臺灣博碩士論文加值系統

量測技術是工業上尺寸驗證中不可或缺的一環，隨著東西微小化與精度的提升，顯微量測技術更是日趨重要，相較於接觸式量測，非接觸式量測有更大的量測彈性，所以光學顯微量測技術已經成為微小量測的發展趨勢。
本研究以共焦顯微鏡量測方式(Confocal microscopy)作為理論基礎，去除掉濾光針孔以面光源全域方式進行量測，並配合彩色共焦微術(Chromatic confocal microscopy)與雜訊消除技術，以本研究室所發展的RG-ratio演算法進行物體三維輪廓重建(3D profile reconstruction)；為改善量程的不足，於系統添加差動式共焦顯微術(Differential confocal microscopy)演算法，使用三原色混成之白光光源，針對單一像素找出其對應的深度反應曲線(Depth response curve)，以單色深度反應曲線之斜邊為線性方程，最後取得單張景深(Depth of focus)範圍內之影像，即可對影像上每一像素做比值對深度的運算，進而重建待測物表面輪廓，以此方式將量程由5μm增加為20μm。
本研究開發出一套多波長大量程3D顯微探頭(chromatic wide-range microscopic probe)之技術，除了針對微奈米三維結構進行量測，並搭配基本折射理論量測透明薄膜之厚度與折射率。此系統由探頭光機模組及訊號處理模組兩部份構成，探頭光機模組由鹵素光源及光纖模組、準直透鏡、分光鏡、顯微物鏡、三色CCD元件及本研究自製的聚焦模組所組成；訊號處理模組含輸入光強之自動功率控制電路及正規化訊號之處理電路。搭配大量程聚焦模組對待測件進行一次掃描校正後，即可以對同一材質工件以單張影像重建待測物之輪廓，尺寸計算及視覺影像由PC負責顯示。本系統機構掃描範圍可達3mm、解析度0.1 μm、重複性0.2 μm，針對階高型結構可達到解析度為0.1 μm，量測重複可達0.1 μm。

With improvement of fabrication precision and increasing miniaturization of structure, measuring technology has become an important part in industry. non-contact measurement technology is more flexible than contact one, so it has been a trend for developing micro optical measurement technology.
The research was based on “confocal microscopy” theory. Unlike traditional confocal microscope, a pinhole of the microscopic system is replaced by the objective to filter non-axial beam and generate an area light for full-field measurement. By using innovative multi-wavelength light correlation and digital image processing, a 3D-profile can be reconstructed by taking one picture of the measured sample. However, the measuring range is only 5 μm. In order to increase the measuring range, the differential microscopy algorithm was developed in the research. After longitudinal scanning, the depth response curve of any pixel on an image can be acquired and a linear function can be obtained from a sloping side of the depth response curve. Then the 3-D profile can be reconstructed by the linear function. In addition, the microscopy can also be utilized to measure the thickness and refractive index of a transparent plate with the law of refraction.
A compact chromatic wide-range full field 3-D profilometer was developed by a halogen light source and coaxial optical configuration with a 3-chip CCD camera for individual light sensing. A vertical scanning module was invented for auto-focusing and calibration. The scanning range and accuracy of the module are 3 mm and 0.2 μm. From analysis of the measurement results, the 3-D profilometer was confirmed that the accuracy on the height measurement was 0.2 μm.

