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研究生:王怡然
研究生(外文):I-Jan Wang
論文名稱:乾冰顆粒清洗PCBA參數最佳化之研究
論文名稱(外文):A Study on Parameter Optimization for Cleaning PCBA by Dry Ice
指導教授:陳信宏陳信宏引用關係
指導教授(外文):Shinn-Horng Chen
學位類別:碩士
校院名稱:國立高雄應用科技大學
系所名稱:機械與精密工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
畢業學年度:100
語文別:中文
論文頁數:59
中文關鍵詞:田口方法
外文關鍵詞:dry ice blastingsnow cleaningCO2 cleaning
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本研究是利用二氧化碳作為清洗媒介,用以清除印刷電路板(Printed Circuit Board Assembly,PCBA)上的異方性導電膠(Anisotropic Conductive Film,ACF)之殘膠,並應用田口方法(Taguchi methods),分別以除膠前溶劑之使用、噴嘴之高度、噴嘴之吹氣壓力、噴嘴之移動速度和氣缸推動乾冰之壓力等因子作為實驗配置,評估利用二氧化碳清除PCBA上之ACF殘膠後效果的影響,並尋求最佳化的控制參數。以除膠率作為實驗之輸出回應的望大特性(Larger The Better,LTB)分析,進而從實驗結果中得知各因子對PCBA上的ACF殘膠之影響狀況,以求得一組最佳化的參數組合。試驗結果分析,影響除膠效果之主要因子為除膠前溶劑之使用,其貢獻度為33.323 %,再根據田口方法所得結果之最佳因子水準組合進行確認實驗,並將其分析後發現,噴嘴移動速度愈低除膠效果愈佳,但是移動速度過低則會損害PCBA上的絕緣層。
This study used carbon dioxide as the cleaning agent to clear the ACF (Anisotropic Conductive Film) adhesive residue on the PCBA (Printed Circuit Board Assembly). Taguchi methods were applied by using factors including the use of solvent prior to adhesive removal, the nozzle height, the nozzle blowing pressure, the nozzle moving speed and the cylinder driving pressure on the dry ice for experimental configurations. The experiment assessed the effects of using carbon dioxide to remove the ACF adhesive residue on PCBA and search for the optimal combination of control parameters. The experimental output response LTB (Larger the Better) analysis was conducted by using adhesive removal rate as the indicator to determine the impact of various factors on the ACF adhesive residue on PCBA to obtain a group of optimal parameter combinations. According to the experimental results, the major factor affecting the adhesive removal effects is the use of solvent prior to adhesive removal with its contribution at 33.323 %. Confirmation experiments were conducted according to the optimal factor level combinations using Taguchi methods, and found that the adhesive removal effect is better if the nozzle moving speed is lower. However, too low moving speed of the nozzle would damage the insulation layer of the PCBA.
摘要 i
英文摘要 ii
致謝 iv
目錄 v
圖目錄 vii
表目錄 ix
符號說明 x
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 2
1.3 研究方法與流程 4
1.4 論文架構 6
第二章 二氧化碳清洗技術與運用 7
2.1 二氧化碳清洗歷程簡介 7
2.2 乾冰清洗的優勢 7
2.3 二氧化碳清洗方式 9
2.3.1 乾冰顆粒噴洗法(Macroscopic Dry Ice Pellets) 9
2.3.2 液態二氧化碳清洗法(Liquid CO2 ) 12
2.3.3 超臨界二氧化碳清洗法(Supercritical CO2 ) 14
2.3.4 二氧化碳雪花噴流清洗法(Snow Cleaning) 14
2.4 二氧化碳清洗之應用與研究 18
第三章 田口式品質工程 24
3.1 田口實驗方法 25
3.2 選擇直交表 27
3.3 品質損失函數 28
3.4 信號雜音比 33
3.5 回應表 36
3.6 變異數分析 37
第四章 實驗分析、結果與討論 38
4.1 實驗規劃 38
4.2 決定品質特性 39
4.3 因子與其水準數之決定 40
4.4 直交表之選擇 41
4.5 實驗設備 42
4.6 實驗結果 44
4.7 變異數分析 49
4.8 效益評估 50
4.9 確認實驗及結果 50
4.10 結果討論 52
第五章 結論 54
參考文獻 55
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