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研究生:鍾秉憲
研究生(外文):Ping-HsienChung
論文名稱:高功率LED燈泡之熱分析
論文名稱(外文):Thermal Analysis of High-Power LED Spot Lamp
指導教授:趙隆山
指導教授(外文):Long-Sun Chao
學位類別:碩士
校院名稱:國立成功大學
系所名稱:工程科學系碩博士班
學門:工程學門
學類:綜合工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:102
中文關鍵詞:高功率發光二極體接面溫度田口設計方法
外文關鍵詞:High-Power LEDJunction TemperatureTaguchi Method
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目前於照明器材上觸目可見與LED相關產品,LED燈泡是屬於室內照明器材之一。為了使LED燈泡亮度大幅度提升,會選用高功率LED作為發光源。為了提高功率相對的驅動電流勢必要增加。電流提高之下,能量經轉換後將使得LED晶片P/N接面處產生大量的熱。如未有效地將熱排出的話,將對使用壽命造成極大威脅,也會影響到發光效率及熱膨脹係數不均的情況。因此,散熱的方式為長時間使用效率之重要條件。
本研究是以原散熱模組(LED燈泡)所量測到的溫度作為實驗之依據,並搭配模擬軟體COMSOL來修正實驗操作。並探討於不同環境溫度狀態下對散熱模組之影響。接著會以LED燈泡內部之散熱基板(MCPCB)為探討方向。操作方式是以改變原基板之材料形狀(如厚度、寬度、長度)與原基板介電層及金屬層材質,將這些改變的因子,以模擬分析配合田口實驗方法找出較佳LED模組散熱設計之參數。實驗結果發現影響散熱模組最重要因子為介電層的熱傳導係數,其次為基板表面積,其他因子影響的程度甚小。在理想實驗組合下,將使接面溫度降至原模組6.2%。

The lighting equipment which is the LED related product is popular now. LED light bulbs are the indoor lighting equipment. To enhance the brightness of LED bulbs substantially, high-power LED is chosen to be an important light source. For the increase of the electric power, the driving current must be elevated and therefore a large amount of heat is produced at the P/N junction of the LED chip. If the heat is not dissipated effectively, it will make a great threat to the lifetime. Moreover, it will affect lighting efficiency and produce uneven thermal expansion coefficient. For the reasons, the way of heat dissipation is important for the long-time use of high-power LED bulbs.
In the study, the measured temperatures from the original heat-dissipation module of LED bulbs are used as the base data for the simulation of the software COMSOL and the simulation analysis is employed to modify the experiment operations. This study also analyzes the impact of the cooling module within different environmental temperatures. Afterward, the heat-dissipation research of LED bulbs is based on the conditions of the substrate (MCPCB) by changing the substrate geometry (thickness, width and length) and the materials of the dielectric and metal layers of the substrate. For these operation factors, the simulation and the Taguchi method are utilized to find out the optimal parameters of the heat-dissipation design. From the analysis results, the thermal conductivity of the dielectric layer is the most important factor and then is the substrate area. Other factors have small effects on the heat dissipation. With the module of the optimal operation parameters, the junction temperature can be decreased by 6.2% compared to that of the original module.

摘要…………………………………I
ABSTRACT…………………………………II
致謝…………………………………IV
目錄…………………………………V
表目錄…………………………………IX
圖目錄…………………………………XII
符號說明…………………………………XVI
第一章 序論…………………………………1
1-1 前言…………………………………1
1-2 文獻回顧…………………………………2
1-3 研究動機…………………………………5
第二章 基礎理論…………………………………8
2-1 發光原理…………………………………8
2-2 LED晶片原理…………………………………9
2-3 散熱基板作用與種類…………………………………11
2-3-1 印刷電路板(PCB)…………………………………12
2-3-2 金屬基印刷電路板(Metal Core PCB)………12
2-3-3 陶瓷基板(Ceramic Substrate)…………………14
2-4 LED熱傳遞…………………………………15
2-4-1 熱傳導…………………………………15
2-4-2 熱對流…………………………………15
2-5 熱阻定義…………………………………16
第三章 實驗方法與設備………………………………17
3-1 實驗目的與方法…………………………………17
3-2 實驗模組…………………………………18
3-2-1 發光二極體…………………………………18
3-2-2 散熱基板…………………………………19
3-2-3 熱介面材料…………………………………19
3-2-4 環狀散熱鰭片…………………………………19
3-3 實驗設備…………………………………19
3-3-1 熱電偶點焊設備………………………20
3-3-2 溫度擷取系統……………………………20
3-3-3 數位式交流功率計…………………………20
3-3-4 真空烘箱…………………………………21
3-3-5 光學顯微鏡…………………………………21
3-3-6 數位式照度計…………………………………21
第四章 數值模擬與田口方法分析 ……………………22
4-1 設計流程…………………………………22
4-2 COMSOL軟體介紹…………………………………22
4-3 系統環境參數設定…………………………………24
4-3-1 統御域設定…………………………………24
4-3-2 邊界設定…………………………………25
4-3-3 網格設定…………………………………26
4-4 數值模型介紹…………………………………27
4-5 田口方法…………………………………28
4-5-1 控制因子…………………………………28
4-5-2 田口式直交表…………………………………30
4-5-3 自由度的定義…………………………………32
4-5-4 品質計量方法…………………………………33
4-5-5 確認實驗之加法公式…………………………34
4-6 控制因子間之交互作用關係…………………34
4-7 控制因子對於S/N比與品質特性關係………36
第五章 結果與討論…………………………………37
5-1 散熱模組之實驗與模擬比較…………………………37
5-1-1 散熱模組A之結果…………………………………38
5-1-2 散熱模組B之結果…………………………………39
5-1-3 散熱模組C在不同環境溫度下之結果……39
5-2 控制因子間之交互作用結果…………………………40
5-3 控制因子對於S/N比與品質特性之影響……41
5-4 確認實驗之結果…………………………………42
5-5 原始參數設定與田口方法理想參數設定作比較…43
第六章 結論…………………………………45
參考文獻…………………………………47
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