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研究生:陳慶村
研究生(外文):Ching-Tsun Chen
論文名稱:添加Ni對Sn3.5Ag無鉛銲料機械性質與顯微組織之影響
論文名稱(外文):Effect of Ni Addition on the Microstructures and Mechanical Properties of Sn-3.5Ag Pb-free Solder
指導教授:林英志林英志引用關係
指導教授(外文):Yin-Chih Lin
學位類別:博士
校院名稱:國立高雄應用科技大學
系所名稱:模具工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
畢業學年度:100
語文別:中文
論文頁數:88
中文關鍵詞:無鉛銲料IMC層剪切強度
外文關鍵詞:lead free solderSn-3.5Ag-2NiIMC Layer
相關次數:
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  • 下載下載:32
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本研究目的為添加2wt.% Ni在Sn-3.5Ag無鉛銲料,探討在不同的冷卻速率下,銲道金屬間化合物層之微結構和機械性質之影響。並進一步也利用高溫熱儲存測試實驗來評估不同冷卻速率對金屬間化合物(Intermetallic Compound)成長的影響。探討添加Ni是否可以降低Sn-3.5Ag無鉛銲料中,因高溫熱儲存所造成的IMC層之不良影響。
研究結果顯示Sn-3.5Ag+Ni(2wt.%)與Cu銲接後,IMC層厚度隨著熱儲存時間增加而變厚。但是Sn-3.5Ag+Ni(2wt.%)無鉛銲料在不同冷卻速率下有明顯的影響。較快的冷卻速率會使結構較為細化,水冷冷卻速率下的Sn-3.5Ag+Ni(2wt.%)其IMC層熱儲存後為厚度成長較少,且剪切強度的表現也最為優異。
The objective of this study is to evaluate the effects of adding 2wt.% Ni into Sn-3.5Ag lead free solders , with after differernt cooling rate, on the microstrucures and mechanical properties of intermetallic compound (IMC) layer . Furthermore, the solder joints were isothermal aging treatment for further investigation the microstructures and mechanicl properties of IMC layer.
The experimental results show that the IMC layer thickness of Sn-3.5Ag+2Ni (wt.%) solder joints increased with againg times. In addition the Sn-3.5Ag-2Ni free lead solders with a different cooling rate have a significant effect on the IMC layer . Faster cooling rate of f Sn-3.5Ag-2Ni(wt.%) solder causes a erfined microstructure. The IMC layer thickness of Sn-3.5Ag+2Ni solder cooling in water ,after thermal againg , has a smaller growth rate with an optimal shear strength .
摘 要 I
ABSTRACT II
致 謝 III
目 錄 IV
表 目 錄 VI
圖 目 錄 VII
一、前言 1
二、文獻回顧 4
2-1 無鉛銲錫發展概況 6
2-2 二元合金銲料 11
2-3 SN-AG-X 三元合金銲料 20
2-4 冷卻速率的影響 27
2-5 可靠度 28
三、實驗方法與步驟 33
3-1試驗規劃 33
3-2 試片製備 35
3-3 冷鑲埋→研磨→拋光→腐蝕 39
3-4 維克氏硬度(HV)量測 42
3-5 SEM與EDS微結構分析 44
3-6 XRD 45
3-7 剪切試件 46
四、結果與討論 47
4-1 冷卻速率對硬度的影響 47
4-2 銲料XRD之定性分析 52
4-3 銲點微結構與性質 55
4-4 IMC層形成與厚度變化 66
4-5 銲點剪切試驗 75
五、結論 77
參考文獻 78
簡歷 88
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