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研究生:翁新發
研究生(外文):Shin-FaWeng
論文名稱:基於諧振原理之渦電流檢測儀設計與應用
論文名稱(外文):Design and Application of Eddy-Current Testing Instrument Based on the Resonant Theory
指導教授:戴政祺
指導教授(外文):Cheng-Chi Tai
學位類別:碩士
校院名稱:國立成功大學
系所名稱:電機工程學系專班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:53
中文關鍵詞:渦電流非破壞性檢測共振頻率金屬薄膜厚度
外文關鍵詞:Eddy-currentNondestructive testing (NDT)Resonant frequencythickness of metallic film
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  • 被引用被引用:1
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  • 下載下載:0
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渦電流檢測是非破壞性檢測的一項主要技術,惟國內的研究者參與渦電流檢測技術的開發並不多,而且在台灣商用的渦電流檢測儀器又極為昂貴。本論文根據渦電流的原理,設計一台簡易型量測金屬薄膜厚度的渦電流檢測儀,而為使儀器具有較高的檢測靈敏度,以探頭共振頻率做為激勵信號之頻率,並且為滿足探頭縮小化及具低諧振頻率的需求,以探頭和並聯電容的方式來達成。在本檢測系統中之探頭藉由並聯三種不同的電容值,設計有三段共振頻率(10、40、70 kHz),使操作者可依不同的金屬薄膜厚度作不同的頻率選擇,以得到較佳的量測結果,最後實際檢測鋁、銅的金屬薄膜厚度,並對結果作分析與討論。
Eddy-current testing is one of the main techniques that used frequently for nondestructive testing. Unfortunately, very few domestic researchers in Taiwan are involved in the study of the eddy-current techniques. Moreover, the commercial instruments for the eddy-current testing are high-priced in Taiwan. This thesis proposes a method for design and application of eddy-current testing instrument based on the resonant theory. To improve sensitivity of the testing instrument, the frequency of the excitation signals are adapted as the resonant frequency of the probe. To meet the requirements of low resonant frequencies and minimal size of the probe, the shunt capacitors are adopted in the probe. Three resonant frequencies of 10, 40, and 70 kHz are used for testing. According to different metal film thickness, the users can appropriately choose different frequencies to get the best measurement results. The results show that this instrument can accurately determine the metal film thickness of aluminum and copper.
摘要I
AbstractII
誌謝III
目錄IV
表目錄VII
圖目錄VIII
第一章 緒論1
1.1研究背景1
1.2相關文獻回顧1
1.3研究動機與目的2
1.4論文章節概要3
第二章 渦電流檢測原理4
2.1渦電流檢測基礎原理4
2.1.1渦電流特性5
2.1.2影響渦電流量測之因素7
2.2渦電流理論模型9
第三章 系統架構與設計13
3.1 系統簡介13
3.2 諧振原理13
3.3 電源電路15
3.4 正弦波產生電路16
3.5 探頭驅動及信號擷取放大電路18
3.6 鎖頻放大器19
3.6.1 儀表放大器22
3.6.2 90°相位移電路23
3.6.3 混合器24
3.6.4 二階主動式低通濾波器24
3.7 ADC電路25
3.8 微處理器硬體電路26
3.8.1 硬體電路26
3.8.2 系統程式設計28
第四章 量測結果與討論30
4.1 系統規格30
4.2 操作於諧振頻率和偏離諧振頻率之測試33
4.2.1 70 kHz操作頻率對三種不同諧振頻率探頭之測試33
4.2.2 10 kHz操作頻率對三種不同諧振頻率探頭之測試34
4.3金屬薄膜厚度之量測分析35
4.3.1 鋁薄膜之量測分析36
4.3.2 鋁薄膜之回歸分析38
4.3.3 鋁薄膜實際檢測厚度及誤差分析39
4.3.4 銅薄膜之量測分析40
4.3.5 銅薄膜之回歸分析42
4.3.6 銅薄膜實際檢測厚度及誤差分析43
4.4不同導電度之金屬薄膜分析45
第五章 結論與未來發展47
5.1 結論47
5.2 未來展望47
參考文獻49
附錄 系統完整電路圖52
自述53

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