[1] 李家柱,林安,“六價鉻電鍍替代技術研究現況及應用”,表面工程資訊,p7-8,2005。
[2] 周淑金,王正全,“綠色表面處理-六價鉻替代技術的發展”,中華民國電子零件認證委員會,第五十期,2006。[3] 趙力, “Ni-Co-B合金鍍層的研究”,北京航空航天大學碩士論文,2003。
[4] 熊楚強,王月,“電化學”,文京圖書有限公司,1997。
[5] 陳黼澤,“替代六價鉻製程研究”,國立台灣大學機械工程學研究所博士論文,2009。[6] 陳亞,“現代實用電鍍技術”,國防工業出版社,2002。
[7] 渡邊轍,小若正倫,馬場宣良,于維平,李獲澤,“非晶態電鍍方法及應用”,北京航空航天大學出版社,30-65,1992。
[8] 周婉秋, “Ni-W非晶態鍍層的製備和性能研究”,電鍍與塗飾15(14) 18-24,1996。
[9] 石井英雄,“日本電鍍指南”,湖南科學技術出版社,125,1985。
[10] I. Brooks, U. Erb, “Hardness of electrodeposited microcrystalline and nanocrystalline γ-phase Zn-Ni alloys”, Scripta Materialia,44(5) 853-858, 2001.
[11] R. T. C. Choo, J. M. Tougri, A. M. El-Sherik, “Mass transfer and electrocrystallization analyses of nanocrystalline nickel production by pulse plating”, Journal of Applied Electrochemistry, 25(4) 384-403, 1995.
[12] A. M. El-Sherik, U. Erb, J. Page, “Microstructural evolution in pulse plated nickel electrodeposits”, Surface and Coatings Technology, 88(1-3) 70-78, 1997.
[13] 王曉強,“電沉積Ni-W-P合金及Fe-Ni/Ni-W-P雙層合金的性能與應用”,湖南大學碩士論文,2008。
[14] H. G. Li “Metallurgy of rare metals”, Beijing:Metallurgical Industru Press, p5-20, 1990.
[15] A. Brenner, “Electrodeposition of Alloys”, New York, Academic Press, p347-415, 1963.
[16] M. L. Holt, L. L. Vaaler, “Codeposition of tungsten and iron from an aqueous ammoniacal citrate bath”, Journal of the Electrochemistry Society, 94(5)252-261, 1948.
[17] G. L. Davis, C. H. R. Gentry, “The EIectrodeposition of Tungsten”, Metallurgia, 53(1):p3-17, 1956.
[18] K. S. Jachson, A. S. Russell, J. L. Merrill, “The Electrolytic Deposition of Tungsten at a Mercury Cathode”, Journal of the Electrochemistry Society:p2394-2398, 1929.
[19] W. E. Clark, M. H. Lietzke, “The mechanism of the tungsten alloy plating process”, journal of the Electrochemistry Society, 99(6):245-249, 1952.
[20] M. L. Nielsen, M. L. Holt, “Electrodeposition of nickel-tungsten alloys from an acid plating bath”, transactions of the Electrochemical Society,82(11): 217-222, 1942.
[21] A. T. Vasko, “Encyclopedia of electrochemistry of the elements”, New York: A.J.Bard, Marcel Dekker, p69, 1986.
[22] 楊防祖,黃令,“鎳鎢合金電沉積伏安特性和出其行為的研究”,電鍍與塗飾,18(1):1-3,1999。
[23] 楊防祖,“鎳鎢硼合金電沉積機理及鍍層微晶尺寸”,電化學,6(2):169-174,2000。
[24] B. Schariflker, G. Hills, “Theoretical and experimental studies of multiple nucleation”, Electrochimica Acta, 28(7):879-889, 1983.
[25] O. Younes and E. Gileadi, “Electroplating of High Tungsten Content Ni-WAlloys”, Electrochemical and Solid-State Letters, Vol. 3, p543-545, 2000.
[26] O. Younes, L. Zhu, Y. Rosenberg, Y. Shacham-Diamand, E. Gileadi,“Electroplating of Amorphous Thin Films of Tungsten/Nickel Alloys”, Langmuir, Vol. 17, p8270-8275, 2001.
[27] O. Younes and E. Gileadi, “Electroplating of Ni/W Alloys”, Journal of TheElectrochemical Society, Vol. 149, No. 2, p100-111, 2002.
