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研究生:林昆融
研究生(外文):Kun-JungLin
論文名稱:高解析度雲紋干涉儀光路與機構設計
論文名稱(外文):Design of Optical Path and Mechanism for High Sensitivity Moiré Interferometry
指導教授:李輝煌李輝煌引用關係
指導教授(外文):Huei-Huang Lee
學位類別:碩士
校院名稱:國立成功大學
系所名稱:工程科學系專班
學門:工程學門
學類:綜合工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:74
中文關鍵詞:IC封裝雲紋干涉儀機構設計
外文關鍵詞:IC packagingMoiré interferometrydesign of mechanism
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雲紋干涉儀為量測IC封裝變形量的可靠方法。在電子產品日益追求輕薄短小的現今,IC受到產品體積有限的情況下必須縮短矽晶的尺寸與厚度,對於IC封裝體受力行為的量測將會困難許多,因此,更高精度的相位移技術因此被發展出,可以完整的描繪出微小區域的應變場分佈狀況,雲紋干涉儀較傳統干涉儀精度高出八倍甚至於更多,可到達52 nm,因此使用雲紋干涉儀可以精確分析IC封裝體受熱所造成的位移與應變量。
目前市面上所販售之雲紋干涉儀皆無法得知內部光路及機構,本研究主要針對雲紋干涉儀內部光路以及機構進行分析設計,光路分析主要是利用光柵分光原理以及光反射定律,由雷射光源開始計算光線路徑、反射角度,完整描繪出光線於雲紋干涉儀箱體內部的行進路線,選用適合的光學holder、反射鏡、聚焦鏡,並藉由機構設計軟體,在箱體內部設計固定上述光學元件之機構,另外,針對傳統雲紋干涉儀量測試片固定方式無法使試片光柵平面垂直雷射光,造成校正時需耗費許多時間的缺點,重新設計試片固定機構,使得整體量測時間可以大幅縮短,有效率的得到精確的數據。

Moiré interferomety is a reliable method for measuring IC package of deformation. As people today have increasing demands for slim and light electronic products, due to the limitation of the products’ size, it is necessary for the IC to reduce the length and thickness of the silicon. The measurement for IC package body force behavior would be more difficult. Thus, a more accurate phase-shifting technique is developed to illustrate a complete picture of the strain field distribution of the tiny regions. Moiré interferometer has a more than eight times higher accuracy in comparison to the conventional interferomety; it can even reach 52nm. Therefore, the use of moiré interferometry instrument can accurately analyze the IC package body the displacement and strain caused by heat.

As the internal optical path and mechanism of the moiré interferometers currently sold in markets are not clearly revealed, this study focused on the moiré interferometry instruments’ internal optical path, institutional analysis, and design. The analysis of the optical path adopted the grating principle and the law of reflection of light by the laser light source to calculate the light path, the reflection angle, and focus position, depicting the complete light route within the moiré interferometry instrument box. This study also selected a suitable optical holder, mirror, and focusing mirror, and by the mechanical design software, designed and fixed the optical components mentioned above inside the box. In addition, focusing on the shortcoming of the traditional moiré interferometry instrument that specimen plane is fixed in a way that the grating plane cannot be perpendicular to the laser, which resulted in time-consuming corrections, this study redesigned the specimen fixture, and thus significantly reduces the overall measurement time, and efficiently acquires the accurate data.

摘要 I
ABSTRACT II
誌謝 IV
目錄 VI
表目錄 VIII
圖目錄 IX
第一章 緒論 1
1.1 IC封裝種類介紹[2] 1
1.2 IC封裝失效情形及影響[4] 5
1.3 文獻回顧 6
1.4 研究目的及研究方法 8
1.5 本文架構 9
第二章 理論基礎 10
2.1 前言 10
2.2 雲紋干涉儀原理 11
2.3 雲紋干涉儀使用步驟 21
第三章 光路設計 28
3.1雷射特性[27][28] 28
3.1.1雷射光的方向性 28
3.1.2雷射光的高亮度 29
3.1.3雷射光的單色性 30
3.1.4雷射光的方向性 31
3.2光柵分光原理 32
3.3光線的反射定律[30] 35
3.4光路設計 35
第四章 機台架構 39
4.1 設計概念 39
4.2 設計軟體介紹 39
4.3 機構設計 40
4.3-1 反射機構 41
4.3-2 聚焦鏡固定機構 46
4.3-3 參考光柵及試片夾持調整機構 48
第五章 結論與未來展望 53
5.1 結論 53
5.2 未來工作 53
參考文獻 55
附錄(機構工程圖) 59
索引 73


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