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研究生:賴盈家
研究生(外文):Ying-Chia Lai
論文名稱:以YAG雷射進行漆包線除漆加工製程之研究
論文名稱(外文):The Study on Paint Remove Machining of Enameled Wire with YAG Laser
指導教授:康耀鴻
指導教授(外文):Yaw-Hong Kang
學位類別:碩士
校院名稱:國立高雄應用科技大學
系所名稱:機械與精密工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
畢業學年度:100
語文別:中文
論文頁數:70
中文關鍵詞:YAG雷射漆包線剝漆田口方法
外文關鍵詞:YAG laserEnameled Wirepaint strippingTaguchi
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探討以雷射加工,在漆包線上進行剝除絕緣層加工,並以田口方法找出最佳加工製程參數,隨著產業進步往微小方向設計及電感元件微小化,當線材線徑愈小時,較無法有效僅剝除漆包線漆面,而為了剝除線材漆面,往往過度剝除以致損傷線材內銅材,為克服產業中線徑愈來愈小,而無法剝除漆包線線圈的絕緣層問題。
以YAG雷射為主要研究設備,製程條件以田口分析參數,控制絕緣層的剝離現象及核心銅材的表面狀況,並以完整性脫漆及絕緣層塗層剝除後的表面粗糙度為參考條件,當製程參數最佳化後,固定設定參數值,調整雷射焦距可達到有效控制漆包線絕緣層剝除的效果,最佳化雷射剝漆後的表面粗糙度為Ra 0.0305μm,相較於機械剝漆後的粗糙度Ra 0.421 μm,有顯著的改善效果,經化學成份分析也有確實移除表面漆面絕緣層。
The thesis is to discover the remove of insulation by laser machining, and optimization process parameter via Taguchi method. Current design of industrial equipments is heading to minor direction and miniaturization of the inductor, that is, the shorter the wire diameter, the less harder for enameled wire to remove paint.To remove paint on enameled wire efficiency, it is usually over stripping which causes the damage of wire inside the copper, To overcome the shorter diameter of wire and the problem of insulation.
The main research equipment is YAG ray; process conditions like strippingof Insulation, and surface condition of core copper are controlled by parameter Taguchi. Further, the referential conditions are integrity of the paint stripping and surface roughness after removing of insulating layer coating. The results show that the remove of wire insulation layer is able to effectively control merely via adjustion of laser focal lengthwhen optimization the process parameter and fixed setting values. The surface roughness of optimize the laser paint stripping is Ra 0.0305μm, which makes improvement a lot comparing with the roughness Ra 0.421 μm that is made by mechanical peeling paint. The results are approved to be effectively removing the surface of paint insulation layer.
目次
摘要 I
致謝 III
目次 IV
表目錄 VII
圖目錄 VIII
第1章 緒論 1
1.1 前言 1
1.2 文獻回顧 2
1.2.1 漆包線 2
1.2.2 YAG雷射加工 3
1.2.3 田口方法之最佳化 4
1.3 研究方法及目的 5
1.4 論文架構 7
第2章 漆包線介紹及剝漆加工機制 8
2.1 漆包線簡介 8
2.1.1 漆包線種類介紹 8
2.1.2 漆包線塗料 13
2.1.3 漆包線分類 14
2.2 漆包線除漆加工方法 17
2.2.1 化學剝漆 17
2.2.2 機械剝漆 18
2.3 雷射剝漆機制 20
2.4 雷射加工參數 23
第3章 實驗設備介紹 26
3.1 YAG 雷射簡介 26
3.1.1 YAG雷射加工機台 27
3.1.2 YAG雷射加工儀器控制介面 28
3.1.3 掃描式電子顯微鏡(SEM) 29
3.1.4 粗度計 30
3.2 實驗材料 31
3.3 實驗架構與規劃 32
3.4 實驗方法 32
第4章 田口實驗設計法 33
4.1 田口方法 33
4.1.1 直交表 33
4.1.2 實驗參數與水準 35
4.1.3 品質評價指標S/N比與損失函數 36
4.1.4 田口實驗 42
4.1.5 回應表與回應圖 45
4.1.6 變異數分析 46
4.1.7 最佳參數組合規劃 47
第5章 實驗結果與討論 48
5.1 實驗結果 48
5.1.1 表面粗糙度檢測 48
5.1.2 SEM光學顯微鏡檢測 49
5.2 田口實驗樣品結果 49
5.2.1 第一次田口實驗線材實驗結果: 49
5.2.2 第一次田口實驗除漆後之表面化學成份分析: 52
5.2.3 第一次田口實驗最佳化除漆後之表面化學成份分析: 53
5.2.4 第一次田口實驗最佳化除漆後之SEM : 54
5.2.5 第二次田口實驗線材實驗結果: 56
5.2.6 第二次田口實驗除漆後之表面化學成份分析: 59
5.2.7 第二次田口實驗最佳化除漆後之表面化學成份分析: 60
5.2.8 第二次田口實驗最佳化除漆後之SEM: 61
5.3 雷射波長及吸收率差異的比較 62
5.3.1 波長吸收率造成的樣本差異性 63
5.4 結果討論 65
5.4.1 雷射波長及吸收率的差異 65
5.4.2 絕緣層移除後的表面精度 65
5.4.3 焦距焦點的調整 65
第6章 結論與未來展望 66
6.1 研究發現 66
6.2 未來展望 67
6.2.1 多個機台共用一台雷射剝漆 67
6.2.2 自動聚焦模組 67
第7章 參考文獻 68
第7章 參考文獻
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