臺灣博碩士論文加值系統

覆晶載板接合封裝具有細間距、訊號傳遞快速、散熱性良好等優點，本文針對覆晶載板接合封裝進行研究，希望透過分析能提高封裝之疲勞壽命以確保產品之品質穩定。
本文先使用ANSYS有限元素分析軟體對覆晶載板接合封裝進行分析，模型施加低溫-25°C至高溫125°C的循環負載，其中錫球需考慮其為彈塑性材料，其他材料則視為彈性材料。為了提升模擬效率採用全域/局部方法，並以錫球累積之平均應變能密度，作為評估封裝整體可靠度之指標，然後藉由Syed 提出之疲勞壽命公式，預測覆晶載板接合封裝之疲勞壽命。其次，利用單一因子分析探討各控制因子對平均應變能密度值之影響，並以部分因子設計法篩選顯著之因子效應，再將其設計參數建立迴歸模型，然後引用基因演算法進行最佳化分析。
最後，利用區間式基因演算法，可得知各參數對可靠度指標的敏感度，其順序由大至小分別為底填膠熱膨脹係數、銅柱直徑、電路板厚度、銅柱高度。但實際上還會受到製程規格的限制，因此必須界定成本與技術允許下製程參數的區間範圍，使其區間內各種參數組合所得之反應值皆在允許誤差範圍內，以確保產品的品質穩定。

The Flip Chip on Board is recognized to have the advantages of fine pitch, rapid signal transmission and well heat dissipation. By adopting the Flip Chip on Board, this paper aims to improve the fatigue life of the package and ensure the stability of product quality.
First of all, the ANSYS finite element analysis software is applied. The model of package is given with the thermal cycle of -25°C ~ 125°C, in which the solder ball is considered as elastoplastic while other components are elastic. The global/local method is applied to promote the simulated efficiency. The average strain energy density accumulated in the solder ball is treated as the index for evaluating the reliability of the package. Based on the fatigue life formula proposed by A.Syed, the fatigue life of the Flip Chip on Board is accordingly predicted.
Secondly, in order to analyze the effect of each control factor on the average strain energy density, the one-factor-at-a-time analysis is conducted. Afterwards, the factors with more significant effect are chosen as design parameters by the fractional factorial design method to set up the regression model of response surface. Subsequently, the genetic algorithm combined with the response surface method is applied to obtain the optimal design.
Finally, by the interval genetic algorithm, the sensitivity of each parameter can be tracked out, which are ranked from the largest to the smallest as follows：Coefficient of thermal expansion of underfill, diameter of copper column, thickness of printed circuit board and height of copper column. Thus it is also constrained by the manufacturing standards. Therefore it is urgent to define the range of the parameters under the constraints of cost and technology to ensure the response value of each parameter combination not beyond the allowable error range so that stability of the product quality can be expected.

中文摘要 I
Abstract III
誌謝 IV
目錄 V
表目錄 X
圖目錄 XIII
符號說明 XVIII
第一章 緒論 1
1-1 前言 1
1-2 研究動機與目的 2
1-3 文獻回顧 2
1-4 研究方法 5
1-5 章節提要 6
第二章 理論基礎 7
2-1 關鍵錫球失效指標 7
2-1-1 錫球破壞模式 7
2-1-2 錫球之塑性增量本構理論 8
2-1-3 在不同溫度下錫球之多線性等向硬化行為 12
2-1-4 錫球之潛變理論 12
2-1-5 疲勞壽命預測 14
2-2 全域/局部模型分析法 16
2-3 實驗設計法 18
2-3-1 單一因子分析 18
2-3-2 部分因子設計 18
2-4 反應曲面法分析 20
2-4-1 實驗配置 20
2-4-2 迴歸模型 21
2-4-3 配適性分析 23
2-4-4 變異分析 24
2-4-5 殘差分析 25
2-5 利用基因遺傳演算法之最佳化分析 26
2-6 區間式遺傳演化之分析 30
第三章 FCOB模型建立與評估 39
3-1 覆晶載板接合封裝介紹 39
3-1-1 覆晶載板接合封裝之製程 39
3-1-2 覆晶載板接合封裝之結構 40
3-2 覆晶載板接合封裝之模擬 41
3-2-1 覆晶載板接合封裝模型之基本假設 41
3-2-2 錫球幾何外型之建立 42
3-2-3 覆晶載板接合封裝模型之建構 42
3-2-4 覆晶載板接合封裝模型之分析型態與邊界條件 43
3-2-5 覆晶載板接合封裝模型之溫度負載 44
3-3 覆晶載板接合封裝模型採用精細網格之探討 44
3-3-1 關鍵錫球評估 44
3-3-2 全域精細模型網格之收斂分析 45
3-3-3 溫度循環負載之收斂分析 45
3-4 覆晶載板接合封裝模型以全域/局部模型之探討 46
3-4-1 全域模型之位移收斂分析 46
3-4-2 局部模型範圍評估 47
3-4-3 局部模型之網格收斂分析 47
3-4-4 局部模型之循環負載收斂分析 48
3-5 精細網格與局部模型結果之比較 48
第四章 FCOB模型區間最佳化設計 70
4-1 單一因子分析 70
4-1-1 因子水準設計 70
4-1-2 實驗結果與探討 71
4-1-3 單一因子分析之結論 74
4-2 部分因子設計 75
4-2-1 實驗配置與結果 75
4-2-2 部分因子設計之變異分析 75
4-2-3 部分因子設計之結論 76
4-3 反應曲面實驗設計分析 76
4-3-1 反應曲面之建立 76
4-3-2 反應曲面之變異分析與殘差分析 78
4-4 區間式最佳化設計 78
4-4-1 基因遺傳演算法求得最佳化參數與反應值 79
4-4-2 區間式基因遺傳演算法求得設計參數區間值 80
4-4-3 區間式設計之討論 81
第五章 結論與未來研究方向 102
5-1 結論 103
5-2 未來研究方向 106
參考文獻 108

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