[28] L. Zhu, O. Younes, N. Ashkenasy, “STM/AFM studies of the evolution of morphology of electroplated Ni/W alloys”, Applied Surface Science 200(1-4):1-14, 2002.
[29] O. Younes, L. Zhu, E. Gileadi, “The anomalous codeposition of tungsten in the presence of nickel”, Electrochimica Acta 48(18):2551-2562, 2003.
[30] C. G. Fink, F. L. Jones, Trans, “Electrochem”, Soc.59, p461-481, 1931.
[31] M. L. Nielsen, M. L. Holt, “Electrodeposition of nickel-tungsten alloys from an acid plating bath”, transactions of the Electrochemical Society, 82(11): 217-222, 1942.
[32] N. Isaev and J. G. Osteryoung, “Electrodeposition of Ni-W-B amorphous alloys”, Journal of applied electrochemistry, 25:1091-1097, 1995.
[33] Wu Yiyong, Chang Doyon, Kim Dongsoo, and Kwon Sik-Chol, “Influence of boric acid on the electrodepositing process and structures of Ni-W alloy coating”, Surface and coatings technology, 173:259-264, 2003.
[34] T. Yamasaki, R. Tomohira, Y. Ogino, P. Schlossmacher and K. Ehrlich,“Formation of Ductile Amorphous & Nanocrystalline Ni-W Alloys by Electrodeposition”, Plating & Surface Finishing, Vol. 87, p148-152, 2000.
[35] T. Yamasaki, “High-Strength Nanocrystalline Ni-W Alloys Produced by Electrodeposition and Their Embrittlement Behaviors during Grain Growth”, Scripta Materialia, Vol. 44, p1497-1502, 2001.
[36] T. Watanabe, “Nano plating”, Elsevier, Boston, p25, 2004.
[37] 方景禮,“電鍍配合物理論與應用”,化學工業出版社,2007。
[38] 方景禮,“多元錯合物電鍍”,國防工業出版社p344-345,1983。
[39] R. M. Krishnan , C. Joseph, “Electrodeposition of nickel-tungsten alloys”, Metal finishing, p733-739, 1995.
[40] J. J. Cruywagen, L. Kruger, and E. A. Rohwer, “Complexation of Tungsten(VI) with Citrate”, J. Chem. Soc. Dalton Trans., p1727-1731, 1991.
[41] Chen Fu Je, Huang Da Chan, Lin Chao-Sung, “Microstructure and mechanical property of nickel-tungsten electrodeposition”, journal of C.C.I.T,39(1), 2010.
[42] Zhu Li Gun, Xue Zhen, Wu Kun Hu. “Effect of electroplating process on color of Ni-W decorative deposits alternative to chromium”, journal of jiangsu university,29(1), 2008.
[43] 鮮祺振,“腐蝕控制”,財團法人徐氏基金會出版,1998。
[44] 莊哲豪,“陽極處理之低碳鋼熱浸鍍鋁於氯化鈉水溶液與高溫環境之腐蝕行為探討”,國立台灣科技大學碩士學位論文,2009。[45] 柯賢文,“腐蝕及其防制”,全華科技圖書公司,1998。
[46] Denny A Jones, “Principles And Prevention Of Corrosion”, 2nd ed. , Prentice Hill, 1996.
[47] Stern and A. L. Geary, “Electrochemical Polarization, A Theoretical Analysis of the Shape of the Polarization Curves”, J. Electrochem. Soc.,Vol 104, p56, 1957.
[48] Marcel Pourbaix, “Atlas of Electrochemical Equailibria in Aqueous Solutions”, National Association of Corrosion Engineers, 1974.
[49] 盈吉化工原料有限公司,“電鍍操作手冊”,2010。
[50] 方景禮,“電鍍添加劑理論與應用”,國防工業出版社,北京,2007。[51] International Color Consortium, Specification ICC.1:2004-10 (Profile version 4.2.0.0) Image technology colour management -Architecture, profile format, and data structure, 2006.
[52] Standard test method for specular gloss, American Society For Testing and Materials(ASTM), Designation:D523, 1989.
[53] L. M. Chang, Z. T. Wang, “Study on microstructure and properties of electrodeposited Ni-W alloy coating with glycolic system”, Journal of Alloys and Compounds, 509:1501-1504, 2011.