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研究生:周進雄
研究生(外文):CHOU, CHIN-HSIUNG
論文名稱:熱電偶致冷開飲機之產品設計
論文名稱(外文):Thermocouple cooling water machine product design
指導教授:蘇景頌
指導教授(外文):SU, CHINGSUNG
口試委員:洪榮泰
口試委員(外文):Rong-Tai Hong
口試日期:2012-07-05
學位類別:碩士
校院名稱:中華科技大學
系所名稱:機電光工程研究所在職專班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:48
中文關鍵詞:熱電偶致冷晶片
外文關鍵詞:Thermoelectric Cooling Chip
相關次數:
  • 被引用被引用:0
  • 點閱點閱:201
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  • 下載下載:16
  • 收藏至我的研究室書目清單書目收藏:0
摘要
由於科技不斷的演進,使得人類得以享有現代技術的方便及人性化的操作介面。但也由於工業發展的進步,能源的消耗反而造成更多污染與浪費。為此;乾淨而無污染的現代科技需求將成為往後科技發展的方向。
相較於市面產品致冷方式的不同,一般多以含氟化物冷媒的高效率壓縮機為核心致冷。但其冷媒本身具有破壞環境的缺點,因此本文以熱電偶致冷晶片應用驗證開飲機致冷實作冰水的性能並量測研判其數據及效能,作為產品研發之參考。
本文實驗採用熱阻之概念量測其性能,並分析最佳效益作為產品設計應用。本文量測致冷晶片在單體及用於使水降溫的現象,及說明在增加一泵使水流動時的效益,其結果為水在流動時能降溫至19度,較水無流動時溫差為2度。本文為使產品符合市面上大眾所接受,另以TEC1-127080-50單體致冷模組驗證量測得最低溫度為5度。實測於水無流動時最低溫為11度,在水有流動最低溫亦為11度,歸納可知水有流動時僅可縮短其降溫時間,因為效益不佳,所以本文建議不採用泵作流動方式且可降低整體生產成本。
本文藉由實體的量測,以採用適合的組件來開發設計,並用Pro-ENGINEER繪製整體產品結構。探討成本與市埸大眾接受度,並用專利迴避之方法讓產品不致有侵權疑慮。
關鍵字詞:熱電偶致冷晶片、熱阻、產品設計、專利迴避
Abstract
Due to the evolution of technology, allows humans to enjoy the convenience of modern technology and humanized operation interface. But owing to advances in industrial development, energy consumption instead of creating more pollution and waste. To that end; clean and pollution-free needs will become the future development direction of modern technology.
Compared to the product cooled the market of differently, generally more efficient refrigerant compressors for fluoride-containing core cooling. But the refrigerant itself has a disadvantage that damage the environment, therefore this article to real Thermoelectric Cooling Chip applying validation thermocouple cooling water machine cooler ice-water performance and measurement analysis of its data and the effectiveness of, as a reference to product research and development.
This experimental concept of using thermal resistance measurement of its performance, application of best value as a product design and analysis. This measure Thermoelectric Cooling Chip in monomers and used to cool water phenomenon, and description benefit in increased water flow in a pump, the results for water flow to cool down to 19 degrees, compared with no water flow 2 degrees. To bring the product into conformity with this article on the market accepted by the public, and accompanied by TEC1-127080-50 monomer cooling module verify that lowest measured temperature is 5 degrees. Measured in water when there is no flow of low temperature is 11 degrees, water flows the most low-temperature 11 degrees, summarizing water flows only reduces its cooling time, because of the poor
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performance, so this article does not recommend using the pump for the flow pattern and can reduce overall production costs.
This article made by entities of measurement, development and design to fit and using suitable components, and Pro-ENGINEER Drawing the overall product structure. Explore the cost and market public acceptance, with a patented method of evading the product without infringement concerns.
