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研究生:張恒瑞
研究生(外文):Heng-JuiChang
論文名稱:雷射熱裂法之玻璃裂紋應力分析及高速攝影觀察
論文名稱(外文):Stress analysis of the crack propagation on glass in laser thermal cleavage with high speed photography
指導教授:林震銘
指導教授(外文):Jehn-Ming Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:機械工程學系碩博士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:105
中文關鍵詞:雷射熱裂應力分析裂紋觀察
外文關鍵詞:laser cleavagestress analysiscrack visualization
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  • 被引用被引用:2
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摘要
  本文之目的在於探討使用雷射切割鈉鈣玻璃之裂紋生成情形。有別於切割一般材料,使用雷射切割玻璃時,主要是利用雷射熱源引起板件表面生成熱應力,並以此機制進行板件切割。使用有限元素法進行雷射引發熱應力之分析,研究雷射切割板件之溫度與應力分佈;並以數值計算結果對裂紋生成機制進行探討。實驗時使用高速攝影觀察裂紋生成即時畫面,並使用光學顯微鏡檢視切割後之裂紋情形。本文將不同切割路徑與切割邊界條件統整討論,並分別以有限元素法計算與雷射切割實驗探討不同路徑與邊界條件時之裂紋生成現象。
  研究結果顯示,當切割分別由板件內部或外部開始時,會因為邊界條件之差異導致應力分佈模式有所不同;當應力分佈改變時,裂紋生成模式會由拉伸應力主導之破裂模式轉為由剪應力所主導。相同的現象亦會發生在切割路徑轉折點附近:當切割路徑轉向時,應力分佈受到切割路徑限制,因而產生應力密集分佈之區域,此時裂紋生成模式亦與穩定生成之裂紋不同。切割時之熱應力分佈會受到邊界條件與切割路徑所影響,因此在切割玻璃之起始端、路徑轉折點等應力分佈變化較大之區域較容易產生切割缺陷,甚至將影響整體切割品質。
Abstract
The crack of the soda-lime glass in laser thermal cleavage was investigated in this thesis numerically and experimentally. In the laser cleavage of glass and other brittle materials, the laser is mostly treated as a heat source to generate the thermal stress to cleave the substrates.
In the numerical simulation, the thermal stress was computed by the finite element method to analyze the temperature and stress distributions induced by the laser heat source. In the experiment, the crack propagation was visualized by a high-speed camera and the micro-crack was examined by an optical microscope. With various cleavage paths and boundary conditions, the numerical and experimental results were compared and verified.
The results show that the crack propagation varies with boundary conditions and cleavage paths. In the laser cleavage of brittle materials, the crack growth does not completely follow the cleavage path; on the cleavage path with various rotational angles, the crack will generate in different fracture modes at the turning point. For different cleavage conditions such as starting points inside and outside the glass surface, the laser-induced thermal stress states are significantly different; a tension stress state may transform to shear stress state and change the fracture mode from opening to sliding. Therefore the micro-cracks may occur and affect the cleavage quality mainly at the starting point, end point, and the turning point in the laser cleavage of glass.
目錄
中文摘要………………………………………………………… I
英文摘要………………………………………………………… II
誌謝……………………………………………………………… III
目錄……………………………………………………………… IV
表目錄…………………………………………………………… VII
圖目錄…………………………………………………………… VIII
符號說明………………………………………………………… XII

第一章 緒論…………………………………………………….. 1
  1.1 研究背景與目的………………………………………. 1
  1.2 文獻回顧………………………………………………... 3
  1.3 研究動機………………………………………………... 9
  1.4 本文架構………………………………………………... 10
第二章 數值分析理論………………………………………….. 11
  2.1 切割原理概述…………………………………………... 11
  2.2 破裂模式介紹…………………………………………... 15
  2.3 裂紋尖端計算…………………………………………... 17
  2.4 應力強度計算…………………………………………... 20
  2.5 非耦合熱傳模型………………………………………... 26
  2.6有限元素分析力學模型………………………………… 29
第三章 有限元素法模擬分析………………………………….. 33
  3.1 有限元素法與軟體ABAQUS介紹……………………. 33
  3.2 材料性質………………………………………………... 35
  3.3 實例驗證………………………………………………... 36
  3.4 有限元素分析模型……………………………………... 40
  3.5 邊界條件與基本假設…………………………………... 42
  3.6 數值模擬結果討論……………………………………... 44
    3.6.1 邊緣起始切割模擬結果………………………… 46
    3.6.2 板件內部切割模擬結果………………………… 50
    3.6.3 裂紋生成綜合討論……………………………… 54
  3.7 轉向切割裂紋討論……………………………………... 59
  3.8 數值模擬結論…………………………………………... 68
第四章 實驗與討論…………………………………………….. 69
  4.1 實驗配置與實驗方法…………………………………... 69
    4.1.1 實驗配置………………………………………… 69
    4.1.2 實驗參數設定…………………………………… 71
  4.2直線切割實驗討論……………………………………… 73
    4.2.1 邊緣起始切割實驗……………………………… 75
    4.2.2 內部起始切割實驗……………………………… 80
  4.3 轉向切割實驗討論……………………………………... 82
  4.4 實驗與數值計算對照討論……………………………... 88
  4.5 雷射切割實驗結論……………………………………... 92
第五章 結論與未來發展……………………………………….. 93
  5.1 結論……………………………………………………... 93
  5.2 未來發展………………………………………………... 97
參考文獻………………………………………………………….. 99
附錄……………………………………………………………….. 104
參考文獻
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