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研究生:謝少宇
研究生(外文):SHAO-YU HSIEH
論文名稱:反應式濺鍍氮化矽鈦硬質薄膜之微結構與耐磨性質研究
論文名稱(外文):A Study on Microstructure and Abrasive Resistance of Ti-Si-N Hard Films by Reactive Sputtering
指導教授:邱錫榮
指導教授(外文):Shi-Yung Chiou
學位類別:碩士
校院名稱:國立高雄應用科技大學
系所名稱:模具工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
畢業學年度:100
語文別:中文
論文頁數:81
中文關鍵詞:磁控反應性濺鍍、TiSiN薄膜、表面粗糙度
外文關鍵詞:sputtering,TiSiN film,surface roughness
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本實驗使用單靶射頻磁控反應式濺鍍系統沉積TiSiN奈米複合薄膜,固定氮氣流量及工作壓力下、藉由不同鈦-矽合金比例的靶材及靶材功率,以沉積不同鈦矽化合比的TiSiN硬質鍍膜於粉末高速工具鋼基準片上。目標為備製Si含量在20at%~24at%間的薄膜。利用環境射掃描式電子顯微鏡(ESEM)、低掠角X光繞射儀(XRD),對鍍膜之鈦、矽成份化合比及微結構進行分析及確認。並以微小硬度計、洛氏硬度計及表面粗度儀量測薄膜硬度、附著性及表面粗度等鍍膜的機械性質。另以一組TiN基準片為對照組,針對TiSiN鍍膜的斷面形貌、表面粗度及薄膜硬度與TiN做比較。最後在無屑絲攻上施做TiSiN薄膜與TiN薄膜無屑絲攻進行攻牙實驗,比較TiSiN表面改質後和傳統TiN鍍膜耐磨性質上的差異。
實驗結果顯示合金單靶搭配固定氣體條件的製程下,靶材功率的變化並不影響薄膜內鈦及矽的化合比例,只影響薄膜的沉積速率及薄膜的表面粗糙度,靶材功率越高會有更快的沉積速率及較差的表面粗糙度,薄膜內鈦及矽成份的比例隨著合金靶成份比例不同會有明顯的改變,薄膜內Ti/(Ti+Si)及Si/(Ti+Si)比值,不論是重量比或原子量比均與合金靶的成份比例相同,確定合金靶成份與薄膜的成份上的關係。TiSiN薄膜的平均含矽量為25at%,微小硬度計量測值約為2000HV_((0.01)),比TiN的1095HV_((0.01))多出近900HV_((0.01))的硬度。附著力判定為VDI3198 HF4級。無屑絲攻的攻牙實驗中也可明確的發現,在加工3,000孔後的初期磨耗值比較下,TiN無屑絲攻的凸部磨耗值為0.76mm而TiSiN 為0.50mm,顯示TiSiN薄膜比TiN薄膜具有更佳的耐磨耗性。
This research is to deposite TiSiN film on ASP2030 tool steel using magnetron-reactive sputtering. The TiSiN films with different ratio of Ti/Si are deposited under controlling the Ti/Si ratio of targets and input watt with the fixed gas flow and working pressure.The environmental scanning electron microscope (ESEM) and low-angle X-ray diffractor and used to analyze the concentration of Ti and Si and crystalline structure of the film. The vicker’s hardness tester and Rockwell hardness tester and roughness measurement equipment are applied to detect the film hardness , adhesion and surface roughness. The TiN deposition is undertaken to compare with TiSiN in morpholohgy, surface roughness film hardness and thread-forming performance.
The results show that the greater input watt may increase the deposition rate and surface roughness. The ratio of Ti and Si in the film just depends on the ratio of Ti and Si in the target and the average Si content in the TiSiN film is 25at%.
The measured TiSiN hardness is around 2000HV,which may be higher than one of TiN by 900HV. The adhesion of TiSiN on ASP2030 may be categorized VDI3198 HF4. The tapping tests for thread-forming performance show the abrasion area of protruding surface of the Tap deposited with TiSiN have 0.50mm while the Tap deposited with TiN may have 0.76mm abrasion area of protruding surface, which appears TiSiN has more abrasion resistance than TiN.
目錄
摘要 I
ABSTART II
誌謝 III
目錄 IV
表目錄 VI
圖目錄 VII
符號說明 IX
第一章 緒論
1.1前言…………………….…………………………….……….…..… 1
1.2研究動機與目的………………………………………….…..…….. 2
第二章基礎理論
2.1單一相薄膜形成的機制……………………………………...…….. 3
2.2複合薄膜形成的機制……………………………………….……… 5
2.3電漿的產生………………………………………………….……… 6
2.4反應濺鍍的理論…………………………………………….……… 9
2.5 PVD鍍膜原理與種類……………...……………………….……… 10
2.6靶材的濺射率……………...………………………………….……. 14
2.7 TiSiN超硬質薄膜結構與強化理論……………………….…….. 15
2.8 TiSiN薄膜的影響因子…………………………………………... 18
2.8.1 氮氣分壓對TiSiN薄膜的影響………………….…..……. 18
2.8.2 Si含量對TiSiN薄膜性質的影響……..………….……...... 20
2.8.3基材偏壓對TiSiN薄膜性質的影響…………..…………… 23
第三章實驗方法與步驟
3.1實驗方法說明……………………………….………………......…. 24
3.1.1實驗流程圖…………………………...………...…………… 25
3.1.2反應式磁控濺鍍條件……………………...………...……… 26
3.2基材前處理………………………………………………….......….. 26
3.3實驗設備……………………………………………………………. 27
3.3.1反應式磁控共濺鍍設備………………………..…………… 27
3.3.2 ESEM環境射掃描式電子顯微鏡…………………….…..... 29
3.3.3 能量散光譜儀(EDS)…………..……………………………. 30
3.3.4 多功能X光繞射儀(XRD)…………………………………. 31
3.3.5微小硬度機………………………………………………... 34
3.3.6附著力試驗機(洛式硬度計)……………………………….. 36
3.3.7表面粗糙度量測儀………………………………………….. 37
3.3.8攻牙實驗………..…………………………………………… 39
第四章實驗結果與討論
4.1 TiSiN薄膜濺鍍速率………………………………………….. 43
4.2化學成份……………………....………………………………… 44
4.3微結構與晶粒尺寸…..………………………………………….. 45
4.4斷面形貌………………..……………………………………….. 48
4.5薄膜表面硬度……...……………………………………………. 50
4.6表面粗糙度…….………..………………………………………. 52
4.7附著力測試……………………..……………………………….. 57
4.8攻牙實驗………………………..……………………………….. 57
第五章結論
5.1結論………………………………………...……………………. 62
5.2未來展望………………………………………………………… 63
參考文獻……………………………………………..………………………. 64
自傳………………………..…………………………………………………. 68
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