Keyword term: Thermoelectric Cooling Chip, thermal resistance, product design, patent avoidance
第一章、緒論 ·················································································· 1
1.1 前言 ················································································· 1
1.2 研究動機 ··········································································· 2
1.3文獻探討 ············································································ 3
1.4研究範圍 ············································································ 4
第二章、電熱器特性 ········································································· 6
2.1電熱工作原理 ······································································ 6
2.1.1席貝克效應····································································· 6
2.1.2珀爾帖效應····································································· 7
2.1.3 ZT熱電優值 ··································································· 8
2.2 電熱模型 ··········································································· 9
第三章、實驗方法與結果 ································································· 11
3.1 實驗裝置 ········································································· 14
3.2 實驗主體之步驟與方法 ························································ 21
3.3 實驗結果與討論 ································································ 25
3.3.1單一致冷晶片致冷速率 ···················································· 25
3.3.2水無流動時致冷速率 ······················································· 28
3.3.3水有流動時致冷速率 ······················································· 29
3.3.4熱阻之差異··································································· 31
第四章、產品設計與專利迴避 ··························································· 34
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4.1 產品設計 ········································································· 34
4.1.1 產品開發 ····································································· 35
4.2產品專利 ·········································································· 39
4.2.1專利迴避 ····································································· 39
第五章、結果與討論 ······································································· 42
5.1 結果與討論 ······································································ 42
參考文獻 ······················································································ 49
[1] R. Chein,G. Huang,"Thermoelectric cooler application in electronic cooling Original Research Article",pp.2207-2217,2004
[2] A.R. Jha,"Thermodynamic Aspects and Heat Transfer Capabilities of Heat Exchangers for High-Capacity Coolers",pp.57-95,2006
[3] A.R. Jha,"Effects of Heat Flows on Heat Exchanger Performance and Cooler Efficiency",pp.25-56,2006
[4] Foucaran,Sorli,Garcia,P. Delannoy,Giani,Boyer,"Porous silicon layer coupled with thermoelectric cooler : a humidity sensor Original Research Article",pp.189-193,2000
[5] R. Chein,Y. Chen,"Performances of thermoelectric cooler integrated with microchannel heat sinks Original Research Article",pp.828-839,2005
[6] N. Putra,Ardiyansyah,W. Sukyono,D. Johansen,F.N. Iskandar,"The characterization of a cascade thermoelectric cooler in a cryosurgery device Original Research Article",pp.759-764,2010
[7] G.E. Hoyos, K.R. Rao,D. Jerger,"Numerical analysis of transient behavior of thermoelectric coolers Original Research Article",pp.23-29,1977
[8] X.C. Guo,T.S. Zhao,"A parametric study of an indirect evaporative air cooler Original Research Article",pp.217-226,1998
[9] K. Hansen,"Thermal performance of a 61-cell Si-drift detector module with thermoelectric cooler Original Research Article",pp.254-263,2004
[10] Y.H. Cheng,C. Shih,"Maximizing the cooling capacity and COP of two-stage thermoelectric coolers through genetic algorithm Original Research Article",pp.937-947,2006
[11] F.L. Tan,S.C. Fok,"Methodology on sizing and selecting thermoelectric cooler from different TEC manufacturers in cooling system design Original Research Article",pp.1715-1723,2008
[12] H.S. Huang, Y.C. Weng, Y.W. Chang, S.L. Chen,M.T. Ke,"Thermoelectric water -cooling device applied to electronic equipment Original Research Article",pp.140-146,2010
[13] S. Lalota,M.K. Jensen,"Study of isoflux convective coolers Original Research Article",pp.1283-1296,1999
[14] B.J. Huang, C.J. Chin, C.L. Duang,"A design method of thermoelectric coolerConception d'un refroidisseur thermoelectrique Original Research Article",pp.208-218,2000
[15] L.L. Vasiliev,"Micro and miniature heat pipes – Electronic component coolers Original Research Article",pp.266-273,2008
[16] J. F. Li, W. S. Liu, L. D. Zhao and M. Zhou, “High-performance nanostructured thermoelectric materials”,pp.152–158,2010
[17] A. Shakouri and M. Zebarjadi, “Nanoengineered Materials for Thermoelectric Energy Conversion”, Thermal Nanosystems and Nanomaterials Topics in Applied Physics,pp.225-299,2009
[18] www.melcor.com
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