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研究生:魏鼎宇
研究生(外文):Wei, Ding-Yu
論文名稱:無外部電容之近場無線電源積體電路
論文名稱(外文):Near-Field Wireless Power Integrated Circuit without External Capacitors
指導教授:黃弘一
指導教授(外文):Huang, Hong-Yi
口試委員:蘇朝琴江正雄黃弘一
口試委員(外文):Su, Chau-ChinChiang, Jen-ShiunHuang, Hong-Yi
口試日期:2011-07-21
學位類別:碩士
校院名稱:國立臺北大學
系所名稱:電機工程研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2011
畢業學年度:99
語文別:中文
論文頁數:86
中文關鍵詞:近場無線傳能無外接電容電源拒斥可靠度
外文關鍵詞:Near-field wireless powerExternal capacitor lessPSRReliability
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  現今無線傳能技術廣泛應用於生醫電子及RFID等積體電路系統,利用無線方式傳遞電能與訊號。縮小接收端元件尺寸為目前許多研究努力的方向[1]-[5]。而隨著製程進步,電晶體耐壓因閘極厚度下降而減低,如何在次微米製程下設計可靠的電源積體電路也是一大挑戰。本研究提出一無外接電容之近場無線電源積體電路,除了傳能耦合線圈外,無其他外接元件,並提升了可靠度。測試晶片以台積電0.18μm 1P6M標準製程實現,晶片面積為0.804 × 0.986 mm2。透過晶片量測驗證,當不同大小的交流電壓由傳送端耦合至接收端,接收端皆能產生穩定之1.8V直流輸出電壓,以供給1mA負載電流。其中輸出電壓漣波小於1%輸出電壓。
  Recently wireless power transmission technology is widely used by biomedical electronics, RFID and the other integrated circuit systems. It transmits energy and signal through wireless communication. The trend is to reduce the device size at the receiver’s side as presented by several studies [1]-[5]. With the advancement of process technologies, the withstand voltage of transistors are decreased by reducing the thickness of gate oxide. So, to design a reliable power integrated circuit becomes a big challenge. This research presents a near-field wireless power integrated circuit without external capacitors, no other external components are needed but the coupling coil and the systems’ reliability is also enhanced. The test chip is implemented by TSMC 0.18μm 1P6M process and the chip area is 0.804 × 0.986 mm2. The measurement result shows that the receiver can generate a stable 1.8V DC output voltage to supply 1mA output current under different amplitudes of the coupling input voltage from transmitter. The output voltage ripple is less than 1% of output voltage.
謝 辭 I
中文論文提要 III
英文論文提要 IV
目 錄 V
圖目錄 VIII
表目錄 XII

第一章 緒 論 1
1.1 研究動機與目的 1
1.2 論文章節說明 1

第二章 無線電源簡介與先前技術探討 3
2.1 無線電源傳輸簡介 3
2.2 各子電路先前技術探討 4
2.2.1 整流電路(Rectifier) 4
2.2.2 限壓電路(Limiter) 15
2.2.3 穩壓電路(Regulator) 16
2.3 相關近場無線傳能系統電路 20

第三章 無外部電容無線電源電路架構 22
3.1 架構分析 22
3.1.1 差動式CMOS全波整流電路 23
3.1.2 高頻寬電源供應拒斥之低壓降穩壓電路 29
3.1.3 疊接Power NMOS與低通濾波器 31
3.1.4 Bandgap電壓電路 33
3.1.5 兩級式運算放大器 35
3.1.6 限壓電路 (Voltage Limiter) 38
3.2 設計考量 40

第四章 電路佈局與佈局後模擬結果 42
4.1 電路佈局 42
4.1.1 整流電路佈局 43
4.1.2 穩壓電路和限壓電路整體佈局 44
4.1.3 兩級式運算放大器佈局 45
4.1.4 減法電路佈局 46
4.1.5 限壓電路佈局 48
4.1.6 Power MOS佈局 48
4.1.7 核心電路佈局 50
4.1.8 整體電路佈局 51
4.2 佈局後模擬結果 52
4.2.1 電流路徑上主要節點電壓 52
4.2.2 不同corner下之輸出電壓 54
4.2.3 限壓電路操作 55
4.2.4 穩壓電路之PSR 56
4.2.5 穩壓電路特性 58
4.2.6 Bonding電感效應 66
4.3 穩壓電路規格比較 68

第五章 晶片量測 70
5.1 測試板規劃 70
5.2 晶片測試 71
5.3 無線傳能測試 74

第六章 結論與未來研究方向 82
6.1 結論 82
6.2 未來研究方向 82

參考論文 83


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