mV/Pa。

In this thesis, we have presented a high sensitive miniature ribbon microphone fabricated with a combination of semiconductor manufacturing and micro-electro-mechanical system techniques. For the circuit design within ribbon microphone, the dual induction circuit was introduced in order to amplify the signal from induction coil cutting magnetic field. Furthermore, the vibration velocity and sensitivity of diaphragm were significantly improved by altering its shape as a consequence of releasing diaphragm strain. The miniature ribbon microphone thus possesses of a higher sensitivity.
SU-8 1040 was used as a main material of the diaphragm in miniature ribbon microphone since it was more compliant to the lithophotography that we implemented in this study. Another advantage of using SU-8 1040 is a lower process temperature, which reduced the extrinsic stress induced by the difference of thermal expansion coefficient between diaphragm and substare. The dimension of dual induction circuit was 17 mm×3 mm×0.003 mm for rectangular shape. With this design,the vibration rate reached 4.85 um/s. The frequency response of miniature ribbon microphone was -42.6 dBV/Pa (@1k Hz), corresponding to a sensitivity of 7.41 mV/Pa.

誌謝 i
中文摘要 ii
Abstract iii
目錄 iv
表目錄 vii
圖目錄 viii
第一章 緒論 1
(一) 前言 1
(二) 帶狀式麥克風發展歷史回顧 1
(三) 速度型麥克風簡介 3
(四) 論文架構 5
第二章 微型化帶狀式麥克風之基本原理說明 6
(一) 前言 6
(二) 帶狀式麥克風之感應電動勢 6
(三) 麥克風靈敏度 8
(四) 麥克風之機械感度 9
(五) 麥克風雜訊 10
(六) 麥克風振動速度量測原理 12
(七) 帶狀式麥克風之頻率響應 13
第三章 微型化帶狀式麥克風設計與模擬分析 15
(一) 前言 15
(二) 微型化帶狀式麥克風設計考量 15
(三) 振膜設計 16
(四) 感應線路設計 17
(五) 模擬結果與分析 17
第四章 微型化帶狀式麥克風製造 20
(一) 前言 20
(二) 微型化帶狀式麥克風元件製程 20
1. 單層感應線圈製程 21
2. 雙層感應線圈製程 24
第五章 結果與討論 29
(一) 前言 29
(二) 製程中遭遇問題與解決方法 29
(三) 製程結果與討論 33
(四) 麥克風機械感度量測 33
(五) 麥克風振動速度量測 36
(六) 麥克風頻率響應量測 38
第六章 結論與未來展望 41
(一) 結論 41
(二) 未來展望 42
參考文獻 43

[1]P. Hoffmann, “The history of the German resistance,1933-1945,” McGill Queens Univ Pr, p. 307, 1996.
[2]http://knol.google.com/k/ribbon-speaker#
[3]F. Harry, Olson, “A History of high-quality studio microphones”, J. Acoust. Soc., vol. 24, pp. 798-807, 1976.
[4]http://www.coutant.org/pb31/index.html
[5]http://www.wesdooley.com/aea/ds_R44C_et_al.html
[6]http://www.acesandeighths.com/microphone_evo.html
[7]F. Harry, Olson, “Microphones for recording”, J. Acoust. Soc., vol. 25, pp. 676-683, 1977
[8]http://homepage.mac.com/oldtownman/recording/microphones2.html
[9]韓鐘恩、靳學東主編, “中國音樂年鑒,” 文化藝術出版社, pp. 142-143, 1991.
[10]E. Joseph, Blanton, “The organ in church design”, Venture Press, pp. 471-475, 1957.
[11]R. C. Coile, “The Development of Modern Microphones”, J. Acoust. Soc. Am. vol. 11, p. 163, 1931.
[12]J. Eargle, “The microphone book,” Oxford: Elsevier Press, 2nd ed., pp. 50-84, 2004.
[13]R. H. Horng, K. F. Chen, Y. C. Tsai, C. Y. Suen and C. C. Chang, “Fabrication of a dual-planar-coil dynamic microphone by MEMS techniques,” J. Micromechanics and Microengineering, vol. 20, pp. 1-3, 2010.
[14]M. L. Ke, R. H. Horng, Y. C. Tsai, G. W. Chen and C. C. Chang, “Design and simulation of miniature ribbon microphones,” J. Micro/Nanolithography, vol. 021160, pp. 1-5, 2009.
[15]O. Bobby, “The recording engineer’s handbook”, Course Technology Prt Press, p. 6, 2009
[16]O. Bobby, “The recording engineer’s handbook”, Course Technology Prt Press, p. 3, 2009
[17]M. L. Gayford, ”Electroacoustic microphones, earphones and loudspeakers”, London: Newnes-Butterworths Press, pp. 148-156, 1970.
[18]M. P. Norton, “Fundamentals of noise and vibration analysis for engineer”, New York: Cambridge University Press, pp. 197-200, 1969.
[19]M. Mullenborn, P. Rombach, U. Klein, K. Rasmussen, J. F. Kuhmann, M. Heschel, et al., ”Chip-size-packaged silicon microphones”, Sens. Actuators A, vol. 92, pp. 23-29, 2001.
[20]A. G. H. van der, Donk, P. Bergveld and J. A. Voorthuyzen, “Optimal design of electret microphone MOSFET preamplifier”, J. Acoust. Soc., Am., vol. 91, pp. 2261-2269, 1992.
[21]揚善國, “感應與量測度工程,” 全華科技圖書股份有限公司”, p. 7, 2003.
[22]P. M. Morse, “Vibration and aound, international series in pure and applied physics,” New York: McGraw-Hill Press, 2nd ed., p. 189, 1948.
[23]W. R. Bevan, R. B. Schulein, and C. E. Seeler, “Design of a studio-quality condenser microphone using electret technology,” J. Audio Eng. Soc. vol. 26, p. 947, 1978.
[24]B. B. Bouer, and Shure Brothers, “Equivalent circuit analysis of mechanical-acoustic structures,” Inc. Chicago, Illinois, p. 112, 1954.
[25]白明憲, “工程聲學,” 全華科技圖書股份有限公司出版, p. 5, 2005.
[26]陳建盛, “矽晶麥克風之設計與製作, ” 國立交通大學電機與控制工程系碩士論文, 民國88年.
[27]H. S. Noh et al., “Miniature corrugated diaphragm for fiber- opitc- linked pressure sensing (FOLPS)”, ASME Int. Mechanical Engineering Congress & Exposition Proceedings of IMECE’03, pp. 1-5, 2003.
[28]王以真, “實用磁路設計,” 全華科技圖書有限公司出版, p. 189, 2006.
[29]R. D. Mikkola, Q. T. Jiang, and B. Carpenter, “Plating and Surface Finishing,”American Electroplaters Society, p. 81, 2000.
[30]H. S. Noh et al., “Miniature corrugated diaphragm for fiber- opitc-linked pressure sensing (FOLPS)”, ASME Int. Mechanical Engineering Congress & Exposition Proceedings of IMECE’03, pp. 2-5, 2003.
[31]孫誠佑, 微型化帶狀式麥克風製程研發與特性量測, 國立中興大學精密工程研究所碩士論文, 民國99年.