誌謝 .................................................................................................................................. I
摘要 ................................................................................................................................. II
Abstract ........................................................................................................................... III
目錄 ............................................................................................................................... IV
圖目錄 .......................................................................................................................... VIII
表目錄 .......................................................................................................................... XIII
Chapter 1 緒論 .............................................................................................................. 1
1-1 動機 ................................................................................................................... 1
1-2 量測法回顧 ....................................................................................................... 2
1-3 研究目的 ........................................................................................................... 4
1-4 研究方法與創新 ............................................................................................... 5
1-5 論文架構 ........................................................................................................... 6
Chapter 2 共焦量測原理與文獻回顧 .......................................................................... 7
2-1 共焦量測原理 .................................................................................................... 7
2-2 文獻回顧 .......................................................................................................... 11
2-2-1 三維輪廓量測文獻 ............................................................................. 11
2-2-2 薄膜量測文獻 .................................................................................... 21
Chapter 3 系統架構與設計原理 ................................................................................ 26
3-1 聚焦量測原理 .................................................................................................. 26
3-2 深度反應曲線 ................................................................................................. 28
3-3 全域影像Cross talk ........................................................................................ 29
3-4 三維立體顯微系統量測原理 ......................................................................... 31
3-4-1 多波長量測原理 ................................................................................ 31
3-4-2 差動式量測原理 ................................................................................ 34
3-4-3 掃描式量測原理 ................................................................................ 36
3-5 薄膜量測原理 ................................................................................................. 37
3-6 光學系統設計原理與分析 ............................................................................. 40
3-6-1 系統設計原理 .................................................................................... 40
3-6-2 光學系統分析 .................................................................................... 41
3-7 量測系統硬體架構 ......................................................................................... 49
3-8 聚焦模組設計 ................................................................................................. 51
3-9 Michelson 干涉儀原理 .................................................................................... 54
3-9-1 量測原理 ............................................................................................ 54
3-9-2 多工式干涉模組之研製 .................................................................... 56
3-9-3 模組化Michelson 干涉儀 ................................................................. 57
3-10 系統模組設計 ............................................................................................... 59
3-11 本章小結 ....................................................................................................... 64
Chapter 4 量測原理與演算法 .................................................................................... 65
4-1 高斯函數分布 ................................................................................................. 65
4-2 最小平方法曲線擬合 ..................................................................................... 67
4-3 濾波技術 ......................................................................................................... 69
4-3-1 時間濾波 ............................................................................................ 70
4-3-2 低通濾波 ............................................................................................ 71
4-3-3 中值濾波 ............................................................................................ 71
4-4 自動聚焦演算法 ............................................................................................. 72
4-4-1 最大梯度值 (Tenenbaum Gradient) .................................................. 73
4-4-2 拉普拉斯能量法(Energy Laplacian) ................................................. 74
4-4-3 變異數 (Variance) ............................................................................. 75
4-5 旋轉平面應用 ................................................................................................. 76
4-6 場曲校正 ......................................................................................................... 78
4-7 橫向解析度的校正 ......................................................................................... 79
4-8 利用OTSU 進行邊緣偵測 ............................................................................ 81
4-9 程式計算流程 ................................................................................................. 83
4-9-1 三維表面輪廓 .................................................................................... 83
4-9-2 薄膜厚度、折射率量測 .................................................................... 85
4-10 系統軟體介面 ............................................................................................... 86
4-11 本章小結 ....................................................................................................... 87
Chapter 5 實驗結果 .................................................................................................... 88
5-1 灰階值飄移實驗 ............................................................................................. 88
5-2 系統場曲平面校正 ......................................................................................... 90
5-3 量測之橫向解析度 ......................................................................................... 91
5-4 自動聚焦演算法測試 ..................................................................................... 92
5-5 聚焦模組定位誤差測試 ................................................................................. 95
5-6 系統NA 值校正 ............................................................................................. 96
5-7 實物量測 ......................................................................................................... 99
5-7-1 2 μm 週期性三角結構階高量測 ...................................................... 99
5-7-2 20 μm 週期性結構階高量測 ........................................................... 101
5-7-3 3 mm 標準階高量測 ........................................................................ 104
5-7-4 透明薄膜折射率量測 ...................................................................... 106
5-8 本章小結 ....................................................................................................... 108
Chapter 6 結論與未來展望 ....................................................................................... 110
6-1 結論 ................................................................................................................ 110
6-2 未來展望 ........................................................................................................ 112
參考文獻 ....................................................................................................................... 113
附錄A 相關元件設備規格 ......................................................................................... 115

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