臺灣博碩士論文加值系統

在本論文中，將提出以本實驗室開發完成的矽基光學平台(Silicon Optical Bench, SiOB ) 為核心之收發模組的開發評估、實作及高頻量測；此平台具有微型化被動對準、光程短的優勢，以及高深度45°微反射面提供光路非共平面轉折，在光學連接模組之應用上具有相當潛力。
本論文提出之模組為一雙向4通道×10-Gbps之收發模組，其中包含：雙向光學組裝件(Bi-Directional Optical Sub-Assembly, BOSA) 、接收端與發射端之驅動積體電路(Driver IC)、12芯帶狀光纖封裝(Fiber Mounting) 和高頻電路板之設計。光學組裝件與印刷電路板之間以 COB(Chip-on-Board)方式整合; 在模組高頻量測中，發射端在常溫下可通過裕度(Margin) 25%的10G-Ethernet眼罩(Eye Mask)，接收端之誤碼率可達到10-12等級，證實此光學收發模組具有雙向平行化4通道×10-Gbps的資料傳輸能力，可運用於板對板(Board to Board)間的資料傳輸。

In this thesis, a bi-directional 4-channels×10-Gbps optoelectronic transceiver base on this Silicon Optical Bench technology is proposed. This transceiver including a Bi-Directional Optical Sub-Assembly (BOSA), transmitter driver IC, receiver TIA, Fiber ribbon assembly and PCB with high frequency trace design. BOSA and PCB have some specific design for conventional Chip-on-Board (COB) process. In eye diagram measurement, the transmitter can pass 10-G Ethernet eye mask with 25% margin at room temperature; Bit error rate (BER) of Receiver can achieve 10-12 order, which confirm the transceiver’s ability of 10-Gbps data transmission.

第一章 緒論 1
1-1 前言 1
1-2 研究動機與目的 3
1-3 以矽基光學平台為核心之收發模組架構 5
第二章 光連接收發模組結構與設計 8
2-1 收發雙向光學組裝件 8
2-1-1 矽基光學平台 9
2-1-2 面射型雷射與光檢測器 12
2-2 驅動積體電路 14
2-3 高頻印刷電路板 16
第三章 光連接收發模組製程與封裝 19
3-1 COB製程 19
3-2 金屬連接線對高頻特性影響 22
3-2-1 金屬連接線長度之影響 22
3-2-2 導線封膠之影響 24
3-3 光纖陣列封裝 25
第四章 光連接收發模組之高頻特性量測 28
4-1 量測架構 28
4-2 發射端眼圖量測 30
4-2-1 驅動電流對眼圖之影響 30
4-2-2 不同環境溫度對眼圖之影響 35
4-2-3 耦光效率對眼圖之影響 37
4-2-4 發射端結果討論 38
4-3 接收端眼圖量測 40
4-3-1 不同輸入光源之眼圖比較 40
4-3-2 不同環境溫度之眼圖比較 42
第五章 結論 44
參考文獻 45

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