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研究生:蘇季鴻
研究生(外文):Chi-HungSu
論文名稱:單晶太陽能矽晶片焊接殘留應力與翹曲分析
論文名稱(外文):Analysis of residual stress and warpage induced by soldering in monocrystalline silicon wafers
指導教授:賴啟銘賴啟銘引用關係
指導教授(外文):Chi-Ming Lai
學位類別:碩士
校院名稱:國立成功大學
系所名稱:土木工程學系碩博士班
學門:工程學門
學類:土木工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:116
中文關鍵詞:太陽能矽晶片焊接有限元素法翹曲殘留應力
外文關鍵詞:solar cellsoldering processfinite elementwarpageresidual stress
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近年來,太陽能產業的迅速發展,導致半導體材料的日益短缺,基於成本考量,太陽能矽晶片朝大尺寸薄形化發展,然而晶片為求導電性與能量的輸出,必須透過焊接製程該項程序,往往導致太陽能矽晶片翹曲變形大幅增加,不利於日後晶片之封裝製程,甚至造成晶片的破損、縮短太陽能晶片的使用年限,因此,如何減少晶片翹曲變形及降低焊接製程晶片殘留應力將是太陽能矽晶片製程產業的重要議題。
本文依單晶太陽能矽晶片焊接製程進行實驗量測,並採用ANSYS有限元素數值模擬工具分析焊接製程降溫過程中單晶太陽能矽晶片翹曲變形行為,最後將數值模擬結果與實驗量測數據加以分析比對,確保數值模擬分析流程建立之正確性,接著再利用本文所建立之數值模擬分析模式,考慮不同晶片之幾何參數對單晶太陽能矽晶片焊接製程結構行為的影響 ; 並更進一步探討不同幾何形狀參數下矽晶片裂縫對應力行為及應力強度因子的變化情形,最後根據實驗與數值模擬所得的結果作出結論與建議,以供後續太陽能矽晶片相關焊接製程行為研究之參考。

In recent years, PV manufacturing develops rapidly, and as the result, it gradually leads to the decreasing of semiconductor material. Solar cell as semiconductor material undergoes vast reduction in cell thicknesses, yet greater dimension as the consequence of costs considerations is inevitable. Solar cell also requires the electric conductivity and power output, which can be achieved through the soldering process. However, the process usually lead to substantial increase of warpage in silicon wafer, which is not good for the packing process of wafer itself and may seriously damage and reduce wafer life use. Therefore, how to reduce warpage and residual stress in wafer soldering process will be an important issue in the future.
In this paper, both finite element simulation from ANSYS and experimental measurement were conducted to analyze the behavior of the soldering process in monocrystalline silicon wafers warpage. Comparison between both methods was carried out to verify the accuracy of numerical simulation analysis process. The results of verified numerical simulation method were utilized to assess different geometric parameters of monocrystalline silicon wafers, which affect it structural behavior in the soldering process. Furthermore, investigation of the crack variations of silicon wafers under the specified different geometry parameters regarding the stress behavior and intensity factor was also examined in this research. Eventually, in accordance with the results from experiment and numerical simulation, conclusions and recommendations can be made as future references concerning silicon wafer soldering process.

目錄
摘要 I
Abstract II
誌謝 III
目錄 IV
表目錄 VII
圖目錄 VIII
第一章 緒論 1
1.1 研究動機 1
1.2 研究目的 3
1.3文獻回顧 3
1.4論文架構 6
第二章 製程步驟及實驗方法 7
2.1 前言 7
2.2 焊接製程 7
2.3 實驗規劃與設計 9
2.3.1 晶片溫度量測之熱電偶配置與設定 9
2.3.2 晶片翹曲變形量量測 10
2.4 實驗結果與討論 10
2.4.1 單晶太陽能矽晶片之溫度分析 11
2.4.2 單晶太陽能矽晶片之翹曲變形量分析 14
2.5 單晶太陽能矽晶片三點彎曲試驗 14
2.6 電致發光之單晶太陽能矽晶片檢測 16
2.6.1電致發光原理簡介 16
2.6.2電致發光之實驗流程與設置 16
2.6.3晶片檢測結果 18
第三章 基礎理論 20
3.1 翹曲分析基礎理論 20
3.1.1 Timoshenko Bi-Metal翹曲理論 20
3.1.2 Suhir熱應力與翹曲理論 22
3.1.3 多層板變形翹曲分析 26
3.2 有限元素法熱應力基礎理論 27
3.3 有限元素法裂縫分析基礎理埨 30
3.3.1奇異元素 30
3.3.1.1 四邊形元素 30
3.3.1.2 三角形元素 32
3.3.2 應力強度因子 34
第四章 數值模擬 36
4.1 前言 36
4.2 材料參數設定 36
4.3 數值模擬架構設定 38
4.3.1分析假設 47
4.4 數值模擬之幾何參數案例規劃 48
4.4.1 一般模型 48
4.4.2 裂縫模型 50
4.5 數值模擬與實驗結果比對 50
第五章 數值模擬結果與討論 55
5.1 前言 55
5.2 參考基準Basic Model討論 55
5.3 單晶太陽能矽晶片厚度變更分析 62
5.4 單晶太陽能矽晶片焊條厚度變更分析 69
5.5 單晶太陽能矽晶片焊條寬度變更分析 76
5.6 單晶太陽能矽晶片鋁膠厚度變更分析 83
5.7 混合型變更分析 90
5.8 小結 101
5.9 單晶太陽能矽晶片裂縫應力分析 103
5.10 應力強度因子分析 109
第六章 結論與建議 111
6.1 結論 112
6.2 建議 113
參考文獻 114

參考文獻
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