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研究生:林祺哲
研究生(外文):Chi-Chelin
論文名稱:8.5代彩色濾光片製程之VCD氣泡改善
論文名稱(外文):VCD Bubble Improvement in Color-FilterProcess of G8.5 TFT-LCD Fabrication
指導教授:趙隆山
指導教授(外文):Long-Sun Chao
學位類別:碩士
校院名稱:國立成功大學
系所名稱:工程科學系專班
學門:工程學門
學類:綜合工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:82
中文關鍵詞:彩色濾光片真空乾燥田口方法氣泡缺陷
外文關鍵詞:CFColor FilterVCD BubbleVacuum DryTaguchi Method
相關次數:
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探討LCD主要零件之彩色濾光片(CF :color filter),其關鍵製程部分:光阻塗布(photo resist coating)後之乾燥製程異常改善,即VCD(真空乾燥機:vacuum dry)bubble(氣泡缺陷)。
VCD bubble引起主因為壓力變化過快或氣流分布不均勻,進而造成基板表面之光阻出現微小氣泡,而VCD bubble的解決方法可有兩個方向,其一為由光阻成分著手調整,另一為生產設備設計改良或透過設備參數之調整達成。
工程面對bubble問題應急方式常見為調整vacuum流量,或玻璃基版在chamber內之高度置,或chamber抽取到達壓力之搭配等,長期則配合光阻成分、比例改善進行,但往往效果不彰。
本實驗研究除透過上述參數調整外,新加入部分設備新設計,如:chamber vacuum pipe數量改變,由原來多管式增加單管式,chamber內抽氣口由原來固定式改為可調式,帶入田口實驗法之望小特性,調整實驗因子,降低bubble不良之發生率,求取最佳化可能,以供新世代設備設計之改善參考。

Color filters are the major parts of LCD. In the study, the improvement is made on an abnormal issue of the color filter caused by the vacuum dry process, which is just behind the photo resist coating process. The abnormal issue is the formation of VCD bubbles.
The VCD bubbles are mainly resulted from the too fast pressure change or the non-uniform air flow, which make tiny bubbles appear in the photoresist on the surface of the substrate. There are two ways to solve the VCD bubble problem. The first one is to adjust the composition of the photoresist. The other one is to improve the design of the equipment or tune the working parameters of equipment.
In the engineering emergent treatment of the bubble issue, the common way is to adjust the vacuum flow rate, the height of glass in the chamber, or the proportion of vacuum pressures of different types. In the long-term treatment of the issue, the composition of the photoresist is adjusted. However, these two treatments are often ineffective.
Besides the methods mentioned above, this study adds some new designs. For example, the number of chamber vacuum pipe is changed. Single vacuum pipe is added into the experimental investigation while there is only multi-pipe used in the old ways. The internal extract opening in the chamber is changed from the stationary type to the adjustable one. The quality characteristic of Smaller-The-Best of the Taguchi method is used to evaluate the experimental factors for reducing the defect rate of bubble and to obtain the optimal process conditions. The results of the study are expected to be helpful for the new design of the new generation equipment.

摘要.......................................................I
Abstract..................................................II
誌謝.....................................................III
目錄......................................................IV
表次目錄.................................................VIII
圖次目錄....................................................X
符號說明..................................................XIV
第一章 緒論.................................................1
1.1 研究動機................................................1
1.2 研究目的................................................4
第二章 基本原理..............................................6
2.1 LCD基礎結構說明..........................................6
2.1-1 LCD製作流程...........................................7
2.1-2 LCD顯示技術簡介........................................7
2.1-3 LCD色彩顯示原理........................................9
2.2 CF製做流程說明..........................................11
2.2-1 CF各層功能依序說明....................................12
2.2-2 RGB pattern簡介.....................................14
2.2-3 RGB與BM overlap說明..................................14
2.3 CF生產材料簡介..........................................15
2.3-1玻璃基板(Bare Glass).................................15
2.3-2光阻(Photo Resist)..................................17
2.3-3 ITO(Indium Tin Oxide).............................22
2.4 CF PR coating process簡介.............................24
2.5 VCD process簡介.......................................26
2.5-1 VCD生產管理方式.......................................27
2.5-2 VCD種類說明..........................................28
2.5-3 VCD目前業界採用狀況...................................31
2.5-4 VCD vacuum pipe配置.................................32
2.6 Coater與VCD製程常見異常簡介..............................33
2.6-1 PR coating常見異常...................................33
2.6-2 VCD常見異常..........................................36
2.7 VCD bubble異常深入探討說明..............................37
2.7-1 VCD bubble defect成像說明............................39
2.7-2其他流體造成之異常說明:.................................41
2.7-3影響VCD bubble設備設計及參數............................41
2.8 田口品質工程............................................44
2.8-1 品質特性.............................................45
2.8-2 因子效應.............................................47
2.8-3 最佳化製程...........................................49
第三章 實驗設備與方法........................................51
3.1 photo進行測試設備.......................................51
3.1-1 cleaner.............................................51
3.1-2 coater & VCD........................................52
3.1-3 HP/CP...............................................53
3.1-4 exposure............................................54
3.1-5 developer...........................................55
3.1-6 oven................................................56
3.2 量測設備...............................................57
3.2-1 AOI.................................................57
3.3 實驗材料...............................................59
3.3-1 bare glass..........................................59
3.3-2 photo resist........................................59
3.3-3 developer...........................................59
第四章 實驗設計與結果討論.....................................61
4.1 實驗規劃...............................................61
4.1-1 固定因子選定說明......................................61
4.1-2 控制因子選定說明......................................63
4.1-3 因子設定表...........................................68
4.2 實驗步驟...............................................68
4.3 驗證實驗...............................................69
第五章 結論與未來研究........................................77
5.1 結論..................................................77
5.2 未來計畫...............................................79
參考文獻...................................................81
[1] TOYO INK株式會社:http://www.toyoink.co.jp/
[2]友達光電公司網站,網址:http://auo.com/?sn=47&lang=zh-TW
[3]田民波,TFT LCD 面板設計與構裝技術,台灣五南出版股份有限公司出版,2008年
[4]戴亞翔,TFT-LCD面板的驅動與設計,台灣五南出版股份有限公司出版,2008年
[5]中山大學,液晶研究室:http://www2.nsysu.edu.tw/Physics/htm/lab/lclab/
[6] TOPPAN株式會社:http://www.toppan.co.jp/
[7]奇美光電公司網站,網址:http://www.chimei-innolux.com/opencms/cmo/technology/Production_Process/cf_tft.html?__locale=zh_TW
[8] JSR株式會社:http://www.jsr.co.jp/pd/lc_index.shtml
[9]USHIO株式會社http://www.ushio.co.jp/jp/products/list/lamp/lamp_01.html
[10]何小虎、韋莉,銦錫氧化物之應用,廣西冶金研究院,2003
[11]王永,孫可,謝莉,孫士祥,TFT-LCD陣列穿透率提升的研究[J],現代顯示,22(9):22~25,2011
[12]李輝煌,田口方法-品質設計的原理與實務,高立出版社,2010年

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