臺灣博碩士論文加值系統

由於半導體行業已趨向於設計專業分工，生產製造大都外包給個專業製造或封裝測試公司，因此如何提昇專業測試公司的測試品質是如何在業界生存下去的重要因素，本研究除介紹測試公司所提供之半導體測試一般性的服務外，產品品質的把關，攸關測試服務品質，目前 A 測試公司判斷測試產品的品質仍倚賴工程師的人工專業判斷，人工判斷難免出錯而導致品質下降，造成客戶抱怨及影響公司聲譽，有鑑於此，本研究開發出一套系統以自動解讀測試品質狀況，並提供產品建議處置，以降低人工出錯及減輕工程師處理日常生產產品的負擔，讓工程師能有更多時間從事研究開發工作，進而提供更高等級的測試服務回饋給客戶。

As the semiconductor industry have been moving towards specialization in different stage, production is outsourced to specialized manufacturing or assembly and test companies. It is definitely an important issue to improve the quality of professional testing company to ensure survival in the industry. Traditionally, the problem that the quality of the test product is still totally dependent on artificial judgment of the engineer and unavoidable overkill is resulted to customer complaints. In this paper, we briefly introduce the general services that testing company provides and also develop a systematic procedure to improve the testing quality. We develop a software system that is capable to automatically detect defects and overkill issues to improve the testing quality.

中文摘要------------------------------------------------------------------------------------- i
英文摘要------------------------------------------------------------------------------------- ii
誌謝------------------------------------------------------------------------------------------- iii
目錄------------------------------------------------------------------------------------------- iv
表目錄---------------------------------------------------------------------------------------- v
圖目錄---------------------------------------------------------------------------------------- vi
一、緒論-------------------------------------------------------------------------------------- 1
1.1 研究背景與動機----------------------------------------------------------------- 1
1.2 研究目的-------------------------------------------------------------------------- 1
1.3 論文架構-------------------------------------------------------------------------- 1
二、相關文獻探討--------------------------------------------------------------------------- 3
2.1半導體測試項目------------------------------------------------------------------ 3
2.2半導體數位測試種類------------------------------------------------------------ 5
2.3半導體測試實務------------------------------------------------------------------ 6
三、 A測試公司半導體測試服務-------------------------------------------------------- 8
3.1 A測試公司簡介------------------------------------------------------------------ 8
3.2 A測試公司半導體測試服務--------------------------------------------------- 8
3.2.1 新產品關聯驗證 (New Device Correlation)--------------------------- 8
3.2.2 良率監控 (Yield Monitor)------------------------------------------------ 10
四、影響Test Quality 原因分析--------------------------------------------------------- 11
4.1 Test Quality 定義----------------------------------------------------------------- 11
4.2 影響 Test Quality 的因素----------------------------------------------------- 11
4.2.1 Speed up Change setup & test issue debug------------------------------- 12
4.2.2 Error Detection & Fast Response------------------------------------------ 15
4.2.3 Hold Lot 管理--------------------------------------------------------------- 15
4.2.4 Test Program 管理---------------------------------------------------------- 16
4.2.5 Tooling/Tester 管理--------------------------------------------------------- 17
五、改善半導體測試品質概念---------------------------------------------------------- 18
5.1 專家系統的意義與起源-------------------------------------------------------- 18
5.2 網路醫院概----------------------------------------------------------------------- 19
5.3 半導體測試品質診斷(產品處置)-------------------------------------------- 19
5.4 現行 Hold Lot 處理方式----------------------------------------------------- 20
5.4.1 Hold Lot 需審閱資料------------------------------------------------------- 21
5.4.2 Hold Lot 處置方式---------------------------------------------------------- 29
5.4.3 工程師專業知識------------------------------------------------------------ 31
5.4.4 Hold Lot 處理實例說明---------------------------------------------------- 36
六、系統展示及結果分析----------------------------------------------------------------- 39
6.1 系統介紹-------------------------------------------------------------------------- 40
6.1.1 軟體選用--------------------------------------------------------------------- 40
6.1.2 資料結構--------------------------------------------------------------------- 40
6.1.3 系統流程--------------------------------------------------------------------- 42
6.2 系統主畫面----------------------------------------------------------------------- 43
6.3 檢查QA ROM code------------------------------------------------------------ 44
6.4 抓取ieda Data功能-------------------------------------------------------------- 45
6.5 自動下載Ieda 、解壓縮及解析資料--------------------------------------- 46
6.6 檢查是否有違反Site Bin Limit----------------------------------------------- 47
6.7檢查是否有測試值Cpk偏移-------------------------------------------------- 48
6.8 建議處置(Suggested Disposition)------------------------------------------- 49
6.9 結果分析------------------------------------------------------------------------ 49
七、結論及未來改善方向----------------------------------------------------------------- 51
八、參考文獻------------------------------------------------------------------------------- 52

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