臺灣博碩士論文加值系統

本論文為改善現行基板設計問題，以達到Co-design 為目標，提出一個Package IP 的
構想，要研究一套在構裝基板設計初期能做IC+PKG+PCB Co-simulation 的方法，達到
快速的預先模擬及提高設計品質的目的。
我們將BGA 構裝基板依結構拆解，分成許多分段的模型，而藉由電磁模擬軟體將
這些分段模型的效應個別萃取出後，並經由電路設計軟體將其效應串接，來與完整的模
型做比較，發現此方法可以有效的表現完整模型的效應達8GHz，並經由量測來驗證模
擬的準確性，如此一來只需將分段的模型製作成參數化的元件後，讓設計者輸入需求的
元件尺寸，並藉由電路軟體的操作，即可在基板設計的初期做預先的模擬，短短幾分鐘
的時間即可預知設計的大略結果，達到縮短設計時程及提高設計品質的目的。
本研究討論訊號在基板穿層時將在接地及電源層間產生共振腔效應，故並未將接地
及電源層做短路。文中將討論共振腔體現象及原理，並經由實際樣品的量測與模擬來相
互驗證，得知基板介電材料的介電係數會隨頻率的上升而微微下降，其準確性取決於量
測的準確性，約可達20GHz 以上。

In this thesis, a set of analysis tools and techniques in initial stage of the design process is presented for co-design. To detach signal traces of BGA substrate in several segmented models by structure.
We detach the BGA substrate to many segmented models by structure, and extract the effect of these segmented models by electromagnetic simulation software, to combine the effects by circuit design software and compare with the whole model and measurement result, found that the accuracy of this method is effective up to 8GHz. To make the parameters components from the effect of segmented models and pre-simulate in the initial stage of substrate design. Just a few minutes, you can roughly predict the results of the design, that will achieve the purpose of reduce the cycle time and improve the design quality.

　　In this study, to discuss the cavity resonance effect of signal through the substrate between the ground and power planes, the ground and power planes are not shorted. The text will discuss the phenomenon and principles of resonant cavity, and by the actual sample measurement and simulation to mutual authentication, the accuracy about up to 20GHz or more.

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
圖目錄 v
表目錄 viii
第一章 緒論 1
1.1 研究動機與目的 1
1.2 章節介紹 4
第二章 有機基板製程與系統構裝三維互連線路技術研究 5
2.1 構裝基板結構介紹 5
2.2 基板製程介紹 8
2.3 單端訊號傳遞的不連續現象探討 12
第三章 共振腔體與鍍穿孔饋入之模態分析驗證 14
3.1 簡介 14
3.2 共振頻率與訊號源饋入位置的影響 15
3.3 訊號源在不同饋入位置之分析模擬 17
3.4 實際樣品量測與結果討論 26
第四章 高頻電路的分段模型化研究 30
4.1 傳輸線分段模型化模擬 31
4.2 構裝基板元件分段及模擬 34
4.3 樣品設計及量測 41
4.4 結果討論 50
第五章 結論與未來展望 51
參考文獻 